Category Archives: MEMS

January 24, 2011 — Rambus Inc. (NASDAQ: RMBS), technology licensing company, acquired the lighting and display portfolio of patents and technology from privately held Imagine Designs Inc. The patented innovations include technology for general lighting, LCD backlighting, and microelectromechanical system (MEMS) displays.

"This acquisition complements our portfolio…allowing us to provide a wider range of solutions to our customers for their next-generation LED-based lighting and display products," said Jeff Parker, president of Lighting and Display Technology at Rambus.

Imagine Designs’ founder and principal inventor Brian Richardson will join Rambus as a technical director in the Lighting and Display Technology business. Richardson joins Rambus to continue the development of innovations and solutions for general lighting and displays. In addition, Pete Pappanastos has joined Rambus as a director of strategic development for the Lighting and Display Technology business. Rambus intends to support and further build the customer relationships and momentum that Imagine Designs established in the entertainment, architecture, street light and general lighting markets.

Rambus specializes in the invention and design of architectures focused on enriching the end-user experience of electronic systems. Additional information is available at www.rambus.com.

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January 24, 2011 — E M Optomechanical Inc. (EMOpto) developed a new low-cost version of its OPTOPro line of 3D MEMS Optical Profilers for use in testing and characterizing micro-electro-mechanical systems (MEMS) devices.

EMOpto introduced the latest in its line of dynamic 3D MEMS optical profilers, the OPTOPro Model 622-Xe, at less than $20K. It is based on exclusively licensed patented long-working distance interference microscopy technology.

"Feedback from potential customers indicates that tight budgets are preventing them from purchasing our higher priced models and that $20K would be a good price point for an entry level system," says Tom Swann, president of EMOpto. In addition to the Model 622-Xe, customers will have to provide a vibration isolation table, a structure to hold the profiler instrument and a means of holding and positioning the sample to be tested. "We have found that many prospective customers already have these capabilities available in-house," says Swann.

In addition to requiring the customer to furnish some of the system’s components, the low price was achieved by redesigning the mechanical portion of the profiler instrument and trimming the margin on software. "Even at its low price, the Model 622-Xe is a valuable and versatile research tool and it can accommodate a wide range of upgrades" says Swann.

EMOpto’s first generation line of products is intended primarily for use by micro-systems researchers for making real-time dynamic measurements of the micro- and nano-scale motions of MEMS devices and other micro-systems.

The technology behind EMOpto’s line of products was initially developed because there were no commercial optical profilers tailored specifically to the needs of micro-systems researchers. Its key feature is that it allows a long working distance without any sacrifice in measurement resolution. This allows capabilities not possible with other techniques such as allowing space for probes that are needed to attach to micro-system devices and viewing through portholes into vacuum chambers or through device cover glasses. Also read: Detecting failure modes in today’s MEMS

The profiler instrument is controlled by EMOpto’s MEMScript Software that also acquires and analyzes the data collected. This software has several unique features, such as the ability to control micro-system devices, which by nature have moving parts, and making real time measurements of performance. "MEMScriptTM" is a trademark of Sandia Corporation in the United States. Used with the permission of Sandia Corporation, and its licensee E M Optomechanical, Inc.

E M Optomechanical, Inc. was spun-off from Optomec, Inc. in 1998 to provide opto-mechanical engineering, design and fabrication services to the photonics industry. The Company has transitioned to a product oriented Company committed to commercialization of exclusively licensed patented long-working distance interference microscope technology for micro-systems research and development.

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January 20, 2011 – BUSINESS WIRE — The Center for Micro/Nano Science and Technology at National Cheng Kung University (NCKU), Tainan, Taiwan, has moved from Building of Science and Technology, Tzu-Chiang Campus, to the Building for Instrumentation Equipments, which occupies more than 600 square meters and includes cleanrooms and laboratories.

Under the leadership of director Jen-Fin Lin and with the joint efforts of staff, the NCKU Center for Micro/Nano Science and Technology has constructed and moved more than 10 valuable equipments within three months, reduced the transportation cost to NT$500,000, and recovered all the equipments to order within one month.

