Category Archives: MEMS

November 3, 2011 — Ziptronix Inc., semiconductor bonding technology developer, shared the results of recent collaborations with major image-sensor manufacturers: Ziptronix ZiBond direct bonding process contributed minimum distortion in backside illuminated (BSI) image sensors.  

The Ziptronix direct bonding technology delivered the lowest distortion of any process for manufacturing BSI image sensors, said Ziptronix CEO Dan Donabedian. "Minimal distortion means pixels can be scaled smaller, and that means increased image sensor resolution, more die per wafer, improved image sensor yields and lower production costs."

BSI image sensor manufacturing typically requires bonding a silicon CMOS wafer to a non-CMOS handle wafer. Because this bonding technology does not involve a large coefficient of thermal expansion (CTE) mismatch, it does enable very low distortion which is required for scalable color filter array overlay on the exposed photodiodes after thinning of the bonded CMOS wafer.

Wafer distortion introduced during the bonding process can compromise the overlay and limit pixel scaling. ZiBond’s inherent capacity for high bond strength at low temperature effectively minimizes this distortion compared to the competing bond technologies (adhesive and copper thermo-compression), the company reports. This enables submicron pixel scaling; 0.9um pixel BSI image sensors have already been fabricated and work on 0.7um pixel BSI is underway.

BSI image sensors are replacing frontside illuminated image sensors for digital cameras and smartphone cameras, as well as other applications.

Sony Corp. recently licensed the Ziptronix ZiBond technology for BSI image sensor manufacturing.

Ziptronix develops low-temperature direct bond technology for a variety of semiconductor applications, including backside-illuminated (BSI) sensors, RF front-ends, pico projectors, memories and 3D integrated circuits. Visit www.ziptronix.com.

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November 2, 2011 — Micronit opened its MEMS division, specializing in the design, prototyping and manufacturing of MEMS devices and wafers based on glass.

The Micronit manufacturing line processes several hundreds of thousands of wafers per year on 100-300mm substrates.

Micronit began manufacturing micro electro mechanical systems (MEMS) after completing several projects for customers, and the company’s existing processing and materials capabilities. Prototyping and manufacturing will use many of the same processes and equipment as lab-on-a-chip production, explained Ronny van ‘t Oever, managing director and co-founder of Micronit.

The company will make MEMS for LED applications, photovoltaics, static and active displays, fuel cells and sensors, among others where glass and silicon are combined in devices.

Micronit manufactures microfluidic lab-on-a-chip products and performs other micromachining technologies. The company works mainly in glass but also in silicon, polymers, and other materials. Micronit is ISO 9001 certified. Learn more at www.micronitmems.com.

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November 1, 2011 — In a Solid State Technology webcast, presented by DigitalOptics Corporation, a wholly owned subsidiary of Tessera Technologies, Dr. Giles Humpston, Director of Applications, presented Lens Tilt in Small Auto-Focus Cameras.

What is a small camera? Most would qualify it as about 1cm3, disposable, cheap (<$1/MP) and integrated into digital cameras, cell phones, webcams, etc.

Figure 1. Simplified diagram of a miniature camera.

Small cameras range from the simplest, most rugged and most limited fixed-focus systems to higher-end auto-focus (AF) devices that are the subject of Humpston’s talk. AF cameras have electronic controls that allow them to focus much closer (as on a barcode) and in lower light than other designs.

Auto-focus cameras have evolved from large, highly mechanical, expensive devices. Today the majority of AF cameras are based on voice-coil motor (VCM) technology which works on magnetic attraction/repulsion principles.

Figure 2. A VCM miniature camera set up, with springs and magnets to control lens movement.

VCM pros? The devices are compact, almost silent, and cheap, with good focus range. Cons? They are slow, and not the best choice for video. Power consumption is in the hundreds of milliwatts (mW), and the smaller the VCM, the higher the power consumption. VCMs also suffer from lens tilt (Figure 3).

Figure 3. Lens tilt. Springs can change length, pulling the lens, or a user can tilt the lens through the influence of gravity and cause permanent changes by dropping the device. Tilt control is expensive and increases package form factor.

High-performance next-generation auto-focus cameras will not use VCMs, says Dr. Humpston.

Alternatives are in development– electrostatic silicon actuators manufactured as micro electro mechanical systems (MEMS).  The comb drive actuator — the most common design — is very low power.

Figure 4. Comb drive actuator.

