Category Archives: MEMS

August 31, 2011 – WEBWIRE — CellGuide selected Baolab’s 3D NanoCompass IC technology as a companion to its location and positioning products, fully integrating GPS and compass functionalities in the CLIOX-C.

Baolab’s electronic 3-axis CMOS MEMS NanoCompass technology for the CLIOX-C will mark the first order for Baolab’s NanoEMS technology, nanoscale micro electro mechanical systems (MEMS) packaged within the standard metal structure of a CMOS wafer using standard, high-volume CMOS manufacturing lines. This enables them to be made an order of magnitude smaller than existing techniques of building MEMS on the surface of the wafer and cost less. The MEMS technology can reduce the cost of a compass by up to two thirds.

Also read: Record MEMS revenues thanks to smartphone/tablet adoption

The GPS and compass functionalities can operate together or be accessed independently by the host device’s application processor, improving power management, CellGuide reports. The combination creates point-and-identify augmented reality for mobile devices, tablets, and cameras. The compass function provides immediate tunnel-exit and dead-reckoning features for intermittent GPS signal compensation and other "challenging situations," said Adina Shorr, CellGuide CEO.

The nanoscale MEMS manufacturing technique encourages MEMS sensor integration in more high-volume, consumer electronics, pointed out Dave Doyle, Baolab CEO.

Baolab Microsystems has developed an innovative technology called NanoEMS that enables MEMS to be created inside the CMOS wafer using standard manufacturing techniques. To learn more about Boalab’s NanoEMS technology and products, visit www.baolab.com/compass.htm.

CellGuide is a fabless semiconductor, IP licensing and design services company, providing leading performance multi-beacon positioning solutions for consumer devices. Learn more at www.cell-guide.com.

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August 31, 2011 — The market for consumer/mobile micro electro mechanical systems (MEMS) is growing to record heights, thanks to integration into smartphones and tablets, according to the latest IHS iSuppli Consumer & Mobile MEMS Market Tracker report.

Revenue for consumer and mobile MEMS will hit $2.25 billion in 2011, growing a record 37%. This segment, which grew 27% in 2010 to $1.64 billion, is the largest sector of MEMS products. IHS expects the mobile and consumer MEMS sector to reach $4.54 billion in 2015, giving it a compound annual growth rate (CAGR) of 22.5% (see the above figure).

MEMS revenue for handsets will reach $1.21 billion, approximately 50% of the total consumer and mobile MEMS space. Gaming follows with $221.49 million in revenue (a decline from 2010), followed by media tablets with $158.64 million (up 331% year-over-year). Tablets will overtake gaming next year.

Accelerometers and gyroscopes provide intuitive motion-based displays; MEMS microphones improve auditory performance; bulk acoustic wave filters facilitate wireless Internet access, said Jérémie Bouchaud, director and principal analyst for MEMS and sensors at IHS, explaining how MEMS enable the smartphone/tablet functionality. Tablet/smartphone adoption is rising, and MEMS adoption into these devices is increasing, creating this record growth rate in 2011.

A new class of emerging MEMS sensors — thermopiles, varactors, timing devices, pressure sensors for indoor navigation, radio frequency MEMS switches and actuators used for autofocus functions in high-megapixel cameras and pico projectors — will further this trend and increase MEMS content in consumer devices.

Accelerometers will generate the most revenue for consumer and mobile MEMS in 2011. Gyroscopes will generate the second-highest revenue.

The 3-axis MEMS gyroscope, when used in conjunction with an accelerometer and a digital compass, allows for more accurate, smoother and faster motion sensing for applications such as gaming and augmented reality. Revenue in 2011 for 3-axis gyroscopes will soar to $420 million, up from $127 million last year. The 3-axis gyroscope can be found in smartphones such as the iPhone 4 from Apple Inc. and the Galaxy SII from Samsung Electronics Co. Ltd.; in virtually all tablet devices, including the Apple iPad 2 and the Samsung Galaxy Tab; as well as in gaming devices like the PlayStation Move motion controller from Sony Corp.

Two new MEMS devices were introduced in 2011: a new type of joystick from Knowles Electronics, the leading manufacturer of MEMS microphones and a Texas Instruments thermopile or contactless temperature sensor. The MEMS joystick forgoes optical or magnetic sensors, is slimmer and less power-hungry for gaming accessories for handsets and tablets, IHS believes. The thermopile can be placed into a phone or tablet next to the processor to help with thermal management for optimal performance.

To learn more about the latest developments in the MEMS market, see the IHS iSuppli report: "Consumer MEMS Market Outdoes Itself Again in 2012 with 37% Growth."

IHS (NYSE: IHS) is the leading source of information and insight in critical areas that shape today’s business landscape, including energy and power; design and supply chain; defense, risk and security; environmental, health and safety (EHS) and sustainability; country and industry forecasting; and commodities, pricing and cost. 

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August 31, 2011 — Ziptronix Inc. has licensed use of its oxide bonding technology for backside illumination imaging sensors patents to Sony Corporation.

ZiBond low-temperature bonding is covered in US Patents 6,902,987, 7,041,178, 7,335,572, and 7,387,944.

Oxide bonding, which Ziptronix patents under the ZiBond trademark, enables low distortion in backside illumination imagers. ZiBond improves yields and costs by allowing pixels to be scaled smaller, resulting in more die per wafer, said Dan Donabedian, CEO of Ziptronix Inc.

The oxide bonding process can be applied to imaging modules for digital still and video cameras, cell phone cameras, automotive sensors, and pico projectors and other projection systems. A digital camera with 5 megapixels (MP) could be converted to 16MP using Ziptronix’s patented technology.

The ZiBond technology changes how image sensors receive light, improving rendering, as well as power consumption, in consumer applications, said Donabedian.

The market for image sensing products is expected to exceed $16 billion cumulative over the next four years, Ziptronix reports.

Last year, Ziptronix accused Omnivision and TSMC of violating its proprietary low-temp oxide bonding patents.

Ziptronix Inc. develops low-temperature oxide bonding technology for advanced semiconductor applications. URL: http://www.ziptronix.com

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August 30, 2011 – SEMICON Taiwan (Sept. 7-9) approaches, the island’s most celebrated event for microelectronics manufacturing, coorganized by SEMI and the Taiwan External Trade Development Council (TAITRA), offers more than 60 programs and sessions and 550 exhibitors spanning the entire semiconductor value chain and related high-growth industries.

A "Market Trend Forum" will host five industry analysts with their takes on future trends in semiconductor markets from up and down the value chain: foundries, DRAM, packaging, and equipment/materials.

The SiP Global Summit presents the latest 3D IC developments from TSMC and ASE, and offers talks on test challenges, 2.5D-3D ICs, and device-embedded substrates, dubbed "the last mile" in heterogeneous integration in SiP packaging.

A gathering for celebration, to see and be seen: The 2011 Leadership Gala Dinner will honor TSMC’s Morris Chang, recipient of the 2011 Akira Inoue award, and we’re told that President Ma Ying-jeou will talk as well. Other invited guests listed are Vincent Siew, VP representing the ROC; Wu Den-Yih, Premier of the Executive Yuan; Yen-Shiang Shih from the Ministry of Economic Affairs (MOEA); and Taipei Mayor Hau Lung-Bin.

For networking, the CEO Forum presents a range of talks from top industry execs (Mentor Graphics, IMEC, Applied Materials, TSMC), addressing market differentiation, future "hyper-intelligent systems," equipment technology inflection points, and other silicon IC technology challenges and opportunities. And there’s the annual SEMICON Taiwan golf tournament and luncheon.

Other forums cover a range of hot industry topics:

– MEMS: Litho for 3D TSV MEMS, etching, simulation, test
– LEDs Cost and technology trends, manufacturing efficiencies, packaging
– Green Manufacturing: Reducing and efficiently managing consumption of energy, water, hazardous substances, waste, etc. Talks include ISO and SEMI standards, TSMC’s "total chemical management," pump/abatement, automation, etc.
– More: Manufacturing/design collaboration, CMP, secondary equipment, and a number of themed pavilions including a Cross-Strait and several national ones.

To learn more about the show and register, go to www.semicontaiwan.org.

August 26, 2011 — The MEMS Industry Group (MIG) welcomed Frauhofer Institute for Silicon Technology (ISIT) to its membership. The research facility focuses on microelectronics and microsystems technology. Siconnex, which builds diverse MEMS fab equipment, also joined the association.

Fraunhofer ISIT operates a 3,000m2 cleanroom for microsystems research and production, sporting Rudolph and SPTS equipment, among others. The staff includes 150 scientists, along with industry partners. They develop power electronics, sensors and microsystems based on micro electro mechanical systems (MEMS), as well as actuators using micro mirrors, valves, etc. Visit Fraunhofer ISIT’s website at http://www.isit.fraunhofer.de/en/ (English language version). The facility joins Fraunhofer IPMS and Fraunhofer ENAS, existing MIG members.

Siconnex Customized Solutions, based in Austria, supplies MEMS manufacturers with coating and deposition systems, metal lift off (MLO) tools, and wet batch sprayers for etch and clean operations. Learn more at http://www.siconnex.com/

MEMS Industry Group offers programs and events to advance MEMS commercialization and manufacturing in global markets. Members include MEMS makers such as Knowles, equipment suppliers such as Applied Materials, and research organizations such as imec. Learn more at www.memsindustrygroup.com.

Recent Fraunhofer MEMS research:

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August 25, 2011 – PRWEB — Magnetic sensors will exceed $3.2 billion in sales by 2017 driven largely by "E-compassing" applications, according to Global Industry Analysts (GIA). Unique end-use applications, along with technology innovations, interoperability with devices and competitive pricing, will fuel "robust" magnetic sensors growth, says GIA.

Better sensitivity, compactness and flexibility in today’s magnetic sensors has led to integration in high-end industrial/automotive applications through low-cost consumer and mobile products. Position sensors, speed sensors and record heads in hard disk drives in computers are the most commonly used magnetic sensor types. Smartphone and automotive-integrated magnetic sensors are enabling a host of new navigation functions in mobile and other GPS devices. Ultra-sensitive superconducting quantum interface devices (SQUIDs) are highly effective in medical applications for detection functions.

Thanks to the miniaturization of micro electro mechanical systems (MEMS), built using semiconductor fab processes, silicon-based magnetoresistive sensors (AMR, GMR) are enabling devices with functionality that hall devices cannot provide, and these sensors are replacing micro switches, potentiometers and reed switches. Manufacturers are investing in GMR technology development, attributed mainly to the significant growth in the HDD area density. Silicon magnetic sensors will flourish in mobile devices, desktop PCs; smartphones; gaming; audio and video devices and personal electronics.

The global 2008-2009 recession kept magnetic sensors growth flat, due to soft demand for all major end-use segments. Demand surged in 2010, mainly from the automotive, consumer and industrial markets, GIA notes. Also read: Digital compass manufacturing: With nearly all makers in Japan, will the earthquake affect supply?

The US and Europe represent equal contenders in the magnetic sensors market. Developing markets in Asia-Pacific and Latin America will add potential for companies with the right technology and product developments. Asia-Pacific, led by India, China, Korea and Taiwan, will see the fastest compound annual growth rate: 12% CAGR through 2017.

By product segment, Hall Sensor ICs constitutes the largest market globally. With respect to long-term potential, giant magnetoresistive (GMR) sensors are poised to take the lead, expanding at a CAGR of over 12%.

Companies mentioned in the report: Allegro MicroSystems, Inc, Asahi Kasei Microdevices Corporation, Austriamicrosystems AG, Honeywell International, Inc, Infineon Technologies AG, Melexis Microelectronic Systems, MEMSIC, Inc, Micronas Semiconductor Holding AG, NVE Corporation, NXP Semiconductors N.V., and Sensitec GMBH.

