Category Archives: MEMS

The 10th Annual MEMS Technology Symposium sponsored by MEPTEC (MicroElectronics Packaging and Test Engineering Council) was held May 23 at the San Jose Holiday Inn. This year’s theme was “Sensors: A Foundation for Accelerated MEMS Market Growth to $1 Trillion.” Registered attendance was ~230.

The conference opened with a keynote address by Prof. Kristofer Pister, UC Berkeley speaking on sensory swarms. Inexpensive, wireless sensor networks have moved out of the lab and are being implemented in myriad applications. A refinery in Richmond, CA has methane gas sensors at every valve to monitor emissions. Parking spaces in San Francisco and Hollywood are tagged with car sensors to provide dynamic signage directing drivers to open spaces; this system also communicates with a smart phone app (“Parker”) to take you to specific open spaces. Rail cars have temperature and vibration sensors on every truck for predictive and preventive maintenance. Wireless sensors in the field are projected to top 1.1 billion units by 2015, up from 168 million units in 2010.

Janusz Bryzek, VP Fairchild Semiconductor, revisited his theme of accelerating the MEMS market to $1 Trillion and 1 trillion units. A $1 wireless sensor unit will require a 20¢ internet access module. The HP notion of a central nervous system for the earth will call for an average of ~1,000 sensors for every person. Smart phones have spurred the initial growth burst for MEMS, but the internet of things represents the “largest growth opportunity in the history of business.” Factors slowing MEMS market development include relatively slow MEMS process R&D cycles, and a lack of industry standards for manufacturing, packaging and testing. The fusion of computing, communication and sensing has been characterized as the third industrial revolution by Vijay Ullal of Maxim. While manufacturing jobs continue to be outsourced, the profitability and job creation potential at the innovation, design and marketing end remains a lucrative economic driver for the US.

Robert Haak of MANCEF described the implementation of the $1T MEMS roadmap. The key technologies needed for success include RF, chemical measurements, energy sourcing, inertial measurements, pressure measurements, acoustic sensors and displays. The industry roadmap infrastructure needs to evolve to a 3rd generation that focuses on products that are conceived at the interface of more than one technology. Specific roadmaps proposed are sensors, data transfer and data processing equipment. These are proposed to have a 15 year outlook with a 5 year review cycle.

Richard Friedrich of HP Labs spoke of the aforementioned central nervous system for the earth, CeNSE: awareness through a trillion MEMS sensors. The subtitle of his talk proclaimed this as the decade of sensing and sense-making. True more for technology than for politics. The infrastructure behind this enterprise will require about 1,000x more bandwidth than today’s internet has available. His vision projects ~150 sensors for every person on the planet, fewer than the second speaker but with a focus specifically on CeNSE applications. A MEMS nanofinger substrate for surface enhanced Raman scattering  (SERS) provides a signal enhancement factor of 1011, enabling a detection sensitivity of 0.02 parts per trillion. The use of people as sensors is manifest in real time analysis of Tweets for regional tuning of marketing campaigns. The HP Social Computing Lab claims 97% accuracy in predicting movie revenues based on the response to pre-release advertising. Work is underway to simulate the human brain visual cortex using a system with 64,512 cores that has demonstrated the ability to learn without being taught. The root objective of a CeNSE network is to convert the flood of data into insight that leads to action. Skynet?

Greg Galvin, CEO of Kionix, presented another perspective of sensing the future on the road to a $1T market. They focus solely on inertial sensors, which had a 2004-2011 unit CAGR of ~100%. Unit prices of accelerometers, compasses and pressure sensors are already well below $1, with gyroscopes to follow by 2015. MEMS components have been averaging 2% of the end cost of products that use them. His conclusion was that a $1T market for MEMS over the next 10 years is unlikely, even though a 1T unit market is probably, and a $1T market for MEMS-enabled devices is a given.