Silicon MEMS can also be formed into a complete auto-focus component, with springs, etc. on one chip. With no mechanical play, MEMS actuator actions are extremely reproducible, operation is faster and optical performance is maintained through a wide range. With only one moving lens, as opposed to the entire optical train, image quality is desensitized to lens tilt. The module form factor becomes thinner as well.

Table. Key features of an auto-focus camera using VCM and MEMS.

 

MEMS

VCM

Actuator dimensions (mm)

7.4 x 7.4 x 1.7

8.5 x 8.5 x 5.0

Peak Power*

0.5mW

250mW

Repeatability

1µm

10µm

Hysteresis

3µm

20µm

Speed+

5ms

30ms 

Reliability cycles

10 million

1 million

Reflow compatible

Yes

No

* MEMS peak power <30µW, remainder is the driver chip

+ Half-stroke settling time

VCM alternatives based on MEMS will start hitting the market commercially in 2012, Humpston says. Get all the design details and in-depth discussion of lens options, reliability, and more in the webcast: Attend now.

Dr. Humpston is a metallurgist with his name on patents and publications, including articles on nanotechnology and semiconductors for ElectroIQ.

Attend the webcast: FREE WEBCAST: Lens Tilt in Small Auto-Focus Cameras

Read Dr. Humpston’s article: Nanotechnology for semiconductors

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November 2, 2011 – PRNewswire — MEMS foundry Silex Microsystems licensed its Silex Sil-Via through-silicon-via (TSV) packaging platform to Nanoshift for use in early development of complex MEMS products.

Silex Sil-Via license agreements allow customers to take complex MEMS devices from prototype to volume production faster, said Peter Himes, vice president of marketing and strategic alliances for Silex Microsystems. Through the Silex Sil-Via license, Nanoshift can bring customer designs to market faster, reducing development time and project risk. Transition to full-scale production on Silex’s 6" or 8" wafer fab lines will be "seamless."

Nanoshift chose the Silex Sil-Via platform because it has been "proven in many high-volume [MEMS] applications," said Salah Uddin, co-founder of Nanoshift.

Silex Sil-Via is a proprietary technology for through silicon via (TSV) interconnects: a full-wafer thickness via comprised of a DRIE etched post surrounded by an isolating material. The resulting interconnect is low impedance, mechanically robust, and avoids the thermal mismatch of metal-based via technologies. Silex brought it into production in 2006 and it has been used on over 100 designs. It can be implemented for wafer-level packaging (WLP) as well as MEMS interconnects.

Silex Microsystems is the world’s largest pure-play MEMS foundry. For more information, please visit www.silexmicrosystems.com.

Nanoshift LLC is a privately held design and development company that specializes in emerging technologies. For more information, please visit www.nanoshift.net.

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November 1, 2011 — Huntsman Corporation (NYSE:HUN) Advanced Materials division sold its stereolithography resin and Digitalis MEMS manufacturing machine businesses to 3D Systems Corporation (NYSE:DDD) for $41 million in cash.

The stereolithography business had revenues of $7 million in 2010 and its products are used primarily in three-dimensional part building systems.

Digitalis is a new rapid manufacturing printer for micro electro mechanical systems (MEMS), currently in advanced stages of development and validation, that is capable of manufacturing large numbers of parts simultaneously at high speed and accuracy.

This acquisition complements 3D Systems’ print materials technology and intellectual property portfolio and adds the Digitalis print engine to its printer family. DDD will integrate the product lines into its rapid manufacturing and healthcare solutions portfolio. The company expects this acquisition to be immediately accretive to its net income and contribute favorably to its target operating model.

"3D has a rich heritage of being a pioneer and industry leader in stereolithography and rapid manufacturing systems," noted James Huntsman, president of the Advanced Materials division of HUN. HUN will concentrate its focus on the construction, coatings, power, aerospace and electronics applications.

Huntsman is a global manufacturer and marketer of differentiated chemicals. For more information about Huntsman, visit www.huntsman.com.

3D Systems provides 3D content-to-print solutions including 3D printers, print materials and on-demand custom parts services for professionals and consumers. More information on the company is available at www.3DSystems.com.

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November 1, 2011 — Micrel Inc. (Nasdaq:MCRL) has begun manufacturing micro electro mechanical systems (MEMS) at its San Jose, CA wafer foundry operations. Micrel started production with a "major MEMS manufacturer representing a significant percentage of the existing foundry capacity." The IC maker is also developing production processes for several MEMS startups.

