Category Archives: MEMS

November 10, 2011 — Shanghai Simgui Technology Co. Ltd., a leading Chinese wafer manufacturer, placed a follow-on order for an EV Group (EVG) EVG850 automated production bonding system for silicon-on-insulator (SOI) and direct wafer bonding. Simgui is moving from EVG’s semi-automated wafer bonder to advance high-volume SOI production.

Simgui is a spin-off from Shanghai Institute of Microsystem and Information Technology (SIMIT). It will transfer a well-established production process to the fully automated system. Currently, the company uses an EVG301 single wafer cleaning system with pre-bonding and IR inspection station.

SOI wafers are used to make micro electro mechanical systems (MEMS) and microprocessors, as well as other microelectronics.

This order comes on the heels of another EVG install in China: new customer Shenyang Silicon Technology Co. Ltd. (SST) purchased an EVG850LT automated production bonding system for silicon-on-insulator (SOI) wafers in its state-of-the-art SOI production facility this March.

EV Group recently introduced its 450mm SOI wafer bonder.

EV Group (EVG) makes wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. More information is available at www.EVGroup.com.

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November 9, 2011 – GlobeNewswire via COMTEX — Measurement Specialties Inc. (NASDAQ:MEAS), sensor designer and manufacturer, entered into an amendment to its senior secured credit facility dated June 1, 2010, among JPMorgan Chase Bank N.A., as administrative agent and collateral agent, and certain other parties including Bank of America N.A., HSBC Bank USA N.A., Branch Banking & Trust Company and Credit Industriel et Commercial.

Details:
The Credit Agreement Amendment provides MEAS with improved pricing and additional flexibility under its minimum fixed charge ratio covenant, extended the term to 5 years from the Amendment Date, and increased the accordion expansion feature from $50 million to $75 million. MEAS’ applicable margins for the variable interest rates under the Eurocurrency or London Inter-Bank Offered Rate (LIBOR) borrowings were reduced to levels ranging from 125 to 200 basis points from levels ranging from 200 to 325 basis points. The Company’s applicable margins for the variable interest rates under the prime or ABR borrowings were reduced to levels ranging from 25 to 100 basis points from levels ranging from 100 to 225 basis points. The commitment fees on the unused balances were reduced to a range of 0.30% to 0.375% from a range of 0.375% to 0.50%. Additionally, the minimum fixed charge coverage ratio will exclude capital expenditures related to the new facilities being constructed in China and France.

On November 8, 2011, Measurement Specialties also entered into an amendment (the Prudential Amendment) to its note purchase and private shelf agreement with Prudential Investment Management, Inc. and certain other note-holders party thereto, conforming certain definitions and changes made in the Credit Agreement Amendment.

Measurement Specialties Inc. (MEAS) designs and manufactures sensors and sensor-based systems to measure precise ranges of physical characteristics such as pressure, temperature, position, force, vibration, humidity and photo optics. MEAS uses multiple advanced technologies — including piezoresistive, electro-optic, electro-magnetic, capacitive, application specific integrated circuits (ASICs), micro-electromechanical systems (MEMS), piezoelectric polymers and strain gauges — to engineer sensors that operate precisely and cost effectively.

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November 9, 2011 – Marketwire — The Ontario Centres of Excellence gave the Martin Walmsley Fellowship for Technological Entrepreneurship award, totalling $50,000, to Innovative Processing Technologies Inc. The one-year fellowship supports Ibraheem Khan’s company’s application of multiple-memory material (MMM).

Two other companies received the award as well: MyVoice Inc. (2-year) and Eve Medical (1-year).

Innovative Processing Technologies (IPT) Inc. helps implement smart materials in industrial applications. Multiple-Memory Material (MMM) technology enables greater functionality than traditional smart materials and can be applied to virtually any shape memory alloy (SMA) to locally modify properties. SMAs exhibit a shape memory, used for micro electro-mechanical systems (MEMS) and microelectronics, automotive, medical devices, and other applications. MMM enables more than one shape memory to be embedded in a monolithic component. IPT’s MMM technology also enhances other functional properties of SMAs, such as pseudoelasticity and corrosion performance.

