Category Archives: MEMS

April 26, 2012 — The College of Nanoscale Science and Engineering’s (CNSE) Smart System Technology and Commercialization Center of Excellence (STC), Canandaigua, NY, was designated as a Trusted Foundry by the US Department of Defense’s (DOD) Defense Microelectronics Agency.

The Trusted Foundry program is a DOD initiative to accredit trusted, secure sources for IC development and manufacturing for various defense and intelligence applications. With the accreditation, CNSE’s STC can now serve the DOD, intelligence agencies, allied foreign governments, and government contractors. STC houses over 30,000 square feet of certified cleanroom facilities to enable fabrication, packaging and testing.

The designation was achievable through STC’s ability to meet the International Traffic in Arms Regulations (ITAR), and the expansion of its secret security clearance through the Defense Security Service (DSS). In addition, DMEA requires all Trusted sources to maintain ISO registration, with CNSE’s STC having achieved ISO 9001:2008 certification at the end of 2011.

CNSE’s STC is New York’s only Trusted Foundry for the processing, packaging and assembly of micro electro mechanical systems (MEMS) and optoelectronic devices.

In recognizing the designation, New York Governor Andrew M. Cuomo noted work to make the state “the epicenter of the global nanotechnology industry…through smart and targeted investments.” The classification as a Category 1A Trusted Foundry will help CNSE’s STC drive “new technology companies and high-tech jobs to the nanotechnology cluster in Western New York,” said CNSE SVP and CEO Dr. Alain E. Kaloyeros.

Next-generation MEMS are used in field-deployable, multi-functioning nanosensors and actuators, integrated system-on-a-chip (SOC) and system-in-a-package (SIP) technologies, and protective coatings and materials for the safety and security of military personnel and equipment, among other nanotechnology-based military applications. Also read: CNSE wins 6M in sensor projects for military power gen

The Trusted Foundry program seeks to maintain technological superiority for the U.S. military and ensure national security. Due to the rapid pace of technological development and the commercial microelectronics technology business climate that has shifted a significant amount of computer chip manufacturing offshore, that security is at risk. The Office of Secretary of Defense issued the Defense Trusted Integrated Circuits Strategy that established "Trust" as a minimum need for the Department of Defense in 2003 to address this risk.

Learn more about CNSE’s STC at www.cnse.albany.edu.

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April 25, 2012 – PRNewswire — Silex Microsystems, a pure-play micro electro mechanical system (MEMS) foundry, will develop ferromagnetic materials for next-generation MEMS devices, under a new VINNOVA research grant worth nearly 3 million Swedish Kronor (about US$445,632). The aim is improved smartphones with multi-axis sensor integration.

Magnetic MEMS enable multi-axis sensor integration, said Dr Thorbjorn Ebefors, chief technologist at Silex Microsystems. Multi-axis sensors combine magnetic sensing with gyroscope functions, creating sensors with multiple degrees of freedom, added Ebefors.

Combining Silex’s Met-Via through-silicon via (TSV) technology with magnetic materials could create high-value, high-Q integrated inductors, leading to high-quality integrated passive devices (IPD) and Functional Capping technologies. Silex is also engaging in research with its Met-Via TSVs combined with mold packaging for semiconductor devices.

The magnetic MEMS technology development program will begin in May 2012 and will run for 18 months, with an end goal of prototyping runs.

The award, under VINNOVA’s R&D programs titled "Forska & Vax," was one of 63 programs granted, out of more than 340 proposals received. In total, VINNOVA grants totaled approximately 68 million Swedish Kronor for R&D programs.

VINNOVA, the Swedish Governmental Agency for Innovation Systems, supports programs for R&D projects in small companies and at universities to long-term development of strong research and innovation environments that attract R&D investment and expertise from around the world. The aim of VINNOVA’s funding is to enable small and medium-sized enterprises to increase their competitiveness by investing in research and development, thus contributing to growth in Sweden. For more information, see www.vinnova.se/en.

Silex Microsystems is a pure-play MEMS foundry. Internet: www.silexmicrosystems.com.

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April 24, 2012 – PRNewswire — Merriman Capital, Inc., a wholly owned subsidiary of Merriman Holdings, Inc. (OTCQX:MERR), will serve as the Principal American Liaison (PAL) for Audio Pixels Holdings Limited (OTCQX:ADPXY, ASX) as it is now trading American Depositary Receipts (ADRs) on the over the counter (OTC) market’s highest tier, OTCQX.

OTCQX distinguishes the best companies traded over-the-counter (OTC) from more than 9,000 securities traded on the OTCBB and OTC Link that are not required to meet any financial standards or undergo a qualitative review. "Merriman Capital has been retained to provide a suite of investor and market making services including the Principal American Liaison compliance function," said Fred Bart, Chairman of Audio Pixels.

Audio Pixels offers a platform of digital speaker technologies based on micro-electro mechanical systems (MEMS) rather than conventional loudspeaker elements for consumer electronics. This enables speaker products with orders of magnitude improvements in performance, in an affordable, 1mm-thick package. Also read: MEMS "transition period" toward market maturity evident in mobile boom

Investors can find current financial disclosure and Real-Time Level 2 quotes for the Company on www.otcmarkets.com.

Merriman Capital, Inc. is an investment banking firm providing equity and options execution services, market making, and differentiated research for high growth companies. The firm also provides capital raising, advisory, and M&A services. Merriman Capital, Inc. is a wholly owned subsidiary of Merriman Holdings, Inc. (otcqx:MERR). For more information, go to http://www.merrimanco.com/.

Merriman Capital, Inc. is a registered broker-dealer and member of The Financial Industry Regulatory Authority (FINRA) and the Securities Investor Protection Corporation (SIPC).

Audio Pixels Holdings Limited is listed on the Australian Stock Exchange with the code AKP and has its ADRs listed on OTCQX market in the USA with code ADPXY. Audio Pixels Holdings Limited owns 100% of Audio Pixels Limited, an unlisted Israeli corporation that was founded in July 2006 with a technological platform for reproducing sound. Audio Pixels uses entirely new techniques to generate sound waves directly from a digital audio stream using low-cost MEMS rather than conventional loudspeaker elements. Learn more at http://www.audiopixels.com.au/index.cfm/audio-pixels/.

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April 23, 2012 – GLOBE NEWSWIRE — Hexagon Metrology released the Optiv Classic 321GL tp benchtop vision-measuring metrology system for the North American market. It suits electronics and precision parts inspection, including micro-holes, fiber optics, filters, and more.

It features 6.5x motorized CNC zoom optics for 0.002mm accuracy. Touch probes can be added for multi-sensor measurement. The Classic 321GL tp is the smallest model in the Optiv product line. It offers calibrated lighting, a high-resolution color CCD camera, a laser locator and an 8-segment LED dual angle ring light. The LED ring and software controls for red/green/blue sensitivity enable better edge detection, including for colored parts where edges can be difficult to capture.

The Classic 321GL tp includes PC-DMIS Vision image processing software and full online 3D CAD capabilities for live programming of the machine to compare measured values to nominals. The software’s MultiCapture feature finds all 2D characteristics in the field of view, measures them simultaneously, and moves the camera for the next cluster, optimizing the path of stage movement. Inspection speeds can increase by 50% or more.

The tool is made on a granite base with mechanical bearings.

Hexagon Metrology is part of the Hexagon AB Group. Hexagon is a leading global provider of design, measurement and visualization technologies. Learn more at www.hexagon.com.

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April 20, 2012 – Business Wire — MEMSCAP (Paris:MEMS), micro-electro-mechanical systems (MEMS) optical components provider, qualified its high-voltage electrostatic MEMS variable optical attenuator (VOA) with Telcordia standards GR-1209 and GR-1221 for passive optical components.