Micrel is one of the few 6" wafer fabs in the US offering MEMS manufacturing capability.

Micrel invested several million dollars in the MEMS fab ramp. Its San Jose site can now perform 3D front-to-back wafer alignment and has added a deep reactive ion etch (DRIE) tool to precisely etch very deep trenches, through silicon vias (TSV), and large cavities.

Micrel has acheived full production for its primary MEMS customer, said Guy Gandenberger, vice president, worldwide operations and foundry business unit for Micrel. Additional capacity is now reserved for other MEMS customers, and Micrel is capable of expanding the MEMS foundry space if necessary.

Micrel’s Wafer Fab Division offers foundry services to commercial and military IC designers, among other customers. The wafer fab equipment can be used for short runs or volume production. The facility has been certified to ISO14001:1996, the International Environmental Management System Standard.

Micrel Inc. is a global manufacturer of ICs for the analog, Ethernet and high bandwidth markets. Web: http://www.micrel.com.

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November 1, 2011 — Scanning probe/atomic force microscopy company Asylum Research introduced the Variable Field Module2 (VFM2) for the MFP-3D Atomic Force Microscopes (AFM). It allows researchers to apply magnetic fields in conductive AFM experiments, magnetic force microscopy, and other applications.

Rare-earth magnets produce the field without heat, thermal drift, or mechanical vibration. The magnetic fields are continuously adjustable, applied parallel to the sample plane approaching one Tesla with one Gauss resolution. An integrated Gaussmeter provides a quantitative measure of the applied magnetic field.

Five frames showing a piece of Perpendicular Media Recording (PMR) hard disk degaussed with an in-plane ~0.5 Tesla magnetic field using the VFM2.

VFM2 attaches to the MFP-3D AFM with adjustable pole tips to accommodate maximum required field, sample placement, and minimum field gradients. Research on piezoelectrics and ferroelectrics can be conducted with an attachable VFM2 High Voltage Kit, for tip biases up to ±220V.

Also read: Global market for piezoelectric-operated actuators and motors and Ferroelectric/ferromagnetic nano-structured film discovery

The VFM2 replaces “complicated” superconducting or water-cooled magnets, said Roger Proksch, president of Asylum Research, “neither of which were particularly friendly to low-noise, high precision AFM measurements.”

Asylum Research makes atomic force and scanning probe microscopy (AFM/SPM) for both materials and bioscience applications. Internet: www.AsylumResearch.com.

October 28, 2011 — BUSINESS WIRE — Orbit International Corp. (NASDAQ:ORBT) Power Group, through its Behlman Electronics Inc. subsidiary, received 3 new orders for its COTS Division, valued in excess of $1.5 million. The orders are for commercial off the shelf (COTS) power supplies to an electro-optical sensing system, a computer system, and an all-weather airborne reconnaissance aircraft.

$470,000 order: power supply used on a U.S. Naval electro optical sensing system. Deliveries will take place Q1 through Q3 2012. Option quantities have been quoted through 2015, which could bring the total value to over $1.5 million.

$657,000 order: power supply for a computer system used on a major missile defense system, as part of a system upgrade for an ongoing program for which Behlman received a $458,000 order in August 2011. Deliveries will take place from Q2 to Q4 2012. Additional follow-on orders are expected.

$455,000 order: power supply for the RC-135, a U.S. Air Force (USAF) all-weather airborne reconnaissance aircraft. Behlman has been supplying units for this program since 2008, totalling over $1,900,000 in orders. This order will be delivered from Q2 to Q4 2012, with additional orders expected in the future.

Orbit International Corp. is involved in the manufacture of customized electronic components and subsystems for military and nonmilitary government applications through its production facilities in Hauppauge, New York, and Quakertown, Pennsylvania; and designs and manufactures combat systems and gun weapons systems, provides system integration and integrated logistics support and documentation control at its facilities in Louisville, Kentucky. Its Behlman Electronics, Inc. subsidiary manufactures and sells high quality commercial power units, AC power sources, frequency converters, uninterruptible power supplies and associated analytical equipment. The Behlman military division designs, manufactures and sells power units and electronic products for measurement and display.

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October 27, 2011 — Micro electro mechanical system (MEMS) pressure sensors have relatively high average selling prices (ASP) and a range of applications, making them to leading MEMS device by 2014, according to IHS iSuppli MEMS & Sensors Market Tracker.

