Category Archives: MEMS

October 19, 2011 — Nanotech accelerator SVTC Technologies, wet chem equipment maker Amerimade Technology, and chemicals company Shanghai Sinyang Semiconductor Materials will collaborate on electroplating processes for through-silicon via (TSV) that are production-ready for advanced packages and micro electro mechanical systems (MEMS).

By combining a commercialization specialist with tool and materials providers, this partnership will be able to develop new electroplated film processes for TSV in over 95,000 square feet of state-of-the-art cleanroom, staffed 24/7 with SVTC’s engineering team, electroplating toolsets from Amerimade, and chemical formulae from Shanghai Sinyang.

The aim is a commercially viable process for electroplating through-silicon via interconnects that can be ramped up to volume production at advanced packaging houses, semiconductor manufacturers, and MEMS fabrication and packaging facilities.

Shanghai Sinyang Semiconductor Materials Co. Ltd. provides research and development, design, and manufacturing of advanced chemicals for the electronics industry, specifically for semiconductor manufacturing, packaging test and assembly, solar cell manufacturing, and avionics. More information can be found at www.sinyang.com.cn.

Amerimade Technology Inc. designs, manufactures and provides long-term field support for wet chemical processing systems. More information can be found at www.amerimade.com.

SVTC Technologies provides development and commercialization services for innovative semiconductor process-based technologies and products, cost effectively and in an IP-secure manner. More information can be found at www.svtc.com.

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October 19, 2011 — MIT researchers developed a glass-stamp-based technique that helps fabricate lab-on-chip sensors at a lower cost and in a reproducible, simple manner.

A small, voltage-activated glass stamp etches nanoscale patterns onto metallic surfaces in the lab of Nicholas Fang, associate professor of mechanical engineering. Fang’s engravings act as optical antennae that can identify a single molecule by picking up on its specific wavelength. Controlling the optical antenna dimensions tunes the signals the device reports, Fang says.

The glass stamp technique is an alternative to electron-beam (e-beam) lithography for lab-on-chip fabrication. Fabricating a 6mm2 pattern using e-beam litho typically takes half a day and would price them at $600 each, Fang estimates. Nanoimprint lithography, a low-cost technique where polymer forms a pattern, is imprecise, with bumps and dents in the mold. Makers must use more polymer material to fabricate more copies, as the polymer is washed away during processing.

Fang’s team adopted the nanoimprint lithography approach using glass as a molding material instead of polymer. Molten glass is "very malleable and soft," Fang said, noting that the research was inspired by glassblowers. Fang found that glass easily takes a precise shape at the small-scale. Superionic glass, composed partly of ions, can be electrochemically activated.

The researchers filled a small syringe with glass particles and heated the needle to melt the glass inside. They then pressed the molten glass onto a master pattern, forming a mold that hardened when cooled. The team then pressed the glass mold onto a flat silver substrate, and applied 90 millivolts above the silver layer. The voltage stimulated ions in both surfaces, and triggered the glass mold to essentially etch into the metal substrate.

Figure. MIT’s glass stamp reproduces precise, nanometer-scale etchings in silver. The original engraving is 10um wide. Image courtesy of Kyle Jacobs, MIT.

The group was able to produce patterns of tiny dots, 30nm wide, in various patterns (see the figure) at a resolution more precise than nanoimprint lithography, and that can be reused many times.

While the glass-mold etch process is lower cost, it still requires a master metallic pattern that is formed via expensive lithography. Only one master pattern, and one glass stamp, can be used to mass-produce an entire line of the same sensor.

“With this stamp, I can reproduce maybe tens of hundreds of these sensors, and each of them will be almost identical,” Fang says. “So this is a fascinating advancement to us, and allows us to print more efficient antennae.”

The researchers reported the new fabrication process in the Sept. 21 online edition of the journal Nanotechnology. Access it here: http://iopscience.iop.org/0957-4484/22/42/425301

Learn more at http://web.mit.edu.

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October 17, 2011 — In its iPhone 4S teardown, IHS (NYSE:IHS) found "key changes" in the iPhone components. Jim Morrison, product manager at Chipworks, called the iPhone 4S "something of a hybrid" of the iPhone 4 and iPad 2, in his teardown analysis.

Notably, the iPhone 4S uses a 5-lens camera module, which is a first encountered in a smartphone during a IHS iSuppli Teardown Analysis. The 4S camera module is an autofocus device with an 8-megapixel (MP) resolution, compared to 5MP in the iPhone 4 models. Like the iPhone 4, the 4S employs backside illumination (BSI) technology.