The recipients are helping make Ontario a technological leader, said Brad Duguid, Minister of Economic Development and Innovation. The Martin Walmsley Fellowship for Technological Entrepreneurship facilitates the transition of OCE-funded university-based research into innovative business ventures. An expert panel selects the recipients, who are judged on criteria including strength of technology, commercial viability and sound business planning. The Fellowship honours the vision of Dr. Martin Walmsley, who was instrumental in founding the Ontario Centres of Excellence program in 1987.

To view a video of all of this year’s Martin Walmsley Fellowship recipients, please visit the following link: http://www.youtube.com/watch?v=XEqf9SPJGTc

Ontario Centres of Excellence (OCE) Inc. drives the commercialization of cutting-edge research across key market sectors to build the economy of tomorrow and secure Ontario’s global competitiveness. Learn more at www.oce-ontario.org.

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November 8, 2011 — The automobile industry is a "lucrative" sensor integration market globally, as sensors that enhance comfort, fuel-efficiency, and safety are integrated by vehicle manufacturers. Micro electro mechanical system (MEMS) sensor production costs are set to drop, which will bring automotive sensors into the price/benefit range of every level of automobile, says Global Industry Analysts (GIA).

In recent years, post 2008-2009 recession, MEMS sensors have gone into vehicle safety and control products en masse: anti-lock braking systems (ABS), airbags, engine emissions control, etc. In developed nations, opportunities now exist for driver visibility and traffic assistance, such as aftermarket back up warning sensor/reverse parking sensors.

As MEMS production costs fall in the coming years, and regulatory changes make vehicle stability control and other sensors mandatory, all types of new cars will use these sensor systems.

The automotive industry jumped out of recession in 2010 thanks to significant government stimulus, and globally, government incentives will continue to drive new vehicle development. MEMS pressure sensor sales jumped with the automotive industry in 2010, used in tire pressure monitoring systems, among other applications.

Alternative vehicles will also see government backing. Even in traditional vehicles, a focus on vehicle fuel efficiency and improved powertrain performance features will result in secure gains for sensors, such as oxygen (O2) sensors, aftermarket ABS sensor, tire pressure monitoring sensors, aftermarket coolant temperature sensor, Wiegand effect sensors in aftermarket high-performance ignition systems, among numerous others.

Europe and Asia-Pacific account for a major share of the global automotive sensors market, GIA notes.

By segment, engine & transmission automotive sensors is the largest contributor to global market revenues. Global market revenues for safety & security automotive Sensors are expected to surge at a fastest CAGR of 9.2% over the analysis period.

Major players in the global marketplace include Allegro MicroSystems Inc, Analog Devices Inc, Aptina Imaging Corporation, Autoliv Inc, Bosch Sensortec GmbH, Bourns Inc, CASCO, Continental AG, Corrsys-Datron Sensorsysteme GmbH, CTS Corporation, Custom Sensors & Technologies Inc, Delphi Corporation, Denso Corporation, ELESYS North America Inc, Freescale Semiconductor Inc, GE Sensing & Inspection Technologies, Hamamatsu Photonics KK, Hamlin Electronics LP, Hella KGaA Hueck & Co, Hitachi Automotive Systems, Honeywell Sensing & Control, Infineon Technologies North America Corp, Magneti Marelli Holdings SpA, Melexis Microelectronic Integrated Systems NV, Micralyne Inc, Micron Technology Inc, NGK Spark Plugs USA Inc, NXP Semiconductors, Novotechnik US Inc, Omron Corporation, OSRAM Opto Semiconductors GmbH, Sensata Technologies, SSI Technologies Inc, TRW Automotive Holdings Corp, TT electronics plc, Universal Sensors Inc, among others.

“Automotive Sensors: A Global Strategic Business Report” provides a comprehensive review of market trends, issues, drivers, company profiles, mergers, acquisitions and other strategic industry activities. The report provides market estimates and projections (in US$ Million) for major geographic markets including the US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World. End-use segments analyzed include Engine and Transmission, Chassis, Safety and Security, Body and Other Applications.