The MEMS-based VOA met all environmental, mechanical and operational stress tests in the standards. Telcordia GR-1209-CORE and GR-1221-CORE, Generic Requirements for Passive Optical Components, Issue 4; and Generic Reliability Assurance Requirements for Passive Optical Components, Issue 3, contain generic criteria for passive optical components to help promote the satisfactory operation and reliability of such components in single-mode fiber transmission and access networks, and to permit economical planning and engineering of communications networks. Learn more here.

Telcordia qualification showcases MEMSCAP’s “highly reliable processes, designs, packaging, and packaged products.” said Steve Wilcenski, GM of the MEMSCAP Customer Products Business Unit. MEMSCAP’s strategy is to provide more integrated components for customers and markets it serves.

MEMS-based VOAs are integrated in complex optical modules operating up to 100 GBits, for optical network applications from optical module protection to power management. MEMSCAP’s packaged electrostatic VOA exhibits superior optical power attenuation stability in closed loop operation and is designed to fit most optical printed circuit boards (PCBs).

MEMSCAP provides MEMS-based components, as well as component designs/IP, manufacturing, and related services. The company’s shares are traded on the Eurolist of NYSE Euronext Paris S.A (ISIN: FR0010298620-MEMS). More information can be obtained at www.memscap.com.

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April 20, 2012 — The market for micro opto electro mechanical systems (MOEMS), a subsegment of MEMS chips, is poised for exponential growth, reports Semico. MOEMS manipulate light, for projecting images or for direct view displays. MEMS devices are established in projection applications, and MEMS for direct view displays are emerging.

The total optical-MEMS market was under $1 billion in 2011, but by 2016 it will reach $10.4 billion, according to Semico.

The projector type of MOEMS use a micromirror technology that oscillate to direct a light beam. Texas Instruments is the current market leader with its DLP micromirror projection technology for DTV. This segment will grow as pico projectors from TI and other vendors gain a foothold in smart phones and other consumer electronics.

The direct view display devices are an array of elements that control reflected light. Qualcomm has introduced its Mirasol MEMS display in eReaders. The future for Mirasol and other MEMS display technology is in other applications.

In “MEMS Displays: Projecting a Direct View of the Market,” Semico examines end-use markets for MEMS in projection and display, including each markets’ size and growth rates and the MEMS penetration rates. It includes unit and sales TAMs of MEMS for projection and display.

Semico is a semiconductor marketing & consulting research company. Learn more at www.semico.com.

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April 19, 2012 — Pure-play micro electro mechanical system (MEMS) foundry Silex Microsystems named Fredrik Jönsson, CEO of Beijer Electronics, to its Board of Directors.  Beijer Electronics provides industrial automation and data communications solutions.

Jönsson brings “extensive manufacturing experience” to the Silex Board, said Lennart Jacobsson, Chairman of the Board for Silex Microsystems. He has also brought companies into new markets, which could yield “valuable perspective” in Silex’s future.

Jönsson began his career with SKF Group, bearings and bearing-related systems supplier, establishing SKF’s business in Indochina and Vietnam. In 1997, he joined FlexLink as CEO and led the company through seven acquisitions and increased worldwide presence from 12 to 21 countries. In 2006, he became CEO of Crawford Group AB, and in 2008 assumed his current role as CEO of Beijer Electronics.

Jönsson received his master of science in engineering from Chalmers University and also sits on the board of Perten Instruments AB.

Silex Microsystems delivers MEMS-based solutions for intergration with end-user products in the field of biomedicine, biotechnology, and telecommunications.

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April 19, 2012 — Pure-play MEMS foundry Silex Microsystems brought its Met-Via full-wafer-thickness through silicon via (TSV) technology into Chip Architectures by Joint Associated Labs for European Diagnostics (CAJAL4EU), where it is being used to create cost-effective molded chip-level packaging with through metal vias (TMV).

Figure 1. Cross section of final product, showing Biosensor from NXP (Netherlands), TSV interposers from Silex, and epoxy mold to be performed by Frauenhofer (Germany) and gold (Au) bumping by Pactec (Germany). Frontside RDL to be processed by Bosch (Germany), and backside RDL to be processed by Frauenhofer (Germany).