Attend the free, on-demand webcast: Lens Tilt in Small Auto-Focus Cameras from DigitalOptics Corporation, a wholly owned subsidiary of Tessera Technologies.

The apps processor is the same dual-core A5 seen in the iPad 2, says IHS, likely along with the same SDRAM memory configuration at 4 Gigabits (Gb). Low memory density is evidence of Apple’s software + hardware efficiency approach to device design, IHS points out. Chipworks is investigating if the A5 is still made by Samsung, or if it has moved to TSMC for 40nm low-power production.

Chipworks is posting de-capsulated die-level images of the iPhone 4S components at http://www.chipworks.com/en/technical-competitive-analysis/resources/recent-teardowns.

A cellular radio makes the iPhone 4S a "true world phone," said Wayne Lam, senior analyst at IHS. iPhone 4S merges the HSPA and CDMA radio capabilities found separately in the two previous iPhone 4 models into a single product that can address global wireless networks. No other handset OEM produces a single device for multiple operators and for multiple geographies on this scale, making the phone operational with AT&T, Verizon, and Sprint carriers. Changes to the radio design include the use of an updated Qualcomm baseband processor, the MDM6610.

The baseband processor is now discrete, no longer integrated with the RF transceiver (which is a dual-mode Qualcomm RTR8605). The IHS iSuppli Teardown Analysis Service has seen this RF set-up in other handset designs, such as the Hewlett-Packard Veer and HTC Thunderbolt.

The 4S also likely makes use of three different power amplifier module (PAM) module suppliers: Avago, Skyworks and TriQuint, a jump from the iPhone 4 CDMA version where only Avago appeared. Both Skyworks and TriQuint were featured in the HSPA/GSM version of the iPhone.

See IHS’s table of iPhone 4S components here.

IHS iSuppli soon will reveal the results of its full physical teardown that will provide actual data on iPhone 4S components and features. IHS (NYSE: IHS) provides research and analysis on energy and power; design and supply chain; defense, risk and security; environmental, health and safety (EHS) and sustainability; country and industry forecasting; and commodities, pricing and cost. Learn more at www.ihs.com.

Chipworks provides reverse engineering and patent infringement analysis of semiconductors and electronic systems. Learn more at www.chipworks.com, or read Chipworks Real Chips by blogger Dick James.

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October 14, 2011 — Panorama Synergy Ltd (ASX:PSY) has formed an exclusive worldwide licensing agreement with the University of Western Australia (UWA) for optical technologies related to highly sensitive measurements by multiple, simultaneous micro-cantilever micro-electro-mechanical system (MEMS) sensors.

The MEMS under UWA development could be manufactured in more compact, portable sizes, said John Athans, Panorama Synergy chairman. The low-cost chips can be built with multi-system, multi-analyte sensors.

UWA was awarded an ARC grant to develop this technology. Under the licensing agreement, Panorama Synergy has rights up to 75% share on products and 50% share on sublicences.

Two complete patent applications covering this technology have been lodged in the USA and Australia. In addition PSY has lodged in Australia a provisional patent application for a variant technology that offers additional capabilities.

Optical cantilever technology in miniaturized biological and chemical sensing can be used for medical, security, gas detection, and other applications. Athans said the licensing agreement with UWA could bring "significant commercial opportunities for Panorama Synergy."

Panorama Synergy Limited (ASX:PSY) develops and commercializes photonics breakthroughs for multiple applications. For additional information, visit the Panorama Synergy website www.panoramasynergy.com.au

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October 14, 2011 – Marketwire — mPhase Technologies Inc. (OTCBB:XDSL) was granted access to the technical facilities at the Center for Nanoscale Materials (CNM), Argonne National Labs for user-initiated nanoscience & nanotechnology research. mPhase will optimize its micro electro mechanical system (MEMS) Smart silicon membrane, a key component of the mPhase Smart NanoBattery and other potential smart surface applications.

mPhase Smart NanoBattery design uses electrowetting and microfluidic techniques to selectively activate and control the power generated by the cells in the reserve battery. mPhase’s goal is to design batteries with long shelf life, high availability and other programmable factors, said mPhase CEO, Ron Durando.

mPhase will conduct technical analysis and refinement of its smart surfaces technology using Argonne’s sophisticated laboratory tools, which are not readily available to small businesses The CNM nanoscience & nanotechnology research program provides access to capabilities for design, synthesis, characterization, and theory & modeling of nanoscale phenomena, enabling development of functional nanoscale systems.