For more details, visit http://www.strategyr.com/Automotive_Sensors_Market_Report.asp. Global Industry Analysts Inc. (GIA) is a leading publisher of off-the-shelf market research.

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November 8, 2011 — The Heterogeneous Technology Alliance (HTA), a team of leading European technology institutes, is developing new packaging and test methods for micro electro mechanical systems (MEMS) targeting space missions.

As part of the Wafer-Level Encapsulation in Microsystems (WALES) project, HTA members are studying how wafer-level packaging (WLP) can be used to connect and protect MEMS devices in hermetically sealed structures to withstand extreme weather and radiation conditions encountered in space. The project also will provide the European Space Agency (ESA), which is funding the project, a simple and fast standardized test to evaluate the suitability of MEMS for space missions.

XRD systems at CSEM.

Also read: NASA technologist talks CNTs, nanowires, PCMs…

Led by CSEM, the project is developing procedures for sealing and testing MEMS WLP for a piezo-electrically actuated resonator from CSEM and a capacitively actuated resonator from CEA-Leti. Fraunhofer Institute for Electronic Nano Systems ENAS is applying special measuring and testing processes to guarantee the reliability of these MEMS systems. VTT, the Technical Research Centre of Finland, will join the project consortium; negotiations are currently under way.

Focused ion beam (FIB) tool at Fraunhofer.

Increased reliability via improved packaging could extend MEMS lifetimes and make them suitable for harsh environments like space missions. MEMS could increase the sensing devices on European space projects while decreasing form factor and costs.
 
The HTA was launched in 2006, bringing together microsystems institutes in an alliance of ideas and joint-development projects with industry partners. Members: CEA-Leti, CEA-Liten, CSEM, Fraunhofer Group for Microelectronics and VTT. Visit www.hta-online.eu for more information.

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November 7, 2011 — SEMATECH has created an online 3D Standards Dashboard, allowing 3D semiconductor and MEMS interconnect professionals to exchange standards activity information. This Dashboard, managed by SEMATECH’s 3D Enablement Center, will help develop standards in the 3D packaging field with the help of IEEE Standards Association, JEDEC, SEMI, and Si2.

3D heterogenous integration lacks uniform standards for key manufacturing parameters, which are neccessary for an orderly supply chain and high-volume production. Because standards are needed in many areas and over broad technology bases, the Dashboard is designed to improve information sharing, which will accelerate standard development and adoption, and avoid duplication of effort.

Companies involved in 3D production can use the 3D Standards Dashboard to find existing standards as well as to identify and track standards development activities in areas such as design, testing and production. Additionally, the 3D Standards Dashboard provides a proactive forum for facilitating collaborative discussions on perceived gaps in standardization activities and for identifying which standards development organizations (SDO) will best meet the need for a specific standardization activity.

SEMATECH, IEEE, JEDEC, SEMI, and Si2 invite fabless, fab-lite and IDM companies, outsourced semiconductor assembly and test (OSAT) suppliers, and EDA process tool and materials suppliers worldwide to participate by visiting http://wiki.sematech.org/3D-Standards.

Example of 3D packaging standards collaborations:

November 7, 2011 — BUSINESS WIRE — MEMS foundry Micralyne Inc. brought Nanoshift LLC, a product development firm specializing in emerging technologies, on board for design, process development, fabrication and packaging partnerships.

Micralyne has a similar partnership with A.M. Fitzgerald & Associates (AMFitzgerald).

This integrated design and manufacturing approach targets lower entry barriers to micro electro mechanical system (MEMS) device companies looking to commercialize products. The partnership takes Nanoshift from third-party supplier to an "essential part" of the Micralyne business model, said Nancy Fares, CEO of Micralyne.

Fares adds that the partnership approach "minimizes risk and cost" in the transition from proof-of-concept to volume production. The integrated model streamlines market introduction, added Salah Uddin, co-founder of Nanoshift, "moving IP through prototype, design and production." Customers work with a central project manager in the unified approach.

Nanoshift recently licensed Silex Microsystems’ Sil-Via MEMS packaging technology.

Micralyne is an independent MEMS foundry. For more information on Micralyne, please visit: www.micralyne.com.