Subsidized by the Taiwan National Science and Technology Program for Nanoscience and Nanotechnology and Research University Integration Project from the Ministry of Education, the Center is a key institute for nano technology and research in Southern Taiwan with more than sixty valuable instruments. NCKU Center for Micro/Nano Science and Technology, established in 1997, was NSC MEMS Southern Common Facility Center and was renamed as Center for Micro/Nano Science and Technology in 2002.

To strengthen the sustainable development of the Center for Micro/Nano Science and Technology, additional key instruments are necessary, and as the number of instruments increases, space in the Building of Science and Technology became limited, inadequate to use, and difficult to maintain. In addition, nearby residents have complained about the issues of exhaust and noise, thus the university decided to move the Center to Building for Instrumentation Equipments to a new home. 

NCKU president Michael Ming-Chiao Lai said, "After the Center for Micro/Nano Science and Technology moves into Building for Instrumentation Equipments, I believe the comfortable and spacious room can offer better service to students, teachers and the industry and the brand-new clean rooms and laboratories can provide complete space for micro nanometer manufacturing and testing equipments." Ming-Chiao Lai believed that the newly migrated Center for Micro/Nano Science and Technology will help promote academic exchange and industry-academia cooperation.

Nano science is an advanced technology which covers different fields, including electrical engineering, medicine and materials, and to engage in cross-disciplinary cooperation, excellent equipments are needed to attract scientists from different fields to work together and learn from one another.

NCKU senior executive VP Hwung-Hweng Hwung emphasized, "A person who engages in research requires excellent research equipments. From my personal experience, with a set of laser tester I purchased in 1981, my papers published in international journals have never been rejected and many of them have been cited. Because I have such excellent equipments in Tainan Hydraulics Laboratory, I could measure the most sophisticated data and come up a precise analysis." Hwung believes, for a research center to develop sustainably, it must have equipments, instruments and personnel like those of Tainan Hydraulics Laboratory, and the Director of the Center must use these equipments to create new projects.

He added, "To become a national-scale research center, the Center must not rely entirely on university resources or government long-term budget, thus I expect the Director to pay extra attention to this aspect."

The core instruments of NCKU Center for Micro/Nano Science and Technology include E-beam Writer, Ultra-High Vacuum Ion Beam Sputter, High Quality Sputtering and Evaporation System, Dual-Beam Focused Ion Beam, High-Resolution Field-Emission Transmission Electron Microscopy and Mask Aligner.

Learn more about National Cheng Kung University at www.ncku.edu.tw

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January 20, 2011 – PRNewswireSTMicroelectronics (NYSE: STM), micro-electro-mechanical systems (MEMS) devices supplier to consumer and portable applications, and Bluechiip Limited, an early-stage company that has developed a tracking solution, will cooperate in the manufacturing of MEMS-based tracking tags, aimed initially at healthcare applications, such as biobanks.

As the bluechiip tracking tag is a mechanical device, it can survive and read sample IDs in extremely high and low temperatures, in addition to its immunity to gamma irradiation. This robustness provides significant advantages over more traditional identification or tracking solutions, such as labels, barcodes or RFID technologies, and provides the necessary high levels of data surety in the rapidly growing and labor-intensive healthcare markets, especially in biobanking.

This new technology enables data to be read at temperatures as low as those reached in liquid nitrogen, approximately –196C, and as high as 200C. Data can also be transmitted through frost. Bluechiip’s tracking solution has also been field-proven to survive autoclaving, gamma irradiation sterilization, humidification, centrifuging, cryogenic storage and frosting.

The technology is based on MEMS-based resonators within a tiny, purely mechanical chip, containing no electronics. The tracking tag, which comprises this mechanical chip and an antenna, can either be embedded or manufactured into a storage product, such as a vial or a bag. Easy identification, along with any associated information from the tag can be detected by a reader, which can also log the temperature history of the tagged items.

"Bluechiip’s tag technology coupled with ST’s MEMS design and manufacturing expertise will make available an extremely robust and valuable tracking capability for many applications in healthcare and other markets," said Benedetto Vigna, Group Vice President and General Manager, MEMS, Sensor and High-Performance Analog Division, STMicroelectronics. "ST has a long history in the industrialization of innovative technologies and applications, and this cooperation with Bluechiip will further extend ST’s expertise in biosensors, while also complementing and reinforcing its leadership in MEMS overall."