Pressure sensors are climbing the MEMS device ranks thanks to "steady market expansion," said Richard Dixon, Ph.D., senior analyst for MEMS and sensors at IHS. Currently, accelerometers and gyroscopes are the most popular MEMS devices.

The strong automotive resurgence post-recession kicked pressure sensor revenue to $1.22 billion in 2010, a 26% increase from 2009. 2011 growth will hit 6.6%, followed by a double-digit expansion in 2012. By 2014, revenue for MEMS pressure sensors will amount to $1.85 billion.

Figure. MEMS pressure sensor revenues. SOURCE: IHS iSuppli October 2011.

MEMS pressure sensor prices vary depending on the level of compensation and calibration of the die, as well as the MEMS packaging. MEMS pressure sensor designs use either a Wheatstone bridge arrangement (piezoresistive-type sensing) or capacitive sensing to detect deflation within the package. Both styles are popular, IHS reports. Medical and industrial MEMS pressure sensors sell between several dollars and tens of dollars. Highly specialized components for harsh environments, such as aircraft hydraulics, can sell in the hundreds, Dixon noted.

72% of MEMS pressure sensors (by revenue) are used in automotive applications in 2011; 11% go into medical electronics; and 10% serve the industrial segment. The remaining 6% is split between consumer electronics and military-aerospace devices.

Automotive pressure sensors are most popular for engine management (manifold air pressure sensors in petrol engines, common fuel rail pressure sensors for diesel cars). The sensors could also be used to improve combustion by measuring the exact stoichiometry within the engine cylinders. Tire pressure monitoring systems are also a major auto sensor application. One new automotive application is used in automatic transmissions, new double-clutch transmission systems, and manuals. Bosch recently entered this market with a MEMS solution in which the oil acts directly on the back of the silicon sensor (a so-called backside-entry design) with pressures of up to 70 bar.

In the medical market, pressure sensors are used mostly as low-cost disposable devices for catheters in surgical operations. More expensive versions suit pressure and differential flow monitoring in continuous positive airway pressure (CPAC) machines for treating sleep apnea. There is significant potential for implantable sensors from about 2015 onward.

Within the industrial sector, big segments for MEMS pressure sensors include the heating, ventilation and air conditioning (HVAC) sector, level measurements, and various industrial process and control applications. Aircraft, for instance, use the sensors to monitor engines, flaps and other functions, in addition to precision altitude air pressure measurement.

MEMS pressure sensors to date have not been used as much in the consumer electronics and mobile space, where their revenue is under $50 million today. For the mobile segment in particular, no major application has emerged so far. Among their diverse applications, however, are weather stations, sport watches, bike computers, diving equipment and pedometers, along with white goods — such as water-level sensors employed for energy-efficient washing machines.

See the IHS iSuppli MEMS & Sensors Market Tracker – Bring It On: MEMS Maintains Double-Digit Growth Through 2014 at http://www.isuppli.com/MEMS-and-Sensors/Pages/Bring-It-On-MEMS-Maintains-Double-Digit-Growth-Through-2014.aspx?PRX

IHS (NYSE: IHS) provides market analysis on energy and power; design and supply chain; defense, risk and security; environmental, health and safety (EHS) and sustainability; country and industry forecasting; and commodities, pricing and cost.

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Researchers at the Georgia Institute of Technology have developed a prototype wireless sensor capable of detecting trace amounts of a key ingredient found in many explosives.

The device, which employs carbon nanotubes and is printed on paper or paper-like material using standard inkjet technology, could be deployed in large numbers to alert authorities to the presence of explosives, such as improvised explosive devices (IEDs).

Xiaojuan (Judy) Song, left, and Krishna Naishadham display two types of wireless ammonia-sensing prototype devices. (Georgia Tech Photo: Gary Meek)

“This prototype represents a significant step toward producing an integrated wireless system for explosives detection,” said Krishna Naishadham, a principal research scientist who is leading the work at the Georgia Tech Research Institute (GTRI). “It incorporates a sensor and a communications device in a small, low-cost package that could operate almost anywhere.”

Other types of hazardous gas sensors are based on expensive semiconductor fabrication and gas chromatography, Naishadham said, and they consume more power, require human intervention, and typically do not operate at ambient temperatures. Furthermore, those sensors have not been integrated with communication devices such as antennas.

