Category Archives: MEMS

December 26, 2011 — Yole Développement studies the evolution of inertial micro electro mechanical systems (MEMS) and magnetometers and provides reverse costing analysis of the MEMS devices in "Technology Trends for Inertial MEMS," volumes 1 & 2. The report considers 23 MEMS devices.

Four identifiable trends are revealed: future generation of sensors will deliver functions; sensor fusion, combining data from different sensors, is on the rise; new architectures are emerging; and price pressure is still very strong (5% drop per quarter for consumer applications), said Laurent Robin, activity leader, inertial MEMS devices and technologies at Yole Développement.

Yole’s report shares market drivers for inertial MEMS, including consumer, automotive, and high-end applications. Packaging and test trends for the devices are discussed. Over the last 3 years, inertial MEMS & magnetometers have been subject to dramatic market & technological evolutions. This has been driven by a large increase of the consumer market: mobile phones and tablets for accelerometers; gaming for gyros; mobile phones for magnetometers.

Along with “stand-alone” MEMS devices, inertial combo sensors, a combination of several inertial sensors into a single package, are also coming. Main applications are consumer (e.g. accelerometer with magnetometer or accelerometer with gyro) and automotive for ESC and rollover functions first.

On the technical side, form factor is ever decreasing with reduced footprint and thickness. And power consumption has been reduced to a few microA while performances are still increasing. The most successful type for inertial MEMS is based on capacitive transduction. Reasons are simplicity of the sensor element, no requirement for exotic materials, low power consumption and good stability over temperature. But will comb-drive architecture for accelerometers continue to be the main detection principle as MEMS die size keeps shrinking?

Regarding gyroscopes, most are falling into the categories of tuning vibrating fork/plate (STM, Bosch) or vibrating shells (Silicon Sensing Systems). This very common design gives ease of fabrication and possible integration in standard IC manufacturing industry.

For magnetometers, Hall Effect has been the dominant technology for a long time, but today it is changing as Magneto Impedance, Giant Magneto Resistance and Anisotropic Magneto Resistance are used. A new approach, Lorentz effect based on MEMS technology, is currently in R&D (VTT and others). This could bring easier integration in MEMS combo sensors.

"Testing has been also subject to strong evolution over the last years," said Dr. Eric Mounier, senior analyst, MEMS Devices & Technologies at Yole Développement. For example, combo sensors will require new test solutions compared to “stand-alone” sensors. Beyond the usual wafer-level electrical test and package-level electrical and mechanical or functional testing, these sensor combos will need module level testing and calibration of the combined sensors. If they include an MCU in the package, the communication between the sensors and the MCU will also need to be tested. Solutions need to be cost effective with high throughput to test multiple axes of multiple devices, either in parallel or in separate modules, rather like separate chambers in IC equipment.

The world of MEMS testing has moved in the last several years from internal development at MEMS makers to co-development with test suppliers to commercial off the-shelf equipment. So combo solutions that can test all axes of the module in a single tool for higher throughput will also likely be co-developed with the test equipment suppliers and available commercially. Assembly and test houses may also start to offer these test services on an outsource basis for fabless or fab-light MEMS makers. The Yole Développement report will analyze the latest trends in MEMS testing.

In order to understand the key evolutionary changes, a total of 23 different MEMS devices (9 accelerometers, 10 gyros, 3 combos and 1 magnetometer) — mostly consumer MEMS — have been disassembled, analyzed and cost simulations have been constructed for MEMS, ASIC and Packaging/Test. One of the key features of the reports is that ASICs have been analyzed as well. The MEMS have been analyzed and production costs have been simulated by System Plus Consulting, the reverse costing specialist company. The teardown analysis results have been compared in terms of performance, total cost, MEMS size, ASIC lithography node, ASIC size, package size, year for market introduction.

From its analysis, Yole Développement found there is a clear MEMS die size decrease over 2007-2011. For example, in 2008, the average size for an accelerometer (3-axis) was 4-5mm². 3 years later, size is about 2mm². ASIC size has been following the same trend with a lithography node in the range 0.18-0.35μ today. "With latest ST announcement about the use of through silicon vias for inertial, we can expect even lower cost and size in the future," said Robin. The same analysis has been performed for gyros comps, combos and magnetometers.

Companies cited in the report:
Accutronic, Advanced Microsensors, Advantest, Afore, Aichi, AIS/SSS, AKM, Analog Devices, ASE, Baolab, Bosch Sensortec, CascadeMicrotech, CEA Leti, Colibrys, Epson Toyocom, Freescale, Gladiator Technologies, Honeywell, Invensense, Jyve, Kionix, KYEC, Litef, Memsic, Multitest, Murata, Panasonic, Polytec, Qualtre, Rohm, Sensonor, Sensordynamics, Sony, SPEA, SSS, STM, Systron Donner,TEL, Teradyne, Thales, Tronics, VTI, VTT, Yamaha

Dr. Eric Mounier has a PhD in microelectronics from the INPG in Grenoble. He previously worked atCEA LETI R&D lab in Grenoble, France in Marketing dept. Since 1998 he is a co-founder of Yole Developpement, a market research company based in France. At Yole Developpement, Dr. Eric Mounier is in charge of market analysis for MEMS, equipment & material. He is Chief Editor of Micronews, and MEMS’Trends magazines (Magazine on MEMS Technologies & Markets).

Laurent Robin is in charge of the Inertial MEMS & Sensors market research at Yole Developpement. He previously worked at image sensor company e2v Technologies (Grenoble, France) and at EM Microelectronics (Switzerland). He holds a Physics Engineering degree from the National Institute of Applied Sciences in Toulouse. He was also granted a Master Degree in Technology & Innovation Management from EM Lyon Business School, France.

Yole Développement provides market research, technology analysis, strategy consulting, media in addition to finance services. Access the report catalog at www.yole.fr.

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December 21, 2011 – Marketwire — Boston Micromachines Corporation (BMC), MEMS-based deformable mirror (DM) optical products supplier, was awarded a Phase 1 contract for $125,000 by NASA’s Small Business Innovation Research Program (SBIR) to support exoplanet imaging research.

One of NASA’s core objectives is to explore earth-like planets outside of our solar system. Space telescope optics cannot be shaped to the precision required for imaging of small earth-sized planets, and therefore DMs must be used to correct for the residual aberrations resulting from initial fabrication and slowly changing mechanical deformations of the deployed primary mirror.

This grant will enable Boston Micromachines to develop processes and manufacturing innovations that will improve the ability of DMs to correct for these residual aberrations resulting in reduced glare in imaging systems used in the search for earth-sized planets.

In this Phase 1 project, BMC will develop and demonstrate an innovative microfabrication process to substantially improve the surface quality achievable in high-resolution continuous-membrane MEMS DMs. The project goals include at least twofold improvement in small-scale surface flatness in comparison to the current state-of-the-art, and corresponding reductions in diffraction.

Also read: NASA grants BMC Phase II space imaging contract and NASA grant for MEMS deformable mirror fab awarded to Boston Micromachines

"The improvements in DM fabrication technology proposed in this project will help astronomers achieve their goal of imaging earth-like planets in other solar systems," said Paul Bierden, president and co-founder of Boston Micromachines. "In addition, this research has potential impact on commercial applications such as optical communications, surveillance, pulse shaping, and biological imaging."

This Phase 1 award is part of NASA’s Small Business Innovation Research programs. The highly competitive programs afford small businesses the chance to propose unique ideas that meet specific research and development needs of the government. The criteria used to choose these winning proposals include technical merit and feasibility, experience, qualifications, effectiveness of the work plan and commercial potential.

Boston Micromachines Corporation (BMC) provides advanced microelectromechanical systems (MEMS)-based mirror products and has expertise in the design of adaptive optics systems. For more information on BMC, please visit www.bostonmicromachines.com.

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December 20, 2011 — Displays for pure-play e-book readers will see 108% increase in shipments in 2011 (27.1 million units), a strong year leading into slower growth ahead, with 37% growth forecast for 2012, and declining shipments forecast in 2015. E-reader suppliers will consider new ways to attract consumers in the near future, according to an IHS iSuppli Small & Medium Displays Market Tracker report.

Figure. Global e-book reader display market forecast.
SOURCE: IHS iSuppli, December 2011.

The vast majority of e-reader displays are monochrome. These products compete with color-display tablets, like Apple Inc.’s iPad, and the slower growth in e-readers from 2012 on will prompt many device makers to adopt color displays, says Vinita Jakhanwal, senior manager for small and medium displays at IHS, and to focus on vertical markets, such as education.