Nanoshift LLC is a privately held design and development company that specializes in emerging technologies. For more information on Nanoshift, please visit: www.nanoshift.net.

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November 7, 2011 — MEMS foundry Silex Microsystems and MEMS development firm A.M. Fitzgerald & Associates completed a multi-year collaboration on medical and biotech MEMS development. They halved device development time using the Silex Sil-Via platform and AMFitzgerald’s prototyping and design.   

AMFitzgerald worked with Silex Microsystems’ Sil-Via technology platform early in the development process. This grounds-up approach and close collaboration resulted in a 6-month development cycle of several MEMS designs that are now ready to go into volume production in Silex’s advanced 6" and 8" fabs. The projects typically would require a year or more to complete, the companies report.

Also read: Silex MEMS TSV tech licensed to Nanoshift

Silex Microsystems is developing "a partner ecosystem" to accelerate projects like this, said Peter Himes, VP of marketing and strategic alliances for Silex Microsystems. The key was Silex’s "proven, standardized process modules," made accessible to the project developers, said Dr. Alissa M. Fitzgerald, founder and managing member of AMFitzgerald.

AMFitzgerald integrated Silex’s Sil-Via standard through silicon via (TSV) and wafer-level packaging (WLP) technologies in the very first prototypes, identifying and addressing issues early on in the process. This avoided problems during foundry transfer and ramp-up. The Silex Sil-Via platform is a full-wafer thickness via comprised of a DRIE etched post surrounded by an isolating material. The resulting interconnect is low impedance, mechanically robust, and avoids the thermal mismatch of metal-based via technologies.

The companies concluded that array-based sensors, such as imaging or diagnostic arrays that require high-density I/O and small form factors, would benefit the most from the Sil-Via designs and the DfM process. BioMEMS, motion sensors, oscillators, optical sensors and pressure sensors are examples.

Silex Microsystems is a pure-play MEMS foundry. For more information, please visit www.silexmicrosystems.com.

AMFitzgerald offers MEMS product development. Internet: http://amfitzgerald.com/.

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November 4, 2011 — Sand 9, a micro electro mechanical system (MEMS) oscillator developer, reports that it has raised $3,095,262 of its 6,190,528 equity funding round, in a recent SEC filing.

In February this year, Sand 9 announced that it was ramping the commercial-volume launch of its MEMS oscillator technology for wireless applications. The MEMS timing device targets cellular and other devices, like GPS.

See the US Securities and Exchange Commission (SEC) filing at http://www.sec.gov/Archives/edgar/data/1401285/000140128511000001/xslFormDX01/primary_doc.xml

Sand 9 is a venture funded company dedicated to the design of precision timing technology that will dramatically improve the capabilities of electronic devices. The company’s investors include Commonwealth Capital, Flybridge Capital Partners, General Catalyst and Khosla Ventures. For more information, visit www.sand9.com.

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November 4, 2011 — Yole Développement’s new report, "Inertial Combo Sensors for Consumer & Automotive" shows that supply chains need to adapt to the "very large market opportunity" for inertial combo sensors. Inertial combo sensors will see 15% growth in consumer and automotive applications in 2011, hitting $2.6 billion.

Combination sensors are a marginal player now but expected to penetrate 40% of the $2.7 billion consumer inertial market and 12%+ of the $1.1 billion automotive inertial market by 2016. On the consumer side, added motion sensing capabilities in an increasing number of mobile devices are driving growth; for automotive, safety systems — better and in more cars globally — are the main impetus.

Figure. 2009-2016 consumer and automotive inertial sensor market. SOURCE: Inertial Combo Sensors for Consumer & Automotive Report, Yole Développement, October 2011.

Unit sales will continue to grow at double-digit rates in the future. However, price erosion and maturing markets herald a slow decline in revenues. One way to offset this is with more sophisticated sensor fusion that optimized multiple sensors with complex software.