These tags will first be molded into test tubes and vials for the biobank market to identify, track, retrieve, monitor and store human biospecimens, including tissue, embryos and cord blood in liquid nitrogen. Although the Bluechiip tracking technology has initial applications in the healthcare industry, it also has applications in pathology, clinical trials, biorepositories and forensics. Other key markets for the technology could include security, defense, industrial, manufacturing, waste, aerospace and aviation.

In March 2009, TIME Magazine highlighted biobanking as one of ’10 Ideas Changing the World Right Now’. The growth of biobanks worldwide has been exponential; recent studies estimate that hundreds of millions of tissue samples are stored in U.S. biobanks and greater than one billion are stored worldwide.  In a recent report by Visiongain titled ‘Biobanking for Medical R&D: Technology and Market 2010-2025’, the market for biobanking (sales of biobank resources or services) in 2009 was estimated to be worth $8B and is expected to reach $45B by 2025.

STMicroelectronics provides innovative semiconductor solutions for multimedia convergence and power applications. Further information on ST can be found at www.st.com

bluechiip is an advanced tracking and bio-monitoring chaperon technology designed to revolutionize biosample lifecycle and process chain management relevant to bioresource laboratories. Further information on Bluechiip can be found at www.bluechiip.com.

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January 19, 2011 – MarketwireMicro electromechanical systems (MEMS) will be a key technology featured in the educational sessions and throughout the Expo Hall during the 2011 Sensors Expo & Conference taking place June 6-8 at the Donald E. Stephens Convention Center in Rosemont, IL.

"Attendees come to Sensors Expo to see the latest sensing technologies, and MEMS is one of hottest segments in sensors today," said Beth Torrey, event director for Sensors Expo & Conference. "We have partnered with MEMS Industry Group and will be offering a variety of in-depth conference sessions as well as a showcase of MEMS solutions and education on the Expo Floor."

"We are thrilled to partner with Sensors Expo to educate attendees on advancements in MEMS commercialization and fabrication and supporting MEMS infrastructure," said Karen Lightman, managing director, MEMS Industry Group, the industry association focused on advancing MEMS across global markets. "We have put together a compelling three-day line-up of MEMS-focused sessions featuring industry experts who will share insights and information on the ways in which MEMS is enabling an ever-growing range of consumer, automotive, biomedical/healthcare and clean energy applications."

Beginning Monday, June 6, MEMS Industry Group will host an all-day Pre-Conference Symposium on MEMS Commercialization. Lightman will moderate "MEMS Commercialization Opportunities for Systems and Products." Featuring speakers from companies such as Acuity, AM Fitzgerald Associates, Analog Devices, GE Sensing and Maxim Integrated Products, this full-day symposium will explore a mature MEMS supply chain capable of delivering system-level components without the cost, development time or performance risks of the past.

As part of the general conference program on Tuesday, June 7 and Wednesday, June 8, industry experts will lead discussions on miniaturization, node fabrication techniques, nano-micro integration, the intelligent sensor platform, and stealth dicing in the MEMS Track, organized by MEMS Industry Group. Sessions will include:

  • Micro and Nano Technologies for Smart Systems Integration
  • High-Performance MEMS in a Sensing World
  • MEMS Sensors Integration into Mobile Operating Systems
  • Providing the Infrastructure for Connecting to the World: One Sensor at a Time
  • Intelligent Sensor Platform: Benefits and Challenges for Sensor Networks Applications
  • Microfabrication of High Performance Inertial Sensor Using WLP Technology
  • Development of a MEMS-enabled Human Hydration Sensor
  • Dicing of Sensitive MEMS Devices: Challenges and Solutions
  • Co-Design Strategies for Multi-Sensor Systems

In addition to the conference programming dedicated to MEMS, Sensors Expo will also provide a showcase of MEMS products and services, as well as education on what’s to come down the road for MEMS. The MEMS Pavilion will display best-in-class exhibitors dedicated to providing the latest in MEMS technologies. Inside the pavilion, the MEMS Innovation Area will be dedicated to companies on the cutting edge of strategic MEMS products.