Alternatives to the e-book reader display standard — electrophoretic displays (EPD) — include a color display technology based on micro electro mechanical systems (MEMS). The mainstream example is known as Mirasol, from Qualcomm Inc.

Also read: Qualcomm MEMS display launched in Korean e-readers

Mirasol competes with EPD on common characteristics — wide viewing angle, readability in sunlight, low power consumption — and beats EPD with full color displays and fast response speeds. Kyobo ebook readers can hold a power charge for weeks, based on 30 minutes of reading per day on the device, according to the launch announcement.

Color e-reader displays fall behind monochromatic devices in cost. The Mirasol-based Kyobo costs 349,000 Korean won, (USD319), exceeding the price tags of many tablet devices, and nearly quadrupling the monochromatic Amazon Kindle ebook reader (USD79). Large volumes for color e-readers, as well as an aggressive consumer-focused strategy, could bring costs down, IHS predicts. However, given today’s limited manufacturing capacity and associated higher costs for producing the color display, this is a large challenge for alternatives to monochromatic displays.

e-readers could differentiate from media tablets with growth in vertical markets, where a single use case is preferable to the diverse functionality and features of a media tablet, IHS reports. Current e-reader features, like light weight and a battery life lasting weeks on a single charge, are attractive in these use cases, thought IHS notes that no companies have yet pursued this strategy.

Access IHS iSuppli’s report, Tablet PCs and Smartphones Buoy Demand in the Small/Medium Displays Market, at http://www.isuppli.com/Display-Materials-and-Systems/Pages/Tablet-PCs-and-Smartphones-Buoy-Demand-In-the-Small-Medium-Displays-Market.aspx

Visit our new Display Manufacturing Channel on ElectroIQ.com!

December 19, 2011 — In its new report, Emerging Markets For Microfluidic Applications, Yole Développement asserts that microfluidics are a "key technology" for the life sciences market, which will prop up microfluidics growth to $4 billion in 2016. The report provides analysis of microfluidic device markets and technologies with market data for 2008-2010 and forecasts for 2010-2016.

The microfluidic device market is quickly evolving and entering a "structuration and consolidation phase," said report author Frédéric Breussin, Yole Développement. Many products are moving from prototyping to production. Many new players recently entered the supply chain, bringing expertise in the mass production of electronic devices and modules. This could create a microfluidics eco system where production costs are reduced enough to make disposable microfluidic devices accessible for the medical market.

Also read: Microfluidics foundry opens under A*STAR in Singapore

The boundaries between microfluidics applications in the life sciences field are often blurred, says Breussin. These include general dispensing, drug delivery, accurate dispensing, analytics, clinical and veterinary diagnostics, point-of-care testing, industrial and environmental testing, pharmaceutical and life science use, and microreaction technology.

Figure. Microfluidics supply and value chain. SOURCE: Yole, September 2011.

Yole Développement’s report describes the microfluidic supply chain, from R&D to commercialization and distribution. It shows for main players and their role in the supply chain for each type of material, and the costs related to manufacturing steps, as well as final product costs.

Companies cited in the report:
AB SCIEX, Abaxis, Abbott, Advion Biosciences, AES Laboratoire , Agilent Technologies, Bartels mikrotechnik, BD, Bertin Technologies, Biodiot, BioFluidix, bioMérieux, Biosite, Boehringer Ingelheim, Bürkert, Caliper Life Sciences, Cellectricon, Cepheid, Cetoni , Cytoo, Dalsa, Danaher, Debiotech, Dolomite, Eksigent Technologies, Epocal, Fluidigm, Fluigent, GE Novasensor, Genewave, GeSim, Great Basin, Hamilton, Ikerlan, Illumina, IMM, Invitrogen, Johnson & Johnson, Konica Minolta Opto, LabCyte, Life Technologies, Merlin diagnostic, MicroCHIPS, Micronit, MicroParts, Nanostream, Ocusense, Pall Genesystem, PerkinElmer, Philips, PositiveID Corporation, Qiagen, Raindance Technologies, Roche Applied Science, Samsung, Scienion, Sensirion, Seyonic, Shimadzu Biotech, Shrink Nanotechnologies, Siemens Medical Solutions, Sony DADC, Sophion, Stmicroelectronics, Texas Instrument, Tokyo Electron, Vantix Ltd, etc.

Frédéric Breussin is an expert in microfluidics for diagnostics and life sciences.

Benjamin Roussel is a market analyst in microfluidics and medical technologies.

Contact David Jourdan for report information: [email protected] or +33 472 83 01 90, or visit www.yole.fr.

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December 16, 2011 — STMicroelectronics (NYSE:STM), a global semiconductor company, launched ST New Ventures, its corporate venture capital fund currently under incorporation.

ST’s venture fund will invest in technology, product and service start-up companies, preferably at early stage, to understand in advance emerging markets for which semiconductors are key. Healthcare, cleantech and smart infrastructure are among the main areas of focus.

In addition to financial investment, ST New Ventures will bring to its portfolio companies a knowledge of semiconductor technology, products & applications, manufacturing, and markets worldwide.

The fund will co-invest with financial and corporate venture capitalists and has been designed accordingly.

ST New Ventures will be an ST fully owned subsidiary headquartered in Geneva, Switzerland, led by Lo

December 16, 2011 — MEMS and semiconductor supplier STMicroelectronics (NYSE:STM, ST) has hosted 3 2011 iNEMO Campus Design Contests, for the US, China and Taiwan. This week, Taiwan’s first place went to students from the National Yunlin University of Science and Technology. The group, called "Total Annihilation," used the iNEMO board to transform a hula hoop into a sports monitoring system for health care applications.

The Smart Hula Hoop measures a user’s waistline and detects exercise levels, monitoring and recording the data. The design accesses and fuses output data from iNEMO’s on-board accelerometer (gravity and acceleration); e-Compass (absolute heading orientation); and gyroscope (angular velocity during rotation).

The design fully utilized 9 of the 10 degrees of freedom (DOF) available from iNEMO’s micro electro mechanical systems (MEMS), integrating motion detection technology with a consumer need, or "smart-life concept." Total Annihilation received a prize of NT$60,000 from ST. The Smart Hula Hoop combines iNEMO MEMS sensor technology with "engineering creativity," said Patrick Boulaud, STMicroelectronics regional VP, Analog Power & MEMS, Greater China and South Asia Region.

In addition to the champion, the judges selected a second and third place winner and seven honorable mentions, which were awarded, respectively, prizes of NT$40,000, NT$30,000 and NT$5,000 each.

Nearly 145 students and young engineers in Taiwan submitted 32 designs to the 2011 iNEMO contest. Entries were judged based on a combination of function and practicality, implementation, creativity, presentation and final demonstration. Contest winners were revealed in conjunction with ST’s Annual MEMS Symposium held in Taipei.

The open competition, co-sponsored by Taiwan’s Association of Nanotechnology and Micro System and launched to showcase ST’s iNEMO evaluation and development tool, promotes MEMS design innovation among university students in Taiwan. See China’s winners here. And the US team here.

Further information about the iNEMO contest in Taiwan can be found at http://www.st-inemo.com.tw/

STMicroelectronics provides semiconductors for consumer and portable applications.

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December 15, 2011 — Combo sensors, comprising micro electro mechanical system (MEMS) accelerometers, gyroscopes, or electronic compasses, are filling a need in consumer and automotive applications. These multi-sensor packages should see combined revenue from these sectors grow by a factor of 50 over 5 years, shows an IHS iSuppli MEMS market brief.

Combo sensor packages can vary in configuration, depending on the components contained in the package. In the consumer space, for instance, a 6 degree of freedom (DOF) compass module typically comprises a three-axis accelerometer plus a 3-axis compass; where inertial sensors are used, the device is called an inertial measurement unit (IMU). In comparison, a 9DOF is a combination of a 3-axis compass, 3-axis gyroscope and 3-axis accelerometer; while a 10DOF includes all of the components of the 9DOF along with a pressure sensor to measure altitude. Meanwhile, combo sensors in the form of 4DOF to 6DOF are emerging in automotive applications, principally in the form of IMUs without compasses.

Revenue for MEMS combo sensors saw $23.6 million in 2010, an estimated $70.9 million in 2011, and will approach $1.2 billion by 2015, a compound annual growth rate (CAGR) of 120%. Triple-digit expansion percentages will occur 2011-2013.

Automotive applications saw $22.8 million in 2011 revenues, and should reach $131.8 million by 2015. Major combo sensor suppliers include Bosch (namely its stability control systems) and VTI Technologies (feeding Continental AG’s stability control systems).

Also read: 2012 sees automotive sensor market back to healthy growth track

The attraction of combo sensors in these applications comes from price and form factor advantages achieved when multiple MEMS are packaged together. Automotive safety systems, government-mandated in many countries, can be made smaller, more efficient, and less expensive in a combo format.

In 2011, consumer applications make up the majority of revenue ($48.1 million) and this trend is expected to continue through 2015 ($1.0 billion).

Also read: Sensor fusion drives mobile electronics’ future apps

In consumer applications, the majority of accelerometers are currently shipped as separate, discrete devices. These discrete devices are set to dominate in handsets during the next 4 years. Integration within a 6-axis IMU will take off starting in 2013, and will be the main format for combo sensors in 2015.

The same, however, cannot be said for integration within 6-axis compass modules, which will remain marginal because of diverging requirements for the location of the accelerometer and compass in handsets, leading to no obvious cost advantage. Here, a motion sensor needs to be near the center of the device, while a compass needs to be away from sources of disruptive electromagnetic interference.

Some 9-axis IMUs will appear among a few OEMs seduced by revenue opportunities for black-box solutions, but penetration will be limited because their large form factor is a disadvantage in handsets, where space for sensors and other semiconductors is at a premium.

Meanwhile, combo sensors are likely to be more prevalent in tablets because of the extra space that is available with a larger device. Here, 6-axis IMUs will dominate, with 6-axis compasses and 9-axis IMUs to be more popular in tablets than in handsets.

Other consumer applications for combo sensors include laptops, cameras, MP3 players and remote controllers.

So far, 6-axis compasses have been offered by Asahi Kasei Microdevices (AKM) Inc. and Aichi Steel Corp., STMicroelectronics, and Bosch Sensortec. 6-axis IMUs also are available from STMicroelectronics and from InvenSense Inc.

Worldwide MEMS combo sensor revenue forecast. SOURCE: IHS iSuppli Research, December 2011.

Access the IHS report, Combo Sensor: A Solution to Incessant Price Pressure, at http://www.isuppli.com/MEMS-and-Sensors/Pages/Combo-Sensor-a-Solution-to-Incessant-Price-Pressure.aspx

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December 14, 2011 — Linkstar Microtronics Pte. Ltd. customers have qualified the pilot shipment of silicon optic devices fabricated with Singapore’s A*STAR Institute of Microelectronics (IME) MEMS technology.

IME developed the MEMS technology for LinkStar, a recent spin-off from IME. Linkstar developed the novel silicon optical devices based on this MEMS technology, using what it calls a highly accurate, repeatable, and cost-competitive process.

The IME silicon MEMS technology enables accurate alignment of optical devices to the optical fiber arrays, ensuring that the maximum amount of light is coupled to the devices with minimal optical power loss. Compared to traditional alignment methods, the MEMS-based system significantly reduces the cost of packaging, as well as the time spent at alignment, IME reports.

This is one of IME’s forays into photonics, leveraging its expertise in areas such as MEMS technology. "Attaining volume production status from the customer marks a significant milestone achievement on our silicon photonics roadmap, said Prof. Dim-Lee Kwong, executive director of IME.

The silicon MEMS technology is licensed to LinkStar via A*STAR’s commercialization arm, Exploit Technologies Pte Ltd.  

The Institute of Microelectronics (IME) is a research institute of the Science and Engineering Research Council of the Agency for Science, Technology and Research (A*STAR). For more information, visit IME on the Internet: http://www.ime.a-star.edu.sg.

LinkStar Microtronics Pte. Ltd. (LinkStar) is a fabless semiconductor company that offers innovative silicon devices. For more information, visit LinkStar’s website http://www.linkstarmicrotronics.com/.

Exploit Technologies Pte Ltd (ETPL) is the strategic marketing and commercialization arm of the Agency for Science, Technology and Research (A*STAR). For more information, please visit www.exploit-tech.com.

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December 13, 2011 — Jean-Christophe Eloy, president & CEO, Yole Développement, shares an analyst’s view of the micro electro mechanical system (MEMS) industry, calling 2011 a year of transition and changes. 2011 is the year when the MEMS market transitions to big business with wide-spread adoption, Eloy asserts.

In 2011, the MEMS sector topped $10 billion for the first time, and a MEMS company (InvenSense) approached $1 billion with its initial public offering (IPO).

Fabless MEMS is becoming a viable business model, noted Eloy. A-List companies are creating MEMS teams: Apple, Google, and Facebook for example.

MEMS are going into high-volume applications like mobile phones. MEMS sensors are showing up in all kinds of systems, enabling them to interact with the external world and sense what is happening: smart munitions, cardiac rhythm management, smart phone functionality, oil drill monitoring, etc.

The MEMS industry has a long way to go before becoming a $100 billion business, Eloy said. "MEMS integration is still complex for system manufacturers, delaying fast market adoption," he added. MEMS manufacturers need to roadmap simplified system integration for more growth of the MEMS business. MEMS companies need to come together to create a MEMS ecosystem, which will simplify the integration of MEMS into larger systems and modules by non-MEMS-specialists.

In 2012, new devices will go into volume production, as has happened with inertial devices in mobile systems; and new applications will evolve, as has happened with antenna-matching MEMS technology, MEMS-based micro fuel cells, Mirasol MEMS-based displays, enumerated Eloy. More units will be produced in inertial sensors, microphones, electronic compass, pressure sensors in the coming year.

Device makers will have to counteract price pressures by redefining their value proposition — selling functions and not only devices. "This is where the major changes will happen in 2012: if MEMS companies want to preserve their margins, they have to remember that MEMS is all about selling functions and micro-systems."

Many MEMS companies are acquisition targets for semiconductor and system makers. Eloy breaks this down into 2 factors: MEMS companies have reached market maturity; and venture capitalists (VCs) that invested in MEMS start-ups 10 years ago can now see a return on their investments.

In 2012, expect growth of MEMS unit volumes and more M&A from interested semiconductor companies.

Figure. 2016 MEMS market value breakdown. Total: $19.6 billion. SOURCE: Yole Développement.

Yole Développement is a group of companies providing market research, technology analysis, strategy consulting, media and finance services. Learn more at www.yole.fr.

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Update, January 18, 2012 – Marketwire — inTEST Corporation’s Temptronic Corporation has closed on the acquisition of Thermonics, Inc. on January 16, 2012, pursuant to the agreement entered into in December 2011. The purchase price for the assets was approximately $3.8 million cash, which included net working capital of approximately $1.1 million.

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December 13, 2011 – Marketwire — Temperature management and semiconductor ATE company inTEST Corporation (NASDAQ:INTT) will acquire the assets and certain liabilities of Thermonics Inc. from Test Enerprises Inc. inTEST’s Temptronic Corporation, of the Thermal Solutions Group, will integrate the company.

The acquisition is expected to close in January 2012.

Thermonics develops precision temperature testing systems with emphasis on speed, accuracy, and reliability. The precision temperature forcing systems are used in semiconductor and other industries to verify product performance at a range of temperatures. Acquiring the company expands inTEST’s semiconductor and non-semiconductor customer base — addressing temperature-related problems in the test, manufacturing, conditioning and process control arenas, said James Pelrin, president of inTEST Thermal Solutions. Pelrin points out that the product ranges are complementary to those of Temptronic Corporation, which inTEST acquired in 2000.

Robert E. Matthiessen, inTEST Corporation’s president and CEO, noted that the thermal products expand inTEST’s served available market in non-semiconductor businesses such as Automotive, Aerospace, Industrial, and Telecommunications. "inTEST Corporation began 2011 with non-semiconductor related bookings of 18% for the first quarter; and the company has systematically expanded its product offerings, with our most recent third quarter non-semiconductor related bookings increasing to 41% of consolidated bookings…During the third quarter of 2011, nearly 60% of our Thermal Group’s bookings came from non-semi customers, driven by requirements from manufacturers of oscillators, industrial sensors, LEDs, equipment for the nuclear process industry, and military/aerospace applications."

inTEST Corporation is an independent designer, manufacturer and marketer of temperature management products and ATE interface solutions, which are used by semiconductor manufacturers to perform final testing of integrated circuits (ICs) and wafers. inTEST’s Thermal Solutions Group provides customized temperature test solutions. For more information, visit www.intest.com.

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