Combo sensors allow device designers to reduce costs and product footprint. Lower-cost units combining multiple micro electro mechanical system (MEMS) sensors will see "healthy growth."  However, Yole warns that the benefits of combo sensors can be application specific, with the dynamism of the evolution of each individual sensor. The trend will start in the mature automotive sector, where cost benefits can be realized in electronic stability control (ESC) systems by combining the accelerometer and the gyroscope in one package with one ASIC. Consumer technologies change much more rapidly, and discrete device prices are still falling rapidly. Once the economics do become compelling for consumer adoption, around 2012-2013, market penetration will be faster and deeper than on the automotive side.

Yole forecasts that new players will enter the market, and sensor management expertise will be in demand.

Dropping prices and new market entrants will change the supply chain, Yole notes, as companies "figure out how best to compete and cooperate for the much bigger business of integrating the silicon sensors into useful functions." The cost of MEMS devices often lies much more in the ASIC, packaging, test, and calibration — as well as software development — than in die fabrication. This rule will only become more visible as companies adopt multisensory packages.

Combo sensors enable interaction between the multiple MEMS die that enhances their individual performance and creates new applications, a melding that is called sensor fusion. This requires much more sophisticated software controls. Players in the MEMS industry can compensate for price declines by selling high-value solutions that include more software content. This added value could benefit the sensor makers supplying the algorithms to combine and cross-calibrate the sensor data and do some standard applications as well as the software and chipset makers that supply higher-level specialty functions. Higher-value software calculations might require an MCU, not the usual ASIC. Makers of microcontrollers, software, and subsystems will start to take over more of the sensor management.

Laurent Robin is in charge of the MEMS & Sensors market research at Yole Developpement. He previously worked at image sensor company e2v Technologies (Grenoble, France). He holds a Physics Engineering degree from the National Institute of Applied Sciences in Toulouse, plus a Master Degree in Technology & Innovation Management from EM Lyon Business School, France.

Companies cited in the report:
Acutronic, Advanced Microsensors, Advancedmicrofab, Aichi Steel, AKM, Alps Electric, Amazon, AMS, Analog Devices, AP M, Apple, ASTRI, Atmel, Autoliv, Baolab, BMW, Bosch, Broadcom, BWI , BY D, Casio Micronics, CEA LETI , Chevrolet, Chrysler, Continental, CSR, Daesung, Dai Nippon Printing, Daihatsu, Dalsa, Deep Di Semiconductor, Delphi, Domintech, Eastman Kodak, EM Microelectronics, Epson Toyocom, Fairchild, Ford, Foxcon, Fraunhofer ISIT , Free / Iliad, Freescale, Fujitsu, FullPower, Futaba, Garmin, GE, Global Foundries, Google, Hana Microelectronics, HDK Kokuriku, Hillcrest Labs, Honeywell, HT C, IMU Solution, InvenSense, IT RI, Jyve, Keynetic, Kionix, Kyocera, Lancia, Lenovo, LG, Lingsen Precision Industries, Logitech, Mando Corp, Maxim, Mcube, Mediatek, Memsic, Memsmart, Memstech, Micro Infinity, Microchip, Microsoft, Mitsubishi, Mobius, Mio, Motorola, Movea, Murata, Navteq, Nike, Nintendo, Nissan, Nokia, NT DoCoMo, Nuvoton Technology, Pace, Pacific, Palm, Panasonic, Parrot, Pixart, PointInside, Prolific Technology, Qualtre, Renault, Ricoh, RIM, Rohm, Rood Microtec , Samsung, Schraeder, Seagate, Seiko Epson, Seiko NP C, Senodia, Sensitec, Sensonor, SensorDynamics, SensorPlatforms, Sharp, SiliconLabs, Sitronix Technology, Skyartec, SMK , Sony, Sony Ericsson, SPIL , SSS, ST Microelectronics, Sunrex, Systron Donner, Takata, Technitrol, TI , TMT, TomTom, Toshiba, Toyota, Tronics, Trusted Positioning, TRW, TSMC, Universal Electronics, Virtus Advanced Sensors, VTI, Wacoh, Western Digital, Wolfson, Wolkswagen, XSens, Yamaha, Yishay Sensor, ZillionTV , ZTE …

Yole Développement is a group of companies providing market research, technology analysis, strategy consulting, media in addition to finance services. Internet: www.yole.fr.

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