Sensors Expo & Conference exclusively focuses on sensors and sensor-integrated systems. The conference program is dedicated to exploring the most up-to-date innovations in sensor technology including physical sensors, sensor networks, biosensors, MEMS/nanotechnology, instrumentation & controls, intelligent systems, machine-to-machine communication, wireless sensing and IT technology. For more information, visit www.sensorsmag.com/sensorsexpo.

MEMS Industry Group (MIG) is the trade association advancing MEMS across global markets. For more information, visit www.memsindustrygroup.org.

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January 19, 2011 — United Microelectronics Corporation (NYSE:UMC) (TWSE:2303), a semiconductor foundry, said today that it has produced customer micro electromechanical systems (MEMS) sensor products and volume production is scheduled to start this year.

This milestone comes after three years of MEMS technology development at the foundry, UMC said. Engineering samples are scheduled for the first half of 2011, with volume production to begin after that. Development of the CMOS-MEMS accelerometer has met consumer electronics application specifications (1g-16g) and achieved readiness for volume production.

Copyright 2011 Normans Media Limited All Rights Reserved

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January 17, 2011 – EON: Enhanced Online News – BUSINESSWIRE — OMRON Corporation (TOKYO:6645)(ADR:OMRNY) will release the D6F-70, a 70L/min MEMS flow sensor optimized for measuring the gas flow rate of fuel cell systems. Omron also plans to release in FY2011 a similar MEMS flow sensor capable of measuring up to 200L/min.

These products will greatly enhance Omron’s MEMS flow sensor lineup.

Click to EnlargeThe D6F-70 MEMS Flow Sensor is capable of measuring up to 70L/min- an improvement of 20L/min from the current model- all with a very high level of accuracy thanks to Omron’s MEMS technology.

The detrimental effect of pump vibration has been reduced by 90% compared to existing models allowing a higher level of flow sensing accuracy. The D6F-70 70L/min flow sensor is almost the same size (84.6 × 32 × 30mm) as existing 50L/min sensors. This was made possible with a unique new flow structure.

OMRON added sensors with P14-type quick connectors to the series. It is the standard connector type for fuel cell systems in Japan and significantly reduces the time required for pipe connection work.

OMRON expects 200,000 units to be used in fuel cell systems in FY2013.

Such sensors are needed to control the 70L/min flow rate of air as it reacts with hydrogen in home-use fuel cell systems. With this new addition to the lineup, Omron can now provide flow sensors suitable for use in all home-use fuel cell systems. The new sensor is also available with a standard P14-type quick connector that enables easier connection to fuel cell systems.

Higher flow rate types are increasingly necessary for industrial-use high power generation fuel cells. Omron’s 200L/min type flow sensor scheduled for release in FY2011 will be able to meet the requirements of almost any type of fuel cell system. They will also enable wider usage in medical equipment applications, and are expected to open the door to a range of other new applications.

Fuel cells and other such environmentally friendly products are increasingly moving into the mainstream, and it is predicted that their use will become widespread globally in the near future. Our flow sensors improve the operational efficiency of fuel cells making them an even more attractive option for a wide range of applications.

Specifications:
Model number D6F-70AB71 
Flow range 0 to 70 L/min 
Medium Air 
Power supply DC10.4 to 26.4V 
Output DC1.0 to 5.0V 
Size 84.6 × 32 × 30mm
Accuracy ±3%F.S. at 25C. 
Operating temperature -10 to +60C. 
Operating humidity 35 to 85%RH (in ice-free, condensation-free conditions)

OMRON Corporation is a global leader in the field of automation. For more information, visit OMRON’s website at http://www.omron.com/

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January 13, 2011 – BUSINESS WIRE — Tegal Corporation (NASDAQ:TGAL), specialized equipment maker for the fabrication of advanced MEMS, power ICs and optoelectronic devices, received an order from the Fraunhofer Institute for Microelectronic Circuits and Systems in Duisburg, Germany for a Tegal 200 SE DRIE system equipped with the new Tegal ProNova2 reactor.

The Tegal 200 SE DRIE system will be shipped and installed at the customer’s site in early CY2011, and will support Fraunhofer IMS’ mission to develop and produce microelectronic system solutions by combining mixed-signal ICs and integrated microsystems (MEMS) devices built using a state-of-the-art equipment set and "more than Moore" thinking.

The Tegal 200 SE silicon DRIE system order from this first-time Tegal DRIE customer is the result of a thorough competitive evaluation Fraunhofer IMS performed on a broad range of silicon DRIE tools and tool suppliers.

"The capabilities of the Tegal 200 SE are convincing for us due to the Tegal system’s demonstrated high deep silicon etch performance and high process flexibility, including oxide and isotropic silicon etch. We believe that this equipment excellently meets our needs for advanced MEMS development," said Dr. Andreas Goehlich from the Fraunhofer IMS.

"Fraunhofer IMS is well-known for technological leadership in integrated microsystems, and we are very pleased to have received this important silicon DRIE tool order," said Jim Apffel, DRIE product manager at Tegal Corporation, adding that the ProNova2 DRIE process module an advanced silicon DRIE process module for 200mm applications and the Tegal 200 SE is the best-adapted DRIE solution for 3D-IC and MEMS volume manufacturing.

The Tegal 200 SE is designed to achieve high throughput with low cost of ownership in production applications, thanks to the combination of extended time between cleaning, minimal wafer edge exclusion, high silicon etch rates, excellent process stability and highly uniform etching.

The Tegal ProNova2 reactor is targeted for fast-growing 200mm MEMS and 3D IC applications. It was built to out-perform comparative tools’ etch rates and increase DRIE productivity and yields. In addition to sustained high etch rates, the new ProNova2 reactor offers a three-fold improvement in ion uniformity over standard ICP sources. For some applications, the higher ion uniformity enables a more than 40% improvement in etch selectivity.

Fraunhofer IMS in Duisburg covers the broad spectrum of industrial and automotive microelectronics. In addition, new solutions in the sector of Health & Senior Care are being tested and developed further in the Fraunhofer-inHaus-Center. As a member of the Fraunhofer Gesellschaft, Fraunhofer IMS carries out research, development and pilot fabrication of microelectronic solutions for industrial and public clients.

Tegal is an innovator of specialized production solutions for the fabrication of advanced MEMS, power ICs and optoelectronic devices. Tegal silicon DRIE tools are used in numerous research and development laboratories throughout the world, engaging in both commercial and academic research programs, and are also found in MEMS foundries and other dedicated commercial High Volume Manufacturing lines worldwide. Learn more at www.tegal.com.

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January 13, 2011 — Yole Développement released details of its upcoming report, MEMS Manufacturing & Packaging. This report analyzes the main MEMS manufacturing evolution. MEMS drivers include size, cost, and performance, though in different ways than ICs. New MEMS manufacturing and packaging technologies and specific materials are necessary.

"With this report, our aim is to provide understanding of current challenges of MEMS manufacturing, packaging & materials. For each MEMS manufacturing step, bottlenecks and challenges are highlighted," explained Dr Eric Mounier, project manager at Yole Développement. Yole Développement’s approach is to analyze the MEMS industry evolution, per MEMS devices (inertial MEMS, magnetometers, pressure sensors, etc). Technical & market data covers the period 2000-2020. This study includes cost analysis, technical trends, impact on MEMS equipment & materials, manufacturing tools (DRIE, sacrificial release, etc), and engineered wafers & materials.

Click to Enlarge
Figure. Example of different MEMS manufacturing & packaging trends analyzed in the report “MEMS Manufacturing & Packaging” Source: Yole.

Although MEMS technologies have not been driven by the same size demands as ICs, MEMS manufacturing is not just standing still. The fast growing MEMS markets, now led by consumer applications, are:

  • Size-drive: for demanding consumer applications like smart phones and laptops
  • Performance-driven: for high-end applications like aerospace
  • Cost-driven: for high-volume applications like cell phones, automotive and game consoles

New MEMS manufacturing and packaging technologies and specific materials are necessary for solving these issues. Yole Développement’s report highlights the future challenges for MEMS production and packaging. From bulk micromachining to surface micromachining and then to SOI, MEMS technology has been following a well-defined evolutionary technical roadmap with 3D integration being the next possible step. The report includes manufacturing trends for the different MEMS devices in terms of processes, new packaging approaches, 3D integration, CMOS MEMS integration, new materials such as structured wafers, and more.