Jérémie Bouchaud of IHS iSuppli couched his perspective as a “MEMS revolution: from billions to trillions?” The 5 year MEMS CAGR is presently running at 9.7% for revenue overall and 20.7% for shipments. Smart phones by themselves have a 17.8% revenue CAGR, and are a significant market driver. MEMS microphones are another beneficiary of smart phones, which now include multiple microphones for both speaking and for background noise suppression. Despite the myriad growth opportunities, he believes the prospect of a $1T MEMS market will require price points ≤5¢ per unit, and an expansion of the market definition to include sensors for temperature, light, humidity, UV and others.

The afternoon keynote was delivered by Steve Nasiri, founder of InvenSense, a big player in the motion interface MEMS market. Just 3 applications, mobile handsets, media tablets and gaming represent a $2.4B market by 2015. The gyro market was slow to get started until Apple put one in the iPhone in 2010. Within a year, over 70 other models were on the market with gyros, even though some didn’t seem to know what to do with them. The wearable sensor market for remote patient monitoring, home monitoring, sports & fitness will push to $150M by 2015. Does your mother live too far away to tell you not to slouch? A shirt with an embedded posture sensor can handle that for her. InvenSense has just announced an open platform infrastructure to facilitate rapid MEMS applications development.

Jean-Christophe Eloy of Yole Développement provided a status of the MEMS industry with a focus on new drivers and the path to new opportunities. The overall MEMS market is ~$10B now, growing to ~$21B by 2017. While the MEMS markets continue to grow, they are still only ~10% of the value of the end markets they enable. Accelerometer / gyroscope systems with 6 degrees of freedom (DOF) have largely been displaced by newer systems with 9 or 10 DOF. All of the growth notwithstanding, he remains skeptical of a $1T MEMS device market.

Stephen Breit of Coventor took us to the software design side of the business with his comments on realizing the full potential of MEMS design automation. If invention is the first wave, and manufacturing differentiation is the second wave, then the third wave is going to be innovation in design and integration. This is the catalyst that will be needed and has the potential to drive the hyper growth if the industry is to hit the $1T mark. Simulation of the integrated MEMS system will make it possible to compress the development cycle from the 2009 benchmark of 4-5 years. This vision includes process design kits and MEMS design kits (modules) similar to the design efficiencies achieved in ASICs. Coventor has a partnership with IMEC that was facilitated by IMEC’s integrated SiGe CMOS + MEMS integration scheme.

Russell Shumway of Amkor took us to the end of the production line with a discussion of high volume assembly and test solutions to support a rapidly growing MEMS market. He anticipates that there will be a greater tendency toward package standardization over the next 10-20 years, but the variety of packaging options is so large that the diversity will still be formidable.

Tristan Joo, Co-Chair of Mobile SIG of the Wireless Communications Alliance reviewed a few case studies of fusing sensors into mobile operating systems. Current smart phones already contain 12-18 sensors, including inertial, optical, touch, audio, magnetic, geo-positional and environmental. The future has a context-aware sensory data cloud in store for us. Smart phone apps that take full advantage of these sensors amount to less than a 0.5% share of apps downloads across all iPhone, Android and Windows OS platforms. I myself can use my smart phone as a bubble level, an audio dB sound meter, a thermometer, a compass, a ruler, a document scanner and a mechanical energy harvester to recharge my battery. But I’m a geek.

The remaining scheduled time comprised six brief presentations by companies showcasing new applications under the banner of “MEMS for the Rest of Us.”

Hillcrest Labs provides motion control systems for consumer electronics and other markets. Their flagship platform is the Freespace® MotionEngine™ that includes a gesture recognition engine and a variety of mobile, gaming and TV applications.

Movea develops data fusion software for processing sensor data into usable information. It is a spin-off of CEA-Leti in France. Fundamental elements of human motion have been compiled into a periodic table, cleverly presented as the Chemistry of Motion.

Sensor Platforms provides data fusion software in their FreeMotion™ library with the objective of being hardware agnostic. He favors mobile devices that respond to human action and context, not in the sense of obeying gestures and commands, but more in the sense of recognizing what’s going on and acting accordingly. For example, when your smart phone calendar says you’re in a meeting, a really smart phone will silence most calls and allow vibration only for a select short list of callers. The end result is to use the available data and context to anticipate intent.

Syride makes a rugged sports-oriented GPS device for tracking speed, elevation and location for hobbies such as surfing, sailing, skiing, skydiving and hang gliding. I use “Map My Walk,” which I will henceforth think of as the couch potato analog of Syride.

VectorNav Technologies is a hardware and software company that takes consumer level motion systems and upgrades them to industrial strength using established aerospace technology. Applications include human exoskeletons for the handicapped, and human motion capture for movies and medical applications. I’m pretty sure I misunderstood when I heard something about a home Cruise missile.

Xsens specializes in sensor fusion software for smart phones, tablets and sports applications. On-body MEMS sensors enable a new paradigm for body motion capture, embodied in a 17 sensor system integrated in a Lycra body suit. The system has already been used in developing video games.

May 24, 2012 — Bosch Sensortec, the consumer electronics sensor arm of Bosch, has integrated two triaxial micro electro mechanical systems (MEMS) sensors in 1 package, claiming the smallest inertial measurement unit (IMU) to date. An optional geomagnetic sensor creates a 3DoF module. Solid State Technology spoke with Leopold Beer, director of global marketing at Bosch Sensortec, about MEMS integration and the sensor fusion software element of sensing.

The BMI055 combines an acceleration sensor and a gyroscope for advanced consumer electronics applications with six degrees of freedom (6DoF), such as gaming applications in smartphones, tablets, consoles, etc. It is packaged in a 3.0 x 4.5 x 0.95mm LGA.

The BMI055 is enabled by continuing miniaturization of MEMS, Beer noted, adding that Bosch fabs all of its MEMS chips in house with high-volume and high-reliability production.

Power is also important for the 2 MEMS package. The accelerometer and higher-power-consuming gyroscope can operate independently, when sensor fusion is not required.

“The MEMS are full-performance sensors in their own right, because customers are used to a certain set of functionality from accelerometers and gyroscopes,” Beer said, “that cannot be compromised for small form factor.”

The accelerometer features flexible interrupt functionality and integrated FIFO buffer. The gyroscope features an integrated interrupt engine, integrated FIFO buffer, and 4 offset compensation modes. For greater design flexibility, the measurement range of the sensors is programmable:  ±125°/s to ±2000°/s for the gyroscope, and ±2g to ±16g for the accelerometer. The latter also shows a low zero-g offset of typically 70 milli-g. The gyroscope has a 16 bit resolution; the accelerometer’s is 12 bit. The gyroscope boasts stable operation with good TCO and offset compensation. The package offers good signal to noise ratio. I2C and SPI digital interfaces offer versatile communication options.

The BMI055 IMU is released concurrently with Bosch’s custom sensor fusion software BSX2.0 FusionLib that optimizes sensing by combining input from the gyroscope and accelerometer. MEMS manufacturers know the functionality and performance of each type of MEMS sensor best, Beer said. Therefore, MEMS makers are the ideal designers of MEMS sensor fusion software. “The algorithms in MEMS software do more than just drive the chip, they integrate abilities from each MEMS to improve calibration, interference filtering, and more.” Sensor fusion, for example, combines the good angular resolution but high drift of gyroscope MEMS with the slower eCompass, improving accuracy. BSX2.0 FusionLib works with all stand-alone or integrated Bosch Sensortec MEMS devices.

Bosch Sensortec makes MEMS devices for consumer applications, as a division of Bosch. Learn more at www.bosch-sensortec.com.

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May 22, 2012 — The 58th annual IEEE International Electron Devices Meeting (IEDM) is seeking original presentations on microelectronics research and development. This year’s IEEE IEDM will focus on silicon and non-silicon device and process technology, circuit/device interactions; energy-harvesting, biomedical, and power electronics; magnetics and spintronics; and other topics.

The IEEE IEDM will take place December 10-12 in San Francisco, preceded by 90-minute afternoon tutorial sessions on December 8 and a full day of short courses on December 9. IEDM 2012 will host more than 200 presentations, as well as panel discussions and special events for microelectronics scientists and engineers from industry, academia and government.

