Category Archives: MEMS

October 12, 2011 — SEMI’s annual semiconductor silicon shipment forecast provides an outlook for silicon demand for 2011-2013.

SEMI recorded that polished and epitaxial silicon shipments will hit 9,131 million square inches (MSI) in 2011, 9,529 MSI in 2012, and 9,995 MSI in 2013 (table). Silicon wafers are the basis of virtually all semiconductors and MEMS, and epi-wafers are the basis of products like LEDs.

While the market has currently softened, early-2011 momentum will carry the year’s semiconductor silicon sales to a higher total than 2010, said Stanley T. Myers, president and CEO of SEMI, noting the figures are an industry record. Growth will continue at "modest levels" through 2013.

Table. 2011 silicon forecast, total Si slices excluding non-polished. SOURCE: SEMI, October 2011.
  2009 2010 2011 2012 2013
Millions of square inches (MSI) 6,554 9,121 9,131 9,529 9,995
Annual growth (%)  -17 39 0 4 5

Also read SEMI’s report from August 2011, Silicon wafer shipments ride out Japan disaster

The data are inclusive of polished silicon wafers, including virgin test wafers, and epitaxial silicon wafers shipped by wafer manufacturers to semiconductor end-users.

SEMI is a global industry association serving the nano- and microelectronic manufacturing supply chains. For more information, visit www.semi.org.

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October 11, 2011 — With navigation features becoming standard in smartphones, tablets, and gaming devices, the market for electronic compasses is set to grow 73% this year to $419.1 million, according to a new IHS iSuppli MEMS & Sensors special report on magnetic sensors.

The 73% growth in 2011 is on top of an "explosive" 186% rise last year. By 2015, revenue will reach $842.2 million, IHS reports, growing more than 3x over 2010 numbers.

Electronic compasses are a "natural" complement to GPS navigation, adding intuitive features for the user, like map rotation and camera-based point-of-interest information, said Jérémie Bouchaud, principal analyst, MEMS & Sensors for IHS. Advanced applications use 9-axis sensor fusion, connecting the compass with a device’s accelerometer and gyroscope to reduce inaccuracies in each sensor. Bouchard notes that electronic compasses have become a "standard feature" in smartphones thanks to Apple’s electronic compass integration in the iPhone 3GS.

Electronic compasses also benefit from gaming device integration, such as the Sony Move controller for the PlayStation 3. The next-generation Nintendo Wii controller will feature 3 sensors.

Military applications include single-axis discrete compasses for high-performance navigation. This is a small — <100,000 units — but lucrative — each unit sells for several hundred dollars — market. The total market is worth about $24 million.

The top electronic compass producer is Japan’s AKM Semiconductor Inc., followed by Aichi Steel, Yamaha Corp. and Alps Electric Co. Ltd., all Japanese. (Click here for info on electronic compass producers following the March 11 Japan earthquake.) European STMicroelectronics is also in the top 5. In the US, Memsic Inc., Honeywell International Inc. and Freescale Semiconductor Inc., are top players. Also watch South Korea’s Amotech and Spanish startup Baolab Microsystems.

Access the IHS iSuppli report, Digital Compasses Pick Up Reins of Magnetic Sensor Market, at http://www.isuppli.com/MEMS-and-Sensors/Pages/Digital-Compasses-Pick-up-Reins-of-Magnetic-Sensors-Market.aspx?PRX

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October 11, 2011 – PRNewswire — MEMS supplier STMicroelectronics (NYSE:STM) has implemented through-silicon vias (TSV) in high-volume micro electro mechanical system (MEMS) devices. ST is using TSV in its smart sensors and multi-axis inertial modules.

The leading-edge packaging technology creates short vertical interconnects instead of wire bonds in ST’s multi-chip MEMS devices.

ST’s Benedetto Vigna, corporate VP and GM of ST’s Analog, MEMS and Sensor Group, reports that its high-volume MEMS packages using TSV are smaller, suiting the needs of consumer products integrating MEMS, such as smartphones.