MEMS processes are analyzed at:

  • The substrate level: engineered SOI, glass, thin wafers
  • Front End level: piezo materials, getters, bonding, resists, CMOS MEMS, release stiction, DRIE, singulation, lithography, etching, sacrificial release, CAD tools
  • The packaging level: thin film packaging, active capping, pixel-level packaging, through glass vias, through Si vias
  • Technology platforms: TSV, hermetic WLP, interposer, standard packaging, MUMPS process, testing

This report analyzes the current major MEMS manufacturing trends and presents some clues for understanding the next evolution in terms of die size, cost, packaging. Among other MEMS technologies to watch for the future, Yole identified:

  • At the substrate level: SOI, glass, thin wafers;
  • At MEMS die level: getters, fusion bonding, release stiction, singulation, CMOS MEMS, DRIE, trench isolation;
  • At the packaging level: TGV, TSV, pixel-level packaging, thin film capping, active capping.

For all the analyzed MEMS technologies, wafer forecasts 2009-2015 by type of step (DRIE, wafer bonding, sacrificial etch, through Si vias, thin films packaging, CMOS MEMS, thin wafers) are estimated.

Companies cited in the MEMS report:
36Deg,  Accretech, AD, Aichi Steel, Air Products, AKM, Akustica, ALSI, Amkor, AML, APM, ASE, ASML, AST, Avago, Aviza, Ayumi, Bal-Tec, Baolab, Berliner Glass, BOC Edwards, Bosch, Brewer, Coventor, Dalsa, Dicon, Discera, Disco, Elpida, Entrepix, ePack, Epcos, EVG, FhG ISiT, FLIR, FocusTest, Freescale, FSI, Hamamatsu, Hitachi Metals, HP, IBM, IDEX, Idonus, Ikonics, IMT, Infineon, Invensense, Ixmotion, JDSU, Kionix, Knowles, LAM Research, Lemoptix, Leti, Lumedyne, Memscap, Memscore, Memsic, Memsstar, Memstech, MEMTronics, Micralyne, Micro Devices Laboratory, Microstaq, Mitsubishi Electric, Nanoplas, NEC Schott, NeoPhotonics, NovioMEMS, Okmetic, Omron, Panasonic Factory Solutions, Penta Technology, piezoVolume, Plan Optik, Polight, Primaxx, QinetiQ, QMT, RFMD, SAES, Samsung, Sandia National Labs, Santec, Semitool, Sensonor, Shell, Silex, Silicon Clocks, SiTime, Solidus Technologies, SPEA, Sporian Microsystems, STM, STPS, SUSS MicroTec, Tango, Tecnisco, Tegal, TEL, TI, TMT, TopCon, Toshiba, Tousimis, Tronics’, TSMC, Ulcoat, Ulis, UltraTechSteppers, Ulvac, Umicore, Veratag, Visera, Vi Technology, VTI, Xactix, XFAB, Xintec.

DRIE and wafer bonders are the technologies subject to major evolution. "Both technologies are increasingly used for 3D TSV in the mainstream semiconductor business. Wafer bonding is the direct competitor to the CMOS MEMS approach," says Dr Eric Mounier. For example, microbolometer players are more and more considering a wafer bonding approach to stack the MEMS to the ROIC wafer.

CMOS MEMS is likely to be restricted to very specific applications where MEMS arrays will need very close electronic processing. For all other cases, it will depend on MEMS product cycle time, flexibility, cost, integration, market demand and power consumption.

In 2011, simplification of manufacturing remains an objective: Yole Développement’s MEMS law of "One product, one process, one package" still rules. Will it still rule in 2020? The current work on technology and product platforms aims to overcome Yole Développement’s MEMS law. But this approach will be custom-made standard processes. By 2020, it is likely that MEMS fabs will have developed internal standard process blocks, but with fab-specific standard tools. The technology/product platforms currently proposed by some MEMS foundries are an interesting approach. Technology platforms can be used to create their own product platform.
 