Submit an abstract on:

  • Circuit and Device Interaction
  • Characterization, Reliability and Yield
  • Displays, Sensors and MEMS
  • Memory Technology
  • Modeling and Simulation
  • Nano Device Technology
  • Power and Compound Semiconductor Devices
  • Process technology
  • Other topics

The submission deadline is June 25, 2012. Learn more and submit your presentation today at http://www.his.com/~iedm/call/.

To register for the event, visit www.ieee-iedm.org.

IEEE, the world’s largest technical professional association, is dedicated to advancing technology for the benefit of humanity. Learn more at http://www.ieee.org.

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May 21, 2012 – PRWEB — Full-service micro electro mechanical systems (MEMS) maker Tronics has had China on its roadmap for about 10 years, the company says. In that time, China has moved from a nascent MEMS market to a location where Tronics works for several Chinese customers, especially in gyroscope products.

Tronics has worked with a local partner in the country. Last year, Tronics invested in a joint venture with its Beijing-based distribution partner, naming the JV CHINATRONICS. Also in 2011, Tronics expanded its European headquarters and manufacturing facilities in Grenoble.

The company states that it has “good prospects for continued growth” in China. In 2013, about 15% of Tronics’ overall revenue will come from China.

Tronics supports MEMS projects from design to manufacturing. The company credits its technical skills and experience in gyrometers, and capability to adapt to Chinese business culture, for its expansion in the market.

Tronics notes that local MEMS facilities will draw some MEMS customers in China, but estimates that “a significant window of opportunity” exists for its partnership-based China operations. In one example, Hanking Industrial Group Co., Ltd., recently broke ground on a MEMS manufacturing campus in Fushun City, China.

Tronics is an international, full-service MEMS manufacturer with wafer fabs in France and the US, and representation in Asia. As a spin-off from LETI, Tronics Microsystems originally started manufacturing MEMS in a LETI facility based on the R&D group’s "thick" SOI process, which was transferred to the company. Learn more at http://tronicsgroup.com/.

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May 21, 2012 – Marketwire — sp3 Diamond Technologies Inc., diamond products and deposition equipment and services supplier, shipped its Model 655D series hot-filament chemical vapor deposition (CVD) diamond reactor system to the University of California, Berkeley (UC Berkeley) Marvell Nanofabrication Laboratory.

UC Berkeley will use the Model 655D system to fabricate diamond micro electro mechanical system (MEMS) structures for the development of micro mechanical resonators for radio frequency (RF) filters, as well as to other uses for thin film diamond. Hot-filament CVD diamond deposition provides cost-effective, high-quality, low-stress thin films suitable for MEMS devices, said Dr. Bill Flounders, executive director of the Berkeley Marvell Nanofabrication Laboratory.

Also read: DARPA funds GaN-on-diamond device development at Raytheon

The Model 655D at UC Berkeley can perform diamond deposition onto multiple 6” silicon wafers, growing polycrystalline diamond films from 100nm to 50µm thick at deposition rates up to 1.1µm/hour that exhibit high thermal diffusivity and greater thermal conductivity than other material choices. It can fabricate smooth and rough textured films for low friction, abrasive, MEMS, and electronic applications, and support boron doping to produce conductive films. The integrated (up to 58 discrete steps), recipe-driven process controller provides precise and repeatable diamond deposition.

The filament assembly generates uniform energy distribution, operating at filament temperatures up to 2550°C and power levels up to 20W/cm². The deposition process is controlled by thermal management of both filament and substrate temperatures, in conjunction with closed-loop pressure and gas flow control. The gas distribution assembly allows control of the gas flow patterns in and around both the filament assembly and the substrates. Adequate space is provided in the deposition chamber to avoid undesirable gas recombination at the chamber walls. The deposition area is 350 x 375mm.

sp3 will exhibit at MEPTEC’s 10th Annual MEMS Technology Symposium at the Holiday Inn in San Jose, CA, May 23, 2012  and the MEMS Business Forum 2012 on May 24, 2012 at the Biltmore Hotel and Suites in Santa Clara, CA.

sp3 Diamond Technologies provides CVD hot filament diamond deposition reactors and diamond-based solutions for electronics thermal management and enhanced cutting surfaces. sp3 Diamond Technologies is a subsidiary of sp3 Inc., which provides products and services relating to thin film and freestanding diamond deposition and other diamond materials. sp3 Diamond Technologies provides diamond products for advanced thermal applications, diamond coating and material services, hot filament CVD reactors, and deposition consulting services. For more information about the company, visit http://www.sp3diamondtech.com.

