Category Archives: MEMS

MVIS closes stock offering


November 17, 2011

November 17, 2011 – BUSINESS WIRE — MicroVision Inc. (NASDAQ:MVIS) closed its public offering of 17,948,716 shares of its common stock and warrants to purchase 8,974,358 shares of its common stock at a price to the public of $0.585 per share and accompanying warrant, as well as warrants to purchase 1,251,092 additional shares sold upon exercise by the underwriter of its over-allotment option.

MicroVision received net proceeds, after deducting the underwriting discount and estimated offering expenses, of approximately $9.8 million. See details of the MVIS stock offering here.

The securities described above were offered by MicroVision pursuant to its registration statement on Form S-3 that was previously filed and declared effective by the Securities and Exchange Commission (SEC).

MicroVision provides the PicoP display technology platform based on MEMS technology. Website: www.microvision.com.

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November 17, 2011 – Business Wire — Specialty foundry TowerJazz signed a non-exclusive memorandum of understanding (MOU) with a European entity to transfer processes and projects to India and Brazil.

TowerJazz will supply training, manufacturing expertise, project management, and technical support. The European partner will supply intellectual property (IP) licenses, supporting services, and training.

TowerJazz and its European partner share over 15 years of collaboration in various process transfer activities and transactions. The companies can collaborate on technology nodes from 1µm to 32nm, including micro electro mechanical systems (MEMS).

This partnership will target Indian and Brazilian fabless companies, and IDMs with Indian and Brazilian end markets. Growth potential in India and Brazil’s semiconductor industries is high, TowerJazz asserts. TowerJazz joined efforts with a nanoelectronics research leader to collaborate in technology transfer to these regions. The structure for project transfers to growing markets comes from TowerJazz’s TOPS business unit.

Tower Semiconductor Ltd. (TSEM), its fully owned U.S. subsidiary Jazz Semiconductor Ltd., and its fully owned Japanese subsidiary TowerJazz Japan, Ltd., operate collectively under the brand name TowerJazz, the global specialty foundry leader. For more information, please visit www.towerjazz.com.

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InvenSense (INVN) prices IPO


November 16, 2011

November 16, 2011 — MEMS maker InvenSense Inc. (NYSE:INVN) priced its initial public offering of 10 million shares of common stock at a price to the public of $7.50 per share.

In addition, selling stockholders have granted the underwriters a 30-day option to purchase up to an additional 1.5 million shares of common stock to cover over-allotments, if any.

InvenSense will not receive any proceeds from any sale of shares by the selling stockholders.

Also read: InvenSense CEO keynotes Semicon Europa MEMS Forum

Goldman, Sachs & Co. and Morgan Stanley & Co. LLC are acting as joint book-running managers for the offering. Oppenheimer & Co. Inc., Piper Jaffray & Co., Robert W. Baird & Co. Incorporated and ThinkEquity LLC are acting as co-managers for the offering. InvenSense common stock will trade on the New York Stock Exchange under the symbol "INVN." The offering of these securities will be made only by means of a prospectus, copies of which may be obtained from Goldman, Sachs & Co., via telephone: (866) 471-2526; facsimile: (212) 902-9316; email: [email protected]; or standard mail at Goldman, Sachs & Co., Attn: Prospectus Department, 200 West Street, New York, NY 10282; and from Morgan Stanley & Co. LLC, via telephone: (866) 718-1649; email: [email protected]; or standard mail at Morgan Stanley & Co. LLC, Attn: Prospectus Department, 180 Varick Street, 2nd Floor, New York, NY 10014.

Investor inquiries may be sent to [email protected].

InvenSense makes motion processing chips based on MEMS technology. Learn more at http://invensense.com/index.html

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November 16, 2011 — Microelectronics experts at Aurrion Inc. are seeking to develop military microelectronics technology for optoelectronic microsystems such as transceivers for telecommunications, coherent optical systems for laser radar (ladar) sensors and communications, optical arbitrary waveform generators, and multi-wavelength imagers with integrated image processing and readout circuitry, under terms of a $13.9 million contract awarded by the US Defense Advanced Research Projects Agency (DARPA).

Aurrion won the contract for the DARPA Electronic-Photonic Heterogeneous Integration (E-PHI) program to develop technologies and architectures to enable chip-scale electronic-photonic/mixed-signal integrated circuits on a common silicon substrate. Aurrion’s goal is to develop the necessary technologies, architectures, and design innovations to enable novel chip-scale electronic-photonic and mixed-signal integrated circuits on a common silicon substrate. Also read: Electronic + photonic + MEMS chip: DAPRA’s request for proposals for E-PHI in April.

The E-PHI initiative is part of a larger DARPA program called Diverse Accessible Heterogeneous Integration (DAHI) to develop a manufacturable device-level technology for a broad variety of materials and devices — including electronics, photonics, and micro electro mechanical systems (MEMS) — with complex architectures on a common silicon substrate.

Technologies that Aurrion will develop in the E-PHI program should provide considerable performance improvements and size reductions over current state-of-the-art technologies. DARPA scientists are particularly interested in low-noise electronic-photonic signal sources in the 20 GHz radio frequency band and in the 1000-2000nm near-infrared optical band.

These kinds of technologies should provide markedly improved technologies for optical gyroscopes, direction finding, optical communications, and frequency reference synchronization for advanced high-bandwidth RF and mixed signal chip-integrated systems, DARPA officials say. The idea is to manufacture these technologies on existing silicon CMOS chip fabs.

Examples of potential approaches include micro-assembly, epitaxial layer bonding and printing, and direct epitaxial growth in silicon process flows. DARPA scientists anticipate that integrating photonics and electronics on a silicon substrate could help produce compact optical oscillators faster electronic feedback, enhanced coupling among photonic components, and better thermal and vibration tolerance than in technologies available today.

In the E-PHI program, Aurrion experts first will develop fabrication and device technologies to integrate different photonic and optoelectronic materials on a silicon CMOS-compatible substrate. Company researchers also will concentrate on architectures and design approaches that take advantage of heterogeneously integrated materials and electronic and photonic devices, as well as on demonstrating microsystems such as continuous-wave and pulsed laser sources; RF optoelectronic signal sources; and other novel demonstration systems.

For more information contact Aurrion online at www.aurrion.com, or DARPA at www.darpa.mil.

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Published courtesy of OptoIQ’s Lee Mather. Subscribe now to Laser Focus World magazine; it’s free!

November 16, 2011 — Precision Mechatronics Pty Ltd acquired Surfx Technologies, which specializes in high-speed atmospheric plasma technology for micro electro mechanical systems (MEMS), microfluidics, semiconductors, solar cells, medical devices, sensors, plastics and composites manufacturing.

The plasma units provide a beam of plasma for materials processing at atmospheric pressure and low temperatures. The clean reactive gas flows over and through micro-structured materials, uniformly treating surfaces without any damage. High-speed atmospheric plasma can be applied for cleaning, etching, deposition, surface activation, bonding and surface modulation.

The acquisition agreement, signed in October 2011, expands Australia-based Precision Mechatronics into the US market, as well as southeast Asia. Precision Mechatronics will offer the Atomflo portable plasma unit, as well as system integration and process engineering around the clean atmospheric plasma technology, reports CEO Jason Thelander. In addition, Precision Mechatronics will expand Surfx Technologies’ install base from universities and labs into manufacturing companies, government agencies, and other end users. Existing customers for Atomflo plasma systems operate in the aerospace industry as well.

Surfx Technologies’ Professor Robert Hicks of University of California, LA (UCLA) will be a leader within the new team.

For more information about Surfx Technologies and high-speed atmospheric plasma technology refer to www.surfxtechnologies.com.

Precision Mechatronics Pty Ltd provides custom-designed, custom-built and fully installed equipment for many industries and environments, including semiconductor packaging and test systems, telecommunications, photonics, mining, medical and life sciences. Learn more at www.premecha.com.

Also read:

Atmospheric downstream plasma- a new tool for semiconductor processing

Atmospheric pressure plasma for surface prep/bonding

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November 15, 2011 — Nanotechnology accelerator SVTC Technologies partnered with SUSS MicroTec on wafer-level packaging (WLP) for micro electro mechanical systems (MEMS) and 3D IC bonding.