The research report "Magnetic Sensors: A Global Strategic Business Report" from Global Industry Analysts Inc. provides a comprehensive review of industry and product overview, market trends and issues, technology overview, end-use analysis, technological developments, product introductions, recent industry activity and profiles of market players worldwide. Analysis and overview is provided for major geographic markets such as US, Canada, Japan, Europe, Asia-Pacific, Latin America and Rest of World. Market analytics are provided in value (US$) terms for product segments including, Hall Sensor IC’s, Anisotropic Magnetoresistive (AMR) Sensors, Hall Sensor Elements, Giant Magnetoresistive (GMR) Sensors and Others. Major end-use sectors include Aerospace & Defense, Automotive, Industrial, Electronics and Others. The study also provides historic data for an insight into market evolution over the period 2003 through 2008. Learn more at http://www.strategyr.com/Magnetic_Sensors_Market_Report.asp

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August 24, 2011 — The IC industry, which had a phenomenal growth year in 2010, is in a cautious mode under greater macro-economic uncertainty and hesitancy. Some positive news has emerged from data within IC Insight’s Mid-Year Update, such as the 200 billion IC shipment milestone in 2011, and the $300 billion mark expected in 2013.

IC Insights lowered its 2011 worldwide semiconductor industry growth forecast to 5% recently, with its 2011 IC market forecast falling to 4% growth.

However, IC sales will exceed $300 billion for the first time in 2013. The IC market first topped $10 billion in 1980, $100 billion in 1995, and $200 billion in 2005. While 10 years passed from $100 billion to $200 billion, the $200 billion to $300 billion jump will take only 8.

Total IC unit shipments should top 200 billion for the first time in 2011. More than 100 billion will be analog devices, an unprecendented number. Growth will be strongest in MOS memory devices (2008-2015), with average annual growth of 12%. NAND flash memory is also growing impressively: 20% average annual growth in the same period, thanks to surging tablet PC, smartphone, and solid-state drive sales. Smartphones contain nine times more NAND flash than a regular cellphone.

Smartphone shipments will grow 60% in 2011 (440 million units), continuing the strong growth cycle (56%) established in 2010. Between 1Q10 and 4Q11, quarterly smartphone shipments are expected to rise by an average of 13% per quarter.

The largest growth for IC application segments will belong to automotive chips. Analog vehicle chips will see 32% market growth in 2011. The Automotive Special Purpose Logic/MPR segment and 32-bit MCUs won’t be far behind. Sophisticated safety systems, driver information systems, and engine control units will keep the automotive IC market active through 2015. Also read: Automotive MEMS sensors recalculating for growth after 2010-2011 disruptions

Another segment experiencing change is portable computing, with touch-screen tablets favoring ARM-based processors. Intel and Advanced Micro Devices (AMD) are "scrambling" to compete with ARM-based processors, which were used in more than 90% of the 17 million tablets sold in 2010. Look for ARM to dominate in 2011 as well, and watch out for ARM on x86 MPU’s familiar turf, such as desktop PCs and network servers.

IC Insights’ Mid-Year Update to The McClean Report is a part of IC Insights new 2011 "Half-Year" McClean Report service. View http://www.icinsights.com/services/mcclean-report/ for more information.

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August 23, 2011 — The automotive micro electro mechanical system (MEMS) sensor market will rise in 2012, steadying after 2010-2011’s cycles of growth and contraction, according to IHS iSuppli’s Automotive MEMS Market Tracker. Revenues will increase 16% to $2.31 billion, initiating a growth cycle that will hit $2.93 billion in 2015 (9% 5-yr CAGR).

MEMS sensors are integrated into safety, performance, and comfort features of automobiles: air bags, tire-pressure monitoring systems (TPMS), vehicle stabilization control, etc. As vehicle production recovers from the recession, and safety regulations become more encompassing, auto MEMS will experience healthy growth, said Richard Dixon, senior analyst for MEMS and sensors at IHS.

The Japanese earthquake in March 2011 significantly disrupted this year’s sales, both of MEMS and automobiles (2 million vehicles lost). Global automotive MEMS revenue in 2011 will reach $1.99 billion, up 4% from $1.91 billion in 2010. Shipments will be average: rising 9% to 750.7 million units, compared to a 36% increase 2009-2010. "The loss in vehicle production could entail a shortfall in sensor shipments equivalent to some 20 million units this year," Dixon posits.