Also read: mPhase touts progress for nanobattery polymer coating

mPhase Technologies Smart Surface technology combines nanotechnology, MEMS processing and micro fluidics for applications in drug delivery systems, lab-on-a-chip analytic systems, self-cleaning systems, liquid and chemical sensor systems, and filtration systems. More information about the company can be found at http://www.mPhaseTech.com.

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October 14, 2011 — The COWIN project is a European Commission (EC) initiative under FP6 and FP7 European research projects for smart nano and micro technologies benefiting diagnostic and medical applications. The 3-year project has a January 2012 closing for micro and nano bioconvergence systems’ research projects.

Smart technology and sensors interact with environments and act on the data collected. Diagnostic and life science applications for smart systems saw an estimated 14% growth in 2009, and became a $1.5 billion market in 2010, according to Yole Développement. The European Commission expects smart sensors to grow in the life sciences field like they have taken off in smartphone applications. Uses include earlier in vivo and in vitro diagnosis of diseases, better medical devices, quality control in the agro-food industry, and environment safety.

Figure. Microsystem devices for healthcare applications, 2009-2015 (US$ million). SOURCE: Yole, September 2011.

In this context, part of the current FP7 European Call closing in January 2012 is especially dedicated to micro and nano bioconvergence systems’ research projects driven by applications’ requirements. Results of such R&D projects are expected to bring key differentiation to support the market penetration of smart systems in the Life Science field. A budget of 39 M€ is dedicated to this topic.

Also read: European competitiveness in miniaturized smart systems

The European Commission is also facilitating the access to advanced smart systems technologies through the COWIN action that extracts and promotes the best of the European FP6 and FP7 R&D projects’ results. It includes in particular for biological applications:

  • Fully integrated detection platform
  • Chemical and gas smart sensors with higher specificity and sensitivity
  • Innovation process for cartridge production
  • Newly solution for reagents integration
  • Data transmission monitoring
  • Innovation in sensors for Body Area Network (BAN)
  • Innovative sensors for medical imaging
  • Innovative robotics and surgical tools.

Large companies, but especially SMEs and start-up companies, are strongly encouraged to take benefit of the European Commission’s support to optimize their access to this promising innovation, reduce their time to market and strengthen their leadership in their targeted markets.

COWIN is a support action launched under the 7th framework Program for 3 years to strengthen the European competitiveness in miniaturized smart systems. Learn more at www.cowin4u.eu.

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October 13, 2011 – BUSINESS WIRE — X-FAB Silicon Foundries Group and Senodia Technologies (Shanghai) Co., Ltd will ramp production of micro electro mechanical system (MEMS) gyroscopes for high-volume consumer applications, following a successful development phase.

Senodia is a commercial MEMS supplier designing and packaging gyroscopes in China. It recently raised its production capacity to more than 2.5 million MEMS gyroscope chips per month.

Pure-play MEMS foundry X-FAB is the front-end manufacturing partner, leveraging its open-platform inertial sensor process. Senodia will then use sensor devices manufactured by X-FAB to produce single-axis and 3-axis gyroscopes. Target products include smartphones, tablets, camcorders, gaming controllers, TV remotes, toys, vehicles, and medical instruments.

Bo Zou, Chairman and CEO of Senodia said, "We chose to work with X-FAB because of its high-performance process technology that enables us to develop products very rapidly and cost-effectively for the market place. X-FAB’s open platform inertial sensor process was immediately available and ready to use for realizing our designs. With X-FAB’s experience as a high-volume MEMS foundry, and our expertise and commitment to help customers develop their MEMS gyroscope applications, we believe Senodia is at the forefront of serving the world’s ever-increasing market demand for MEMS gyroscopes in consumer electronics."

Senodia Technologies (Shanghai) Co. Ltd is a commercial MEMS Gyroscope sensor supplier in China, founded in August 2008.

X-FAB is an analog/mixed-signal foundry group manufacturing silicon wafers for analog-digital integrated circuits (mixed-signal ICs). X-FAB maintains wafer production facilities in Erfurt and Dresden (Germany); Lubbock, Texas (US); and Kuching, Sarawak (Malaysia); and employs approximately 2,400 people worldwide. For more information, please visit www.xfab.com.