The companies will focus on developing "new processes and solutions in the field of wafer-level packaging," said Frank P. Averdung, president and CEO, SUSS MicroTec AG, noting SVTC’s complementary skill set in research and innovation. The companies will jointly develop and characterize new lithography and wafer-bonding technologies.

SUSS MicroTec consigned alignment and bonding equipment to one of SVTC

November 15, 2011 – GLOBE NEWSWIRE — Optical assembly manufacturer Optex Systems, Inc., a wholly-owned subsidiary of Optex Systems Holdings Inc. (OTCBB:OPXS), entered into a memorandum of understanding (MoU) with Bridge Semiconductor Corporation to develop and sell thermal systems for a range of military applications. The thin-film ferroelectric (TFFE) technology aims to displace microbolometers for uncooled thermal sensing applications.

The companies will construct thermal systems based on Bridge’s proprietary, high-performance, pyroelectric infrared sensors for use in uncooled cameras and imagers. TFFE Pyroelectric sensing technology has "unique performance advantages," including solar immunity, said Larry Weidman, CEO of Bridge Semiconductor. Lifecycle, reliability, footprint, weight, and cost improvements could come from using the TFFE technology, said Danny Schoening, GM and COOO, Optex Systems Holdings.

Also read: Wafer-level packaging emerges for uncooled IR imagers

Optex and Bridge have taken preliminary collaborative steps, such as select on-site demonstrations for potential customers.

Optex Systems Inc., the wholly owned subsidiary of Optex Systems Holdings, Inc. (OTCBB:OPXS), manufactures optical sighting systems and assemblies, primarily for Department of Defense (DOD) applications. For additional information, please visit the website at www.optexsys.com.

Bridge Semiconductor Corporation designs and manufactures thermal imaging sensors and cameras based on the company’s proprietary TFFE sensing technology.

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November 14, 2011 – BUSINESS WIRE — The MEMS Executive Congress wrapped in early November with 225 attendees, 25% increase over last year. Micro electro mechanical systems (MEMS) are seen in mainstream devices and creating "exciting new ways" of interacting with the world, say Congress organizers MEMS Industry Group (MIG).

From the world’s first GPS-enabled goggles and ingestible "intelligent" medicine to a handheld laser projector that plugs into iPhone and other multimedia devices, MEMS Executive Congress attendees explored "the MEMS inside the machine" during the Congress’s first-ever MEMS Technology Showcase.

The MEMS supply chain, top OEMs, investment experts, market strategists and technology press attended the conference, which included discussions on sensor networks, consumer MEMS, and foundry models, among other topics, noted organizer Karen Lightman of MIG.

Highlights of the Congress include the addition of Semico Research and Forrester Research, which brought fresh perspectives to the market analyst panel. Keynote speaker Scott Livingston, CEO, Livingston Securities, challenged the audience’s thinking on emerging technology investment models. And closing keynote speaker, Aaron Schulman, business director, Toffler Associates, shared his views on how billions of connected devices, geo-political changes and environmental shifts will impact technology, business and society.

MEMS are seeing growth in all markets, exceeding $19B by 2016 (Yole Developpment), especially in consumer and mobile devices, as well as gaming, automotive applications (tire pressure monitoring systems, airbags, electronic stability systems) and biomedical systems (monitoring, drug-delivery, tissue and organ replacement).

MEMS Executive Congress is a unique professional forum at which executives from companies designing and manufacturing MEMS technology sit side-by-side with their end-user customers in panel discussions and networking events to exchange ideas and information about the use of MEMS in commercial applications.

Sponsors of MEMS Executive Congress 2011 include:
Platinum Sponsor — EV Group; Gold Sponsors – Applied Materials and SPTS Technologies; Silver Sponsors – Analog Devices, Freescale Semiconductor and Semefab; and Bronze Sponsor SUSS MicroTec. Additional sponsors include ACUTRONIC, AEPI, Akustica, A.M. Fitzgerald & Associates, Asia Pacific Microsystems, Bosch, Bosch Sensortec, CEA Leti, Coventor, Fraunhofer ENAS, IHS iSuppli, imec, Kionix, Lam Research Corporation, Maxim, MEMS Investor Journal, Micralyne, Okmetic, Plan Optik, Silex Microsystems, Inc., Solid State Technology, STMicroelectronics, Teledyne DALSA and Yole Developpement.

MIG will host a European MEMS Executive Congress at the Hotel Novotel Zurich Airport Messe on March 20, 2012; the US MEMS Executive Congress 2012 will be held November 7-8, 2012 at the Kierland Resort, Scottsdale, AZ. For more information, visit MEMS Executive Congress at www.memscongress.com.

MEMS Industry Group (MIG) is a trade association advancing MEMS across global markets. For more information, visit www.memsindustrygroup.org.

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November 14, 2011 — Auburn University chemical engineering researchers William R. Ashurst and Virginia A. Davis were awarded a National Science Foundation (NSF) grant to investigate cellulose nanocrystals in micro electro mechanical systems (MEMS).

Cellulose nanocrystals boast beneficial mechanical properties, surface chemistry, and self-assembly, Davis said, leading to less-expensive MEMS devices with improved and new functionalities. The project is titled "Collaborative Research: Processing and Properties of Cellulose Films for MEMS Applications."

The research is being conducted in collaboration with Christopher L. Kitchens, an Auburn chemical engineering alumnus and assistant professor in Clemson University’s Department of Chemical and Biomolecular Engineering.

Auburn University has an extensive MEMS program. Learn more about Auburn University at http://www.auburn.edu/.

Earlier this year, Semiconductor Research Corporation (SRC) joined the NSF to fund $20 million for 12 four-year grants supporting nanotechnology research, focused on replacing the transistor. See the grant recipients here.

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November 11, 2011 – BUSINESS WIRE — MicroVision Inc. (Nasdaq:MVIS), maker of ultra-miniature laser display technology based on MEMS, intends to offer to sell, subject to market and other conditions, shares of its common stock and warrants to purchase shares of its common stock in an underwritten public offering.

MicroVision has priced an underwritten public offering of 17,948,716 units at a price to the public of $0.585 per unit for gross proceeds of approximately $10.5 million. Each unit consists of one share of common stock and one warrant to purchase 0.5 shares of common stock at an exercise price of $0.78 per share. The shares of common stock and warrants are immediately separable and will be issued separately. The warrants are exercisable beginning on the date of issuance and expire on the five-year anniversary of the date of issuance. MicroVision has also granted the underwriter a 30-day option to purchase an additional 2,692,306 shares of common stock and warrants to purchase an additional 1,346,153 shares of common stock, solely to cover over-allotments. MicroVision expects to receive net proceeds, after deducting the underwriting discount and estimated offering expenses, of approximately $9.7 million from the offering, or $11.2 million if the underwriter exercises their over-allotment option in full.

Oppenheimer & Co. is acting as the underwriter for the offering. The offering is expected to close on or about November 16, 2011, subject to the satisfaction of customary closing conditions. 

Also read: Embedded pico projectors steal the show through 2017

MicroVision intends to use the net proceeds from the offering for general corporate purposes.

MicroVision provides the PicoP display technology platform designed to enable next-generation display and imaging products for pico projectors, vehicle displays and wearable displays that interface with mobile devices. The company’s projection display engine uses highly efficient laser light sources that create vivid images with high contrast and brightness. Microvision’s patented MEMS scanner is at the core of its display and imaging engines. Website: www.microvision.com.

Details:
The securities described above are being offered by MicroVision pursuant to its registration statement on Form S-3 previously filed and declared effective by the Securities and Exchange Commission (SEC). This press release does not constitute an offer to sell or a solicitation of an offer to buy the securities in the offering, nor shall there be any sale of these securities in any jurisdiction in which an offer, solicitation or sale would be unlawful prior to registration or qualification under the securities laws of such jurisdiction. The offering may be made only by means of the preliminary prospectus supplement and the prospectus relating to the proposed offering, copies of which may be obtained, when available, from Oppenheimer & Co. Inc., Attention: Syndicate Prospectus Department, 300 Madison Avenue, 5th Floor, New York, NY, 10017, by telephone at (212) 667-8563, or via email at [email protected].

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