Dr. Eric Mounier has a PhD in microelectronics from the INPG in Grenoble and is in charge of market analysis for MEMS, equipment & material. The report, "MEMS Manufacturing & Packaging," will be available in February 2011. Yole Développement is a group of companies providing market research, technology analysis, strategy consulting, media and finance services. More information is available at www.yole.fr

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January 12, 2011 — Researchers at MIT and Brigham and Women’s Hospital have shown that they can deliver the cancer drug cisplatin much more effectively and safely in a form that has been encapsulated in a nanoparticle, targeted to prostate tumor cells and activated once it reaches its target.

Using the new particles, the researchers were able to successfully shrink tumors in mice, using only one-third the amount of conventional cisplatin needed to achieve the same effect. That could help reduce cisplatin’s potentially severe side effects, which include kidney damage and nerve damage.

In 2008, the researchers showed that the nanoparticles worked in cancer cells grown in a lab dish. Now that the particles have shown promise in animals, the team hopes to move on to human tests.

Click to Enlarge"At each stage, it’s possible there will be new roadblocks that will come up," noted Stephen Lippard, the Arthur Amos Noyes Professor of Chemistry and a senior author of the paper, which appears in the Proceedings of the National Academy of Sciences the week of Jan. 10. Additional animal testing is needed before the cisplatin-carrying particles can go into human clinical trials, says Farokhzad. "At the end of the day, if the development results are all promising, then we would hope to put something like this in humans within the next three years," he says.

Click to EnlargeOmid Farokhzad, associate professor at Harvard Medical School and director of the Laboratory of Nanomedicine and Biomaterials at Brigham and Women’s Hospital, is also a senior author of the paper. Shanta Dhar, a postdoctoral associate in Lippard’s lab, and Nagesh Kolishetti, a postdoctoral associate in Farokhzad’s lab, are co-lead authors.

Cisplatin, which doctors began using to treat cancer in the late 1970s, destroys cancer cells by cross-linking their DNA, which ultimately triggers cell death. Despite its adverse side effects, which also include nerve damage and nausea, about half of all cancer patients receiving chemotherapy are taking platinum drugs. Read about other MIT research on cisplatin.

Conventional cisplatin has a relatively short lifetime in the bloodstream. Only about 1% of the dose given to a patient ever reaches the tumor cells’ DNA, and about half of it is excreted within an hour of treatment.

To prolong the time in circulation, the researchers decided to encase a derivative of cisplatin in a hydrophobic nanoparticle. First, they modified the drug, which is normally hydrophilic, with two hexanoic acid units. That enabled them to encapsulate the resulting prodrug — a form that is inactive until it enters a target cell — in a nanoparticle. To help the nanoparticles reach their target, the researchers also coated them with molecules that bind to PSMA (prostate specific membrane antigen), a protein found on most prostate cancer cells.

Using this approach, much more of the drug reaches the tumor. The researchers found that the nanoparticles circulated in the bloodstream for about 24 hours, at least 5 times longer than un-encapsulated cisplatin. They also found that it did not accumulate as much in the kidneys as conventional cisplatin.

After showing the nanoparticles’ improved durability in the blood, the researchers tested their effectiveness by treating mice implanted with human prostate tumors. They found that the nanoparticles reduced tumor size as much as conventional cisplatin over 30 days, but with only 30% of the dose.

This type of nanoparticle design could be easily adapted to carry other types of drugs, or even more than one drug at a time, as the researchers reported in a PNAS paper last October. It could also be designed to target tumors other than prostate cancer, as long as those tumors have known receptors that could be targeted. One example is the Her-2 receptor abundant in some types of breast cancer, says Lippard. Read about breast cancer research involving MEMS.

The particles tested in this paper are based on the same design as particles developed by Farokhzad and MIT Institute Professor Robert Langer that deliver the cancer drug docetaxel. A Phase I clinical trial to assess those particles began last week, run by BIND Biosciences.

Source: "Targeted delivery of cisplatin prodrug for safer and more effective prostate cancer therapy in vivo," by Shanta Dhar, Nagesh Kolishetti, Stephen J. Lippard, and Omid C. Farokhzad. Proceedings of the National Academy of Sciences, 10, January 2011.

Funding: National Cancer Institute, National Institute of Biomedical Imaging and Bioengineering Grant, Koch-Prostate Cancer Foundation Award in Nanotherapeutics.

Courtesy of Anne Trafton, MIT News Office, www.mit.edu

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