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May 18, 2012 — InvenSense Inc. (NYSE:INVN) says STMicroelectronics (ST, NYSE:STM) filed a complaint in the Northern District of California, alleging that InvenSense infringes 9 of ST’s patents. InvenSense contests these claims.

Both companies make micro electro mechanical system (MEMS) components. 

In its defense, InvenSense points to its intellectual property (IP) portfolio and says it “respects the intellectual property rights of others.” InvenSense’s own IP portfolio positions it well in its markets and serves as a deterrent to those that may try to copy its technology, InvenSense said in a legal update. InvenSense is a fabless chipmaker with its MEMS devices fabbed at TSMC and GLOBALFOUNDRIES.

InvenSense debuted a 9-axis motion-sensing module comprising a 3-axis gyroscope and 3-axis accelerometer on the same die packaged with a 3-axis compass in 2012.

ST is the #4 MEMS provider globally, according to IHS iSuppli with 651.6 million in 2011 revenue (an 82% jump over 2010). Yole ranked ST as #2 with $900+ million and InvenSense as #18 with $144 million in 2011 MEMS revenues.

In the future, InvenSense Inc., which recently became a public company in an initial public offering (IPO), will comment publicly on litigation matters only on a selective basis, taking into account the adequacy of SEC and NYSE disclosure requirements to serve the needs of its stockholders. The Company assumes no obligation to update the information it publicly provides.

InvenSense Inc. (NYSE: INVN) supplies MotionTracking solutions for consumer electronic devices based on a patented Nasiri-Fabrication platform and patent-pending MotionFusion technology. More information can be found at www.invensense.com.

ST is a global leader in the semiconductor market serving customers across the spectrum of sense and power technologies and multimedia convergence applications. Learn more at www.st.com.

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May 18, 2012 — SEMICON West is less than 2 months away, July 10-12 in San Francisco, CA. Plan your attendee schedule now with highlights from the Extreme Electronics “show within a show;” 4 strong keynotes; sessions on device architecture and node shrink, lithography, 450mm wafers and more.

Attendee registration is $50 through June 2. On-site registration is $150.

Extreme Electronics

The Extreme Electronics events take place in the exhibit hall and comprise more than 25 free technical presentations on micro electro mechanical systems (MEMS), light-emitting diodes (LEDs) and printed/plastic electronics. These adjacent markets share “synergies” in manufacturing materials, equipment, and processes with semiconductor fab and assembly, which the Extreme Electronics sessions aim to maximize, SEMICON West organizers say. Each session begins at 10:30am.

Speakers in “Taking MEMS to the Next Level: Transitioning to a Profitable High-Volume Business,” July 10, will share practical solutions for scaling industry growth. In partnership with MEMS Industry Group (MIG), speakers come from Yole Développement, Hillcrest Labs, Coventor, Hanking Electronics, Micralyne, Applied Materials, Nikon, ScanNano, NIST and more.

“Enabling the Next-Generation of HB-LEDs,” July 11, will focus on the current state of some disruptive technologies for improving manufacturing yields, with speakers from Cree, Soraa, Everlight Electronics, EV Group, Canaccord Genuity, LayTec AG, Seoul Semiconductor, Lattice Power, Yole Développement, GT Advanced Technologies, and more.

In partnership with the FlexTech Alliance, “Practical Plastic Electronics: Bringing Disruptive Flexible and Organic Materials into Volume Electronics Manufacturing,” July 12, speakers will give progress reports on organic LED (OLED) displays and lighting, solid state batteries, and flexible mounting of rigid die. Look for speakers from IMEC, Panasonic, DisplaySearch, Imprint Energy, Applied Materials, and MC 10.