STMicroelectronics has been producing high-volume MEMS devices for the consumer electronics sector for 5 years. More than 1.6 billion ST MEMS chips has been sold to date.

Also read: MEMS motion sensors’ continuing evolution in commercial markets by Jalinous (Jay) Esfandyari, STMicroelectronics, in association with MEMS Industry Group (MIG)

STMicroelectronics supplies semiconductors for multimedia convergence and power applications. Further information on ST can be found at www.st.com.

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October 11, 2011 — EQT III today announced that it has alongside with management agreed to sell VTI Technologies (“VTI”), the world’s largest independent designer and manufacturer of high-performance MEMS sensors, to the publicly listed Japanese electronic components company Murata Manufacturing (“Murata”).

EQT III acquired VTI from Breed Technologies Inc. in June 2002 and VTI has since then increased sales by more than 75%. Substantial investments in research and development during EQT III’s ownership have enabled VTI to further strengthen its position in acceleration sensors for automotive safety systems and selected medical applications as well as expand into new segments, such as consumer electronics. The recently launched new products, including the new generation sensor for the transportation segment and three-axis gyroscope for consumer electronics applications, will be key growth drivers for VTI going forward.

Murata Manufacturing is a worldwide leader in the design, manufacture and sale of ceramic-based passive electronic components and power supply modules. With annual revenues of ¥618 billion (approx. EUR 6 billion), Murata is committed to the development of advanced electronic materials and leading edge, multi-functional, high-density modules. Murata has employees and manufacturing facilities throughout the world. The combination of VTI and Murata is industrially very strong and complementary both with regards to product portfolios and exposure to different end markets.

“Great results have been achieved together with VTI management and we believe that VTI is now ready for its next growth phase with a new owner. We are confident that Murata, with its advanced technological profile, will be a good platform for VTI ‘s future development”, comments Johan Hähnel, EQT III press spokesperson.

“EQT III has been a supportive owner and provided VTI with valuable resources and expertise throughout its ownership. We believe VTI and Murata have a strong strategic fit and are excited about the opportunity of combining VTI’s product development and manufacturing competence with Murata’s well-built customer base and technological know-how”, says Markku Hirvonen, President and CEO of VTI.

Closing of the transaction is subject to approvals from competition authorities and is expected to take place in less than six months from now. 
 
EQT is the leading private equity group in Northern Europe with close to EUR 18 billion in raised capital and multiple investment strategies. Together with a superior network of Industrial Advisors, EQT implements its business concept by acquiring or financing good medium-sized to large companies in Northern and Eastern Europe, Asia and the United States, developing them into leading companies. Development is achieved by applying an industrial strategy with focus on growth. Since inception, EQT has invested more than EUR 10.5 billion in around 100 companies and exited close to 50. EQT-owned companies have more than 550,000 employees.

EQT Partners, acting as investment advisor to the managers of each EQT fund, has around 120 investment professionals with an extensive industrial and financial competence. EQT Partners has offices in Copenhagen, Frankfurt, Helsinki, Hong Kong, Oslo, London, Munich, New York, Shanghai, Singapore, Stockholm, Warsaw and Zurich.

More information can be found on www.eqt.se (http://www.eqt.se/)

VTI Technologies Oy is a leading supplier of acceleration, inclination and angular motion sensor solutions for transportation, medical, instrument and consumer electronics applications. In their end-use applications, VTI’s products improve safety and quality of life. The silicon-based capacitive sensors are based on the company’s proprietary 3D MEMS (Micro Electro-Mechanical System) technology. The company had net sales of EUR 75.8 million in 2010.

Murata Manufacturing Co., Ltd. is a worldwide leader in the design, manufacture and sale of ceramic-based passive electronic components and power supply modules. With annual revenues of ¥618 billion, Murata is committed to the development of advanced electronic materials and leading edge, multi-functional, high-density modules. The company has employees and manufacturing facilities throughout the world.
 
EQT III is part of the leading private equity group known as EQT which consists those funds and managers who are advised directly or indirectly by EQT Partners and/or its subsidiaries.

October 11, 2011 – StockMarketWire.com — IQE released a customizable range of silicon on insulator (SOI) products that IQE reports afford improved thickness and doping control.

The SOI wafers can be used in micro electro mechanical systems (MEMS), microprocessors, high-voltage devices, and other microelectronics. SOI can offer better parasitic device capacitance and resistance to latch-up than bulk silicon. Its mechanical properties can improve etch-stop in MEMS manufacturing, particularly for complex designs.

IQE Silicon Ltd is debuting the product range allowing customers to tune the SOI parameters to their own specifications in terms of doping type and device layer thickness. The customized SOI orders can be fabricated as small as 50 wafers for prototyping and niche operations.

IQE supplies advanced epi-wafers, supported by an outsourced foundry services portfolio, to major semiconductor manufacturing companies. Learn more at http://www.iqep.com/.

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October 10, 2011 – Imec says it has developed a fT/fMAX 245GHz/450GHz SiGe:C heterojunction bipolar transistor (HBT) device, useful for future high-volume millimeter-wave low-power circuits in auto applications as well as silicon-based millimeter-wave circuits used in imaging systems for security, medical, and scientific apps.

Working within a EU joint research project dubbed "DOTFIVE" seeking to keep Europe ahead of the ITRS in RF applications beyond compound semiconductors, these new SiGe:C HBT devices have a fully self-aligned architecture by self-alignment of the emitter, base and collector region, and implement an optimized collector doping profile, imec says. Their high density and low-cost integration vs. III-V HBT alternatives makes them suitable in consumer applications as well. Other potential areas of use include applications requiring very high frequencies with low power dissipation, or requiring better circuit reliability through lessened process/voltage/temperature variations.

Electrical parameters for a 0.15×1.0μm2 HBT device. (Source: IMEC)

To scale up new SiGe:C HBTs, thin sub-collector doping profiles are generally believed to be mandatory, usually introduced early in device processing and thus exposed to high thermal budgets, which complicates accurate positioning of the buried collector, imec explains. In-situ arsenic doping during the simultaneous growth of the sub-collector pedestal and the SiGe:C base creates a thin, well-controlled, lowly-doped collector region close to the base, as well as a sharp transition to the highly doped collector without further complicating the process. The result is "a considerable increase of the overall HBT device performance," imec says: peak fMAX values >450GHz (on devices with high early voltage), a 1.7V BVCEO, and "sharp transition from the saturation to the active region in the IC-VCE output curve." Even with the aggressively-scaled subcollector doping profile, collector-base capacitance "did not increase much," the group says, and current gain averaged around 400 with limited emitter-base tunnel current (visible at low VBE values).

Cross-section of bipolar HBT device in a B-E-B-C configuration after end-of-line processing. (Source: IMEC)

October 10, 2011 – Imec says it has built an integrated poly-SiGe-based piezoresistive pressure sensor on top of 0.13μm copper backend CMOS, the first such device directly fabricated above its readout circuit and the first poly-SiGe MEMS device of any kind processed on top of Cu-backend CMOS.

The MEMS-last approach for CMOS-MEMS monolithic integration leads to smaller die areas and allows use of standard foundry CMOS processes. Poly-SiGe as a new MEMS structural material (vs. for example CMOS top interconnect layers to fabricate the MEMS device) offers more flexibility since the MEMS fabrication and CMOS fabrication can be completely decoupled, imec explains. Aggressive scaling has pulled the technology away from aluminum interconnects and toward copper metallization with its lower resistivity and improved reliability.

The new integrated sensor, fabricated at imec in 0.13μm standard CMOS, incorporates a surface-micromachined piezoresistive pressure sensor, with a poly-SiGe membrane and four poly-SiGe piezoresistors, and an instrumentation amplifier, with Cu- interconnects (two metal layers), oxide dielectric, and tungsten-filled vias. Maximum processing temperature of the complete sensor (including poly-SiGe piezoresistors) was kept below 455°C, and "an appropriate passivation layer" was added to protect against the aggressive MEMS etch and deposition processes. The CMOS circuit "showed no significant deterioration after the MEMS processing," and even with the lower processing temperature, the sensor by itself (250×250μm2) showed ~2.5mV/V/bar sensitivity; the integrated device on top of the Cu-based amplifier showed ~64× higher sensitivity (~158 mV/V/bar).

Cross-section SEM picture of the integrated sensor. At the bottom, the two Cu metal lines of the CMOS circuit can be observed. Above, the MEMS layers (poly-SiGe membrane and piezoresistors, oxide sealing layer, and metal interconnects) are visible. (Source: IMEC)

October 7, 2011 – ACN Newswire — To encourage productivity, Singapore has launched the Manufacturing Productivity Technology Centre (MPTC) at the Singapore Institute of Manufacturing Technology (SIMTech), a research institute of the Agency for Science, Technology and Research (A*STAR).

GlobalFoundries has signed a 5-year Manufacturing Productivity Enhancement master plan agreement with SIMTech, and 7 other companies have signed memoranda of understanding to initiate productivity improvements. SIMTech and GLOBALFOUNDRIES Singapore Pte Ltd’s work will enable the full-service semiconductor foundry to apply cutting-edge productivity improvement technologies and strategies: Automated Guided Vehicles (AGV) to automate the movement of wafers in the fabs; implementing precision inspection capability into the fabs’ existing inspection tools; exploring the potentials of recycling materials and refurbishment of fab tools; and adopting RFID technology for more efficient production tracking.

Also read: A*STAR, GLOBALFOUNDRIES collab on MEMS capacitive sensor tech

The MPTC offers SIMTech-developed technologies, tools and capabilities in automation, processes and systems. Companies can use the center to identify productivity gaps and develop or adopt technologies to fill them. Professionals, managers, executives and technicians (PMETs) will have access to training on these technologies in an interdisciplinary environment. The Centre houses prototypes, implemented systems, and other supporting products that create enhanced efficiency, effectiveness, and value. The new Centre will share success stories of partner companies that have realized productivity gains of up to 100%.

One sample productivity tool is Manufacturing Energy MOnitoring (MEMO), a software system from SIMTech that automatically tracks machine power usage in a fab and enables manufacturers to reduce energy wastage and suboptimal power usage settings. A precision engineering components manufacturing enterprise that has experimented with the software has demonstrated that energy savings of up to 50% is feasible.

The Centre will also facilitate interdisciplinary research on manufacturing productivity/training, said Dr Lim Ser Yong, SIMTech executive director. The goal is to share this task among partnerships, knowledge transfer and technology transfer.

For the personnel training aspect, SIMTech collaborated with the Singapore Workforce Development Agency (WDA) to implement the new Singapore Workforce Skills Qualifications (WSQ) Operations MaNagement and Innovation (OMNI) Programme. This enhanced programme rides on the success of the WSQ SME Manufacturing Excellence (S.M.E.) Programme launched in 2010, which has trained 47 managers from 26 companies that then raised productivity from 30% to 230%.

OMNI Programme was enhanced and customized to address the operational challenges of different manufacturing industries. Funding support (a grant of up to 50% of implementation costs) is now available to companies implementing operations improvement strategies.

The Singapore Institute of Manufacturing Technology (SIMTech) is a research institute of the Science and Engineering Research Council (SERC) of the Agency for Science, Technology and Research (A*STAR). SIMTech develops high-value manufacturing technology and human capital to contribute to Singapore’s competitiveness. For more information, please visit www.SIMTech.a-star.edu.sg and to learn more about A*STAR, visit www.a-star.edu.sg.

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October 6, 2011 — InvenSense Inc. founder and CEO Steve Nasiri will deliver a keynote "MotionTracking – Driving Hi-Impact Motion-Based Applications in the Digital World" at Semicon Europa‘s International MEMS Forum on October 10, 2011 in Dresden, Germany.