As vehicle production comes back on-line, and automotive safety mandates on electronic stability control systems (ESC) go into effect (United States, Canada, Australia, Europe and Japan), multiple MEMS sensors will be integrated into each vehicle.

China’s "aggressive" fitment rates must be attained by 2015, which will dramatically increase pressure sensor sales for direct TPMS. The mandate will begin phasing in starting in mid-2012, beginning with a portion of engine sizes larger than 1.6 liters. In July 2015, the mandate will apply to all engine sizes, IHS iSuppli research shows.

Globally, TPMS sensor shipments will grow fivefold, propelling the market to 73% penetration of all vehicles by 2015. Tough price cuts of up to 8% per year will test the pressure sensor makers’ business viability.

Learn more in 2012 Sees Automotive Sensor Market Back to Healthy Growth Pattern at http://www.isuppli.com/MEMS-and-Sensors/Pages/2012-Sees-Automotive-Sensor-Market-Back-to-Healthy-Growth-Pattern.aspx?PRX

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August 22, 2011 — Imec and Holst Centre have developed an ultra-low-power readout ASIC for capacitive micro and nano electro mechanical system (MEMS/NEMS) sensors. While most available readout chips are customized to particular sensors, this architecture can interface with various MEMS/NEMS devices without draining power.

The system reads accelerometers and strain sensors in a half-bridge configuration, with gain controlled by integrating pulses from the excitation voltage, controlling the signal-to-noise (SNR) ratio. The system has also been designed to cancel residual motion artifacts.

The readout architecture has the lowest reported equivalent acceleration noise level and the highest bandwidth, Imec states, offering SNR, bandwidth, and power tradeoffs. The team achieved a figure-of-merit of 4.41×10-20 F√(W/Hz) for a sensor range of ±2.0g and ±20,000με over a 100Hz bandwidth. The readout chip handles sensors with different sensitivities, offsets and mismatch via modifications to timing and duty cycle of the excitation pulses.

"Innovative, flexible and power-efficient readout architectures," which read signals from a wide range of capacitive devices (such as accelerometers and strain sensors with different actuation voltages, sensitivities and resolutions), enable MEMS use in building-monitoring networks for seismic-active areas, among other uses where various sensors operate on restricted power sources, Imec reports. Resolution requirements can be 1mg and 10με for the accelerometer and strain sensor respectively, and a range of ±2.0g and ±20,000με over a 100Hz bandwidth.

The ASIC was fabricated on TSMC 0.25μm CMOS with metal-insulator-metal capacitors. Total power consumption of the 3 channels is 15μW. The clock and excitation voltages for the sensors are external.

More MEMS news from imec:

IEDM: IMEC, Panasonic tip record MEMS resonator

IC MEMS design partnership

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August 18, 2011 — Sporian Microsystems received a US Department of Energy (DOE) contract to evaluate advanced materials, sensor designs and packaging for Generation IV nuclear reactor use.

Recycled reactor fuels could be used to power Gen IV reactors. The technology is still in development, with proliferation and physical protection (from terrorist attacks, for example) as major design elements, as well as improved nuclear safety and reliability.

Sporian will develop materials and sensor technology that withstand harsh environments like high temperatures and high pressures, exposure to liquid sodium, fast helium flow, gamma and neutron radiation. The company will develop micro electro mechanical systems (MEMS), polymer derived ceramic materials (PDCs), and electronics packaging technologies to acheive this.

Sporian originally developed harsh-environment sensors for coal and natural gas-based generating turbines and for propulsion turbines. It also makes sensors for other applications, like drinking water control. It will leverage the same technology for Gen IV reactors, reports Sporian principal investigator Dr. Yiping Liu.

Sporian will provide a subcontract to Pacific Northwest National Laboratory (PNNL) in Richland, WA to assist with the evaluation of this technology.

Sporian Microsystems Inc. develops, markets, manufactures and sells a family of novel sensors, multiple sensor-suites, sensor-subsystems and sensor data-loggers. For more information, visit www.sporian.com

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