The wireless component for communicating the sensor information — a resonant lightweight antenna – was printed on photographic paper using inkjet techniques devised by Professor Manos Tentzeris of Georgia Tech’s School of Electrical and computer engineering.  Tentzeris is collaborating with Naishadham on development of the sensing device.  

The sensing component, based on functionalized carbon nanotubes (CNTs), has been fabricated and tested for detection sensitivity by Xiaojuan (Judy) Song, a GTRI research scientist. The device relies on carbon-nanotube materials optimized by Song.

Pictured here are three wireless devices that use carbon nanotubes (CNTs) to achieve high sensitivity to ammonia. At left is a patch antenna, inkjet-printed on photographic paper, with the CNTs shown in black. At top center is an omni-directional segmented loop antenna on a soft substrate, designed for potential 5.8 GHz RFID integration. At bottom right is an inter-digitated capacitor on silicon substrate with CNT loading across the electrodes, being tested for its DC resistance. (Georgia Tech Photo: Gary Meek)

A presentation on this sensing technology was given in July at the IEEE Antennas and Propagation Symposium (IEEE APS) in Spokane, Wash., by Hoseon Lee, a Ph.D. student in ECE co-advised by Tentzeris and Naishadham.  The paper received the Honorable Mention Award in the Best Student Paper competition at the symposium.

This is not the first inkjet-printed ammonia sensor that has been integrated with an antenna on paper, said Tentzeris.  His group produced a similar integrated sensor last year in collaboration with the research group of C.P. Wong, who is Regents professor and Smithgall Institute Endowed Chair in the School of Materials Science and Engineering at Georgia Tech.

“The fundamental difference is that this newest CNT sensor possesses dramatically improved sensitivity to miniscule ammonia concentrations,” Tentzeris said. “That should enable the first practical applications to detect trace amounts of hazardous gases in challenging operational environments using inkjet-printed devices.”

Tentzeris explained that the key to printing components, circuits and antennas lies in novel “inks” that contain silver nanoparticles in an emulsion that can be deposited by the printer at low temperatures – around 100 degrees Celsius.  A process called sonication helps to achieve optimal ink viscosity and homogeneity, enabling uniform material deposition and permitting maximum operating effectiveness for paper-based components.

“Ink-jet printing is low-cost and convenient compared to other technologies such as wet etching,” Tentzeris said.  “Using the proper inks, a printer can be used almost anywhere to produce custom circuits and components, replacing traditional clean-room approaches.”

Low-cost materials – such as heavy photographic paper or plastics like polyethylene terephthalate — can be made water resistant to ensure greater reliability, he added. Inkjet component printing can also use flexible organic materials, such as liquid crystal polymer (LCP), which are known for their robustness and weather resistance.  The resulting components are similar in size to conventional components but can conform and adhere to almost any surface.

Naishadham explained that the same inkjet techniques used to produce RF components, circuits and antennas can also be used to deposit the functionalized carbon nanotubes used for sensing.  These nanoscale cylindrical structures — about one-billionth of a meter in diameter, or 1/50,000th the width of a human hair — are functionalized by coating them with a conductive polymer that attracts ammonia, a major ingredient found in many IEDs.

Sonication of the functionalized carbon nanotubes produces a uniform water-based ink that can be printed side-by-side with RF components and antennas to produce a compact wireless sensor node.  

"The optimized carbon nanotubes are applied as a sensing film, with specific functionalization designed for a particular gas or analyte,” Song said. “The GTRI sensor detects trace amounts of ammonia usually found near explosive devices, and it can also be designed to detect similar gases in household, healthcare and industrial environments at very low concentration levels."

The sensor has been designed to detect ammonia in trace amounts – as low as five parts per million, Naishadham said.  

The resulting integrated sensing package can potentially detect the presence of trace explosive materials at a distance, without endangering human lives. This approach, called standoff detection, involves the use of RF technology to identify explosive materials at a relatively safe distance. The GTRI team has designed the device to send an alert to nearby personnel when it detects ammonia.  
The wireless sensor nodes require relatively low power, which could come from a number of technologies including thin-film batteries, solar cells or power-scavenging and energy-harvesting techniques.  In collaboration with Tentzeris’s and Wong’s groups, GTRI is investigating ways to make the sensor operate passively, without any power consumption.    

“We are focusing on providing standoff detection for those engaged in military or humanitarian missions and other hazardous situations,” Naishadham said.  “We believe that it will be possible, and cost-effective, to deploy large numbers of these detectors on vehicles or robots throughout a military engagement zone.”