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by Barnett Silver, SVP and principal, ATREG

October 13, 2011 – SEMICON Europa got off to a strong start on Monday (10/11) and continued in full swing on Tuesday (10/12). Occupying most of the Messe Dresden, the show has dozens of exhibitors and hundreds of attendees. Some of the most prominent exhibitors on the floor are large firms such as DB Schenker and AMAT, as well as the regional economic agencies. Silicon Saxony is strategically located near the hall entrance with a huge exhibit. New York also has a large presence. The German research institute Fraunhofer also has a large booth highlighting its many interrelated activities in the semiconductor industry.

The overall mood on the show floor is optimistic, yet cautious — not the abysmal gloom of the SEMICON shows in late 2008 and early 2009. While many firms acknowledge that the industry is in the midst of a correction, most people think or hope it will be mild, and see the industry back on a strong growth track by mid-2012.

Today, the exhibition space is full and crowds are robust. However, in discussions with several tool brokers and resellers, there is a definite consensus that demand for 200mm tools is slowing down. Having said that, that view is not entirely universal and some still see continued solid demand for equipment. Slowdown or not, the opportunity to acquire semiconductor assets on the cheap continues to prove irresistible.

The sessions held at the conference run on a diverse set of mostly technical topics. The program on 450mm wafer production was particularly well attended by many participants who seem to want to understand more about it out of curiosity rather than a need inside their organization to start developing the technology. The consensus view is that only a handful of companies such as Intel, Samsung, or TSMC can possibly afford to develop 450mm production. MEMS is another key focus of the show, with many participants interested in this growing sub-segment of the semiconductor business.

Overall, SEMICON Europa 2011 is a well-attended and vibrant conference, illustrating the continued importance of the semiconductor industry to Europe.

Barnett Silver is SVP and principal of ATREG Inc., a Seattle-based advisory firm to the global semiconductor industry providing objective market analysis, strategic advice, and transaction execution expertise for the disposition and acquisition of operational assets. His background includes mortgage banking and investment banking/debt capital markets. For more information, visit www.atreg.com.

October 12, 2011 – BUSINESS WIRE — CTS Electronic Components, of CTS Corporation (NYSE:CTS), received 2 production orders for piezoceramic products from a major US sonar manufacturer. Revenues should total about $5 million.

First deliveries will begin in early 2012.  

The new programs will increase in CTS’ global piezo market share. CTS uses specialized technology and processing for its piezoceramics. Applications include sonar arrays as well as hard disk drive actuation, medical instruments, flight components, hydrophones for energy exploration, and industrial products.

CTS Electronic Components provides engineered electronic components used in communications, medical, defense and aerospace, industrial and computer applications for OEMs and Contract Manufacturers worldwide. Visit the CTS Piezoelectric Materials website at www.ctscorp.com/components/PZT/.

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October 12, 2011 — The University of Houston College of Optometry is using MEMS-based deformable mirrors, Multi-DM, from Boston Micromachines Corporation (BMC) in glaucoma research.

The mirror package, with 140 actuators and low inter-actuator coupling, will be used with wavefront sensorless adaptive optics to image living human eyes. The University of Houston College of Optometry built an Adaptive Optics Scanning Laser Ophthalmoscope (AOSLO) that uses an iterative stochastic parallel gradient descent (SPGD) algorithm to directly control the 140 actuators, maximizing the mean intensity in the acquired retinal images. The DMs are capable of up to 5.5µm stroke and 100kHz frame rate, boasting sub-nm step size and zero hysteresis.

The research goal is to determine earlier structural markers for glaucoma at the site of initial damage in the optic nerve head, explained Jason Porter, assistant professor at the University of Houston College of Optometry.  The high actuator count in BMC’s MEMS mirror enables higher-order aberration correction for the researchers. The researchers have used BMC mirrors in previous retinal imaging projects.

Sensorless imaging will provide higher-contrast images of dilated pupils than sensor-based adaptive optics. The lower light requirement of sensorless imaging is beneficial to light-sensitive patients, such as those with rhodopsin disorders in retinitis pigmentosa. Sensorless control also allows direct optimization of the fluorescence signal in autofluorescence imaging.

Boston Micromachines Corporation (BMC) provides advanced microelectromechanical systems (MEMS) mirror products for use in commercial adaptive optics systems, and custom-designed manufacturing services. For more information, visit www.bostonmicromachines.com.

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