The program is developing nanoelectronics-based biosensor technology platforms for in-vitro diagnostic test manufacturers to rapidly build various new multi-parameter test applications cost-effectively. CAJAL4EU will develop a generalized platform for low cost biofluidic sensing. Biosensing allows for rapid detection of unique biological markers (proteins, antibodies, and other biomarkers for infectious diseases) from microliter fluid samples in an extremely controlled environment. The biosensors will consist of a nanoelectronics-based transducer with an interface chemistry, which makes the connection to the clinical sample to be analyzed. With on-chip detection electronics, small electrical changes can be detected within milliseconds, enabling massively parallel real-time monitoring of bio-molecule binding events. Besides the transducers, interface chemistry and spotting technologies, microfluidics, software and hardware developments (and their integration) will play a crucial role to realize fully integrated biosensor systems and lab-on-chip devices. Therefore, the main deliverables of this project are the different developed technologies: sensor technology including bio-chemical functionalization, microfluidics and related hardware and software drivers.

Figure 2. Actual TSV interposer die from Silex.

Silex

April 19, 2012 — EPIC, the European Photonics Industry Consortium, announced at its annual general meeting that Carlos Lee has been appointed as director general, succeeding Thomas Pearsall, who has led the association since its founding in 2003. Pearsall will work with Lee throughout 2012 to enable the transistion.

EPIC members active in displays, lasers, lighting, optical fibers, optics, semiconductors, photovoltaics sensors, telecommunications, and other photonics fields deserve solid value from the association, said Lee. He announced a new EPIC office in Brussels, Belgium, and closer collaboration with the EU.

Carlos Lee is currently Director General at SEMI Europe, where he leads the advocacy program. He has 15 years experience in industry association management, with a focus on building membership value through standardization, collaboration, networking platforms and events, and other activities of collective interest that benefit the industry at large. He will be tasked with growing EPIC and especially supporting small- and medium-size enterprises (SME) in Europe, said Drew Nelson, CEO and president of IQE, and current president of EPIC.

With 80 voting members and over 400 associate members, EPIC is a leading European photonics industry association. Learn more at www.epic-assoc.com.

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April 19, 2012 – PRNewswire — Texas Instruments Incorporated (TI, NASDAQ: TXN) awarded 15 of its 12,000 suppliers with Supplier Excellence Awards (SEA) for delivering outstanding service and support, based on cost, environmental responsibility, technology responsiveness, assurance of supply, and quality to support TI’s semiconductor and MEMS manufacturing and packaging work.

Also read: Intel’s (INTC) top suppliers and Analog Devices’ (ADI) top suppliers

Texas Instruments’ SEA recipients include:

  • Asahi Engineering Co., Ltd. – IC molding equipment
  • Covalent Silicon Corporation – Silicon
  • Dainippon Screen Mfg. Co., Ltd. – Capital equipment, spares and services
  • Heraeus Quartz America LLC – Quartz
  • Hitachi Data Systems – IT storage systems
  • Hitachi High Technologies Americas, Inc, Semiconductor Equipment Division – Etch capital equipment, spare parts and services
  • InTEST Corporation – Docking, manipulator, and wafer probing interface products
  • Jiangyin Changdian Advanced Packaging Co., Ltd. – External manufacturing
  • Kinpo Electronics, Inc. – Contract manufacturer
  • Kintetsu World Express, Inc. – Shanghai PDC services
  • MBG Consulting – Lease administration
  • MM Solutions AD – Multimedia IP and system solutions
  • Tanaka Denshi Kogyo k.k. – Bonding wire
  • Teradyne, Inc. – Automated test equipment
  • Unimicron Technology Corp. – Rigid substrates

"The past 12 months have been uniquely challenging for the semiconductor industry in terms of the unexpected occurrence of natural disasters, threatening impact to supply," noted Rob Simpson, VP of TI’s Worldwide Procurement and Logistics.

Texas Instruments makes semiconductors. Learn more at www.ti.com.

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