Keynotes

Shekhar Borkar, director of Extreme-scale Technologies at Intel Labs, will provide the technology keynote on Intel’s mid- and long-term development efforts in IC scaling, power reduction, and performance improvements, on July 10. That afternoon, Applied Materials’ Mark Pinto, EVP and GM, Energy and Environmental Solutions, will keynote. Applied Materials recently began a major restructuring of its EES business, which includes LED and solar photovoltaics manufacturing tools.

On July 11, keynote speakers include Ivo Bolsens, Ph.D., SVP and CTO, Xilinx and James G. Brown, president of global business development, First Solar. SEMI will also present an Executive Summit moderated by Jonathan Davis, SEMI, on the 11th.

TechXPOT sessions

Fully depleted transistor architectures on Tuesday, next-generation lithography on Wednesday, and the International Technology Roadmap for Semiconductors (ITRS) on Thusday. Learn more about these individual sessions in SEMICON West heralds 22nm, EUVL, 450mm, mobile electronics speakers

Best of West

SEMI will present Best of West awards for the best exhibitor product introduced since last year’s SEMICON West. Winners will be selected by an independent panel of highly qualified judges from academia and the industry. Entries are judged on their financial impact on the industry, engineering or scientific achievement, or societal impact and benefits. Have a product to submit for Best of West? Read more here — deadline is May 21.

For more information and to register, visit www.semiconwest.org.

Solid State Technology’s editors will be attending SEMICON West with you, sharing updates on the Website, in daily e-newsletters, and via twitter @solid_statetech and @PetesTweetsPW

with #semiconwest.

May 16, 2012 – BUSINESS WIRE — Knowles, micro acoustics and micro electro mechanical system (MEMS) microphone maker, has shipped over 3 billion SiSonic MEMS microphones. From the SiSonic MEMS microphone introduction in 2003, it took 7 years (August 2009) to ship 1 billion. The rapid increase to 2 billion in May 2011 and 3 billion in May 2012 demonstrates the exponential growth of MEMS microphones in the consumer electronics and mobile devices industry, Knowles says.

Knowles is the largest MEMS microphone supplier with 75% market share in 2011 and customers such as Apple, Samsung, and LG. Knowles is ranked 2nd of all MEMS suppliers for consumer and mobile MEMS by IHS iSuppli and 8th of all MEMS suppliers for all MEMS applications. Yole Développement puts Knowles at 5th place.

Total industry revenue this year for MEMS microphones is projected to reach $493.5 million.

Due to "dramatic growth" in the MEMS microphone sector, Knowles recently expanded its facility in Penang, Malaysia to about 187,000sq.ft. The Malaysia facility is Knowles’s second SiSonic facility producing at a rate in excess of millions of units per day. Knowles’s facility in Suzhou, China, was the first plant dedicated solely to SiSonic.

Knowles Electronics is a leading global supplier of advanced micro-acoustic and human interface solutions, including hearing aid components, MEMS microphones as well as dynamic speakers and receivers. For more information, visit www.knowles.com. Knowles is owned by the Dover Corporation, a multi-billion dollar diversified global manufacturer of innovative equipment and components, specialty systems and support services. Visit www.dovercorporation.com for more information.

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May 14, 2012 — MEMS Industry Group (MIG) inducted 3 members into its MIG Hall of Fame, from EV Group (EVG), Acuity Inc. and Analog Devices Inc. (ADI).

The MIG Hall of Fame recognizes members whose contributions grow the micro electro mechanical systems (MEMS) industry and MIG, advancing MEMS globally. It was created in 2010.

2012 inductees:

  • Steven Dwyer, VP and GM, North America, EV Group. EVG makes MEMS fabrication tools such as lithography systems and wafer bonders. www.evgroup.com
  • Jim Knutti, Ph.D., co-founder, president and CEO, Acuity Incorporated. Acuity is a fabless supplier of high-performance MEMS-based pressure sensors and other MEMS devices. www.acuitymicro.com

The award ceremony was held during MIG’s annual members meeting, M2M Forum, in Pittsburgh, PA this month.

Learn more about MIG at www.memsindustrygroup.org.

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