Nasiri will cover the key market drivers for the emerging motion interface market and discuss market needs for an integrated MotionTracking Module offering a true motion interface. He will share the key principals of motion interface technology and define the main benefits for consumer electronics. These include one-to-one motion control, motion gesture commands, device pointing recognition capability, and indoor navigation. Current market challenges with the complexity of integrating multiple discrete motion sensor devices, such as 3-axis accelerometer, 3-axis gyroscope, 3-axis compass and pressure sensors, will be examined. The speech will also touch on algorithm development for sensor fusion.

Steve Nasiri is a 30 year veteran of the MEMS industry. He is the founder of InvenSense and has served as president, CEO and chairman since 2003. Prior to founding InvenSense, Nasiri held various positions as a co-founder and executive of several MEMS companies, including SenSym (acquired by Honeywell), NovaSensor (acquired by General Electric), Integrated Sensor Solutions (acquired by Texas Instruments), and ISS-Nagano GmbH. He also held key management and operations positions at National Semiconductor, Fairchild Semiconductor, and Maxim Integrated Products. Nasiri’s name is on over 50 patents and patent applications, many published papers, and articles on MEMS technology.

InvenSense provides "MotionProcessing" for the consumer electronics market. More information can be found at http://www.invensense.com.

SEMI is a global industry association serving the manufacturing supply chains for the microelectronic, display, and photovoltaic industries. For more information, visit www.semi.org.

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October 6, 2011 – PRWEB — Inkjet printheads are the largest selling micro electro mechanical systems (MEMS) devices, and the mature market should exhibit limited growth, compared to smaller segments of the MEMS market. Digital imaging is the key inkjet head driver. The global market for inkjet heads is forecast to reach $1.8 billion by 2017, according to "Inkjet Heads: A Global Strategic Business Report" from Global Industry Analysts (GIA).

Digital cameras, cameraphones, and other digital imaging devices are pushing an increased need for printing digital photos. Digital imaging is driving print quality and print speed improvements, and demanding these advances at low costs. This forces inkjet head makers to develop advanced, sophisticated technologies for new products. Consumers — small home printers, retail, digital photo printers, etc. — are the biggest user group for inkjet heads.

Demand is growing faster in the industrial sector, with 3.6% CAGR during the analysis period. Inkjet heads deposit small drops of any kind of fluid (both inks and non-inks) in a precise, well-defined, and repeatable format. These applications include printing of electronic deposition, microfabrication of three-dimensional structures, and microdispensing for biological applications.

New and emerging industrial-sector applications also grow the inkjet head market. Printed electronics are still a nascent field for inkjet heads, GIA notes, with more development work needed. This sector could evolve to produce electronics at a fraction of the cost for conventional chips and solar panels.

Other emerging applications for inkjet heads include biomedical, retail kiosk systems, and inkjet in large companies.

The US is the world’s biggest consumer of inkjet heads, GIA reports. Europe is the next largest region. The fastest growing market for these products is the Asia-Pacific region, posting a compound annual growth rate (CAGR) of more than 5.0% through 2017.

Inkjet heads are produced in a highly consolidated market, with only a handful companies dominating the scene. Major players profiled in the report include Canon Inc., Eastman Kodak Company, FUJIFILM Dimatix Inc., Hewlett-Packard Company, Lexmark International, Inc., Olivetti S.p.A., Ricoh Printing Systems, Seiko Epson Corp., STMicroelectronics, Xaar Plc., among others.

"Inkjet Heads: A Global Strategic Business Report" provides a comprehensive review of the Inkjet Heads markets, current market trends, key growth drivers, the Different types of Inkjet Heads available in the market, competitive scenario, recent product launches, recent industry activity, and profiles of major/niche global as well as regional market participants. The report provides annual sales estimates and projections for Inkjet Heads market for the years 2009 through 2017 for the following geographic markets – US, Canada, Japan, Europe, Asia-Pacific, the Middle East, and Latin America. The report also analyzes the market by the following end-use markets – Consumer market, and Industrial markets. Also, a six-year (2003-2008) historic analysis is provided for additional perspective. Obtain the report at http://www.strategyr.com/Inkjet_Heads_Market_Report.asp

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