Category Archives: Advanced Packaging

Global flat-panel television shipments fell by 10 percent in February and by an estimated 4 percent in March compared to the same months in 2012 as Chinese demand plunged following the Lunar New Year buying season.

Global shipments of flat-panel display (FPD) televisions amounted to 12.6 million units in February, down from 14 million one year earlier, according to the Monthly Worldwide FPD TV Shipment Data Report from the IHS TV Systems Intelligence Service at information and analytics provider IHS. Shipments fell by another 4 percent in March, according to a preliminary estimate, as shown in the figure below.

flat panel TV shipments plunge

The FPD market consists of liquid crystal display (LCD) and plasma televisions.

“Worldwide television shipments usually decline in February compared to January because of the shortness of the month and the conclusion of the Chinese Lunar New Year shopping season,” said Jusy Hong, senior analyst, television research, for IHS. “However, global shipments in February this year also dropped sharply on a year-over-year basis because of the weak results in China. This drastic change illustrates the rising influence of the Chinese market on the worldwide television business. Chinese companies this year are expected to account for more than 20 percent of global LCD-TV production.”

Rising ratings for Chinese TV makers

Chinese-based companies in January shipped 31 percent of worldwide LCD TVs, marking the first time that the country surpassed South Korea to take the global lead. However, China slid back to second place in February, with its share dropping to 18 percent.

Read more: Global LCD TV shipments fall for the first time

LCD TV shipments by Chinese-based TV brands declined drastically in February after the end of one of the country’s biggest sales seasons ever. And despite strong sales for the Lunar New Year, inventory issues in the country remain a problem. This contributed to declining LCD panel procurement among Chinese TV makers in January and February.

Big TVs achieve bigger shipments

Global shipments of large-sized televisions are increasing very quickly, especially for the 50-inch and larger sets, based on analysts of shipments from the world’s top 14 brands.

Comparing February 2013 to the same month in 2012, worldwide shipments of 50-inch-and-larger-sized TVs increased to 10 percent, double the 5 percent last year.

In particular, the 50- through 55-inch segment also rose to 3 percent, up from zero during the same period. Moreover, 60-inch and larger size TV shipments are increasing rapidly. Shipments for this segment totaled 240,000 units so far this year, up 100,000 units from 150,000 units in 2012. These sets accounted for 3 percent of the total LCD TV shipments in February.

Read more: OLEDS and the beginning of the end for LCDs

“TV brands are aggressively expanding their lineups and shipments of super-large-sized TVs in order to improve the profitability of their TV businesses,” Hong said. “Panel manufacturers also are following suit, resulting in decreasing prices for both panels and TV sets.”

Midsize sets see mixed results

Meanwhile, medium -sized TVs in the 15- though 29-inch range lost share worldwide, with their portion of the market declining to 10 percent in February, down from 15 percent during the same month the previous year. The share of 32-inch sets, which account for the biggest portion of the global market, also dropped to 40 percent, down from 42 percent during the same period in 2012.

Meanwhile, new sizes such as the 39-inch and 50-inch made a successful entry into the worldwide TV market. The 35- through 39-inch segment, which includes the popular 39-inch size, doubled its portion of the market to 6 percent.

Despite stronger-than-expected growth during the fourth quarter, 2012 was still a miserable year for the semiconductor market and suppliers, with only eight out of the Top 25 chipmakers managing to eke out revenue growth—but nine suffering double-digit declines.

Global semiconductor revenue in 2012 declined by 2.2 percent from 2011, according to final results from the IHS iSuppli Competitive Landscaping Tool (CLT) from information and analytics provider IHS. The preliminary forecast issued by IHS in December projected a drop of 2.3 percent.

The modest improvement in the final results came from year-over-year growth in the fourth quarter that came in slightly better than estimated, topping out at a 2.8 percent increase. The preliminary estimate had predicted a 1.9 percent expansion. 

Read more: When is the semiconductor industry expected to recover?

“The last three months were the only quarter in 2012 that generated a year-over-year increase in semiconductor market revenue, but that growth was too little and too late to salvage a terrible year for chipmakers,” said Dale Ford, senior director at IHS. “Even so, the stronger performance in the fourth quarter represents a positive signal for the semiconductor market, marking the beginning of a new growth cycle in the industry that will be sustained though 2013. IHS predicts global semiconductor revenue will rise by 5.6 percent in 2013, bringing an end to the slump of 2012.”

Semiconductor body count

Semiconductor industry growth in 2012 slipped from stagnation in the first half to a slump in the second half, widely affecting various players in the market.

Among the Top 25 suppliers, the only companies to expand revenue in 2012 were No. 2 Samsung, No. 3 Qualcomm, No. 9 Broadcom, No. 11 Sony, No. 14 NXP, No.15 nVidia, No.18 MediaTek and No. 24 LSI, as presented in the attached table.

The remaining 17 suppliers suffered revenue declines. Companies whose revenue fell by double-digit percentages were No. 4 Texas Instruments, No. 5 Toshiba, No. 6 Renesas, No. 8 STMicroelectronics, No. 12 Advanced Micro Devices, No. 16 Freescale, No. 17 Elpida, No. 21 Panasonic and No. 22 On Semiconductor.

“The semiconductor downturn had an extremely broad impact, as global economic uncertainty and weakness affected companies across all regions as well as the vast majority of products and application markets,” Ford observed. “Almost every major semiconductor product market suffered a decline in 2012, with double-digit drops in the major memory and discrete categories.” 

Merger dirge

With semiconductor suppliers’ financial condition so weak, merger and acquisition (M&A) activity among the top companies was nearly non-existent in 2012—a stark contrast to the high level of activity seen in 2011.

The only major purchase was Samsung’s acquisition of a 100 percent share of the Samsung LED business from Samsung Electro-Mechanics. The results of all other top companies were not meaningfully impacted by M&A activity.

Silver linings playbook

While there was plenty of bad news in the 2012 semiconductor market, the most dramatic change for any single semiconductor supplier was actually a positive development: Qualcomm’s nearly 30 percent surge in revenue.

Qualcomm’s revenue growth of 29.2 percent launched it to the No. 3 rank in the global semiconductor market in 2012, up from No. 6 in 2011.  Its share of the semiconductor market grew by a full percentage point to 4.3 percent, up from 3.3 percent.

“In two years, Qualcomm has risen from No. 9 to No. 3 in the semiconductor rankings,” Ford noted. “This is the strongest ascension through the top ranks by any semiconductor company in recent history. Qualcomm continues to capitalize on the robust growth of semiconductor sales to the strong market for wireless devices including smartphones and media tablets.”

Only two other companies among the Top 25 achieved double-digit growth: LSI, with 22.6 percent; and Sony, with 21.8 percent. These expansions were notable achievements in such a tough market environment.

Semiconductor surprises

The bright spots in an otherwise dismal year for semiconductor growth were found in CMOS image sensors, logic ASICs, LEDs, display drivers and sensors. Growth in CMOS image sensors hit 38.8 percent, followed by logic ASICs at 19.0 percent. LEDs also expanded in the double digits at 11.9 percent. Meanwhile, growth came in at 6.9 percent for display drivers and at 6.1 percent for sensors and actuators.

The only other categories to sustain increases were logic ASSPs and standard logic components.

“Robust growth in smartphones and media tablets was key to driving growth opportunities for logic ASICs, CMOS image sensors and sensors essential to enabling new and attractive features in the exciting wireless market. LEDs also have been boosted by their continued adoption in LCD TV backlight and general purpose lighting applications.”

Veredus Laboratories today announced that the current version of VereFlu detects the current subtype of H7N9 (Avian Flu) that is responsible for the flu outbreak in China. H7N9 is the latest mutation to cause concern and increased surveillance in the region. Launched in 2008 and built on the STMicroelectronics lab-on-chip platform, VereFlu run on Veredus’ VerePLEXTM biosystem is the market’s first test to integrate two powerful molecular biological applications, Polymerase Chain Reaction (PCR) and a microarray, onto a Lab-on-Chip platform.

Detect avian flu
Veredus uses STMicroelectronics’ lab-on-chip platform to detect avian flu.

VereFlu is a portable lab-on-chip application for rapid detection of all major influenza types at the point of need. Unlike existing diagnostic methods, VereFlu is a breakthrough molecular diagnostic test that can detect infection with high accuracy and sensitivity, within two hours, providing genetic information on the infection that traditionally could take days to weeks to learn. With its high level of automation, users outside the traditional lab environment can easily perform the tests at the point of need. In addition to the current H7N9 Avian Flu, VereFlu is proven to identify and differentiate human subtypes of Influenza A (H1, H3, H5, H7, H9) and B viruses, including the Avian Flu subtype H5N1, and the 2009 pandemic H1N1/2009, all in a single test.

“After learning of the outbreak in China, we have confirmed that our current VereFlu influenza panel is able to detect the subtype of H7N9 responsible for this outbreak in addition to other human flu A and B infections,” said Rosemary Tan, chief executive officer of Veredus. “This confirms our vision when we designed the panel for the need to have a multiplexed molecular test to detect not only the typical seasonal influenza subtypes but also novel emerging subtypes, including the current H7N9 subtype, capable of making the jump from animals to humans.”

Veredus specializes in the development, manufacture, and marketing of innovative multiplexed molecular solutions in the clinical, specialty, and custom testing markets based on STMicroelectronics’ proprietary Lab-on-Chip platform. The Lab-on-Chip platform, marketed as the VerePLEXTM biosystem, combines Micro-Electro-Mechanical-Systems (MEMS) with micro-fluidics to integrate multiplexed DNA amplification with microarray detection for rapid, cost-effective, and accurate analysis of biological materials.

From smart wristwatches that record heart rates, to intelligent armbands that track physical activities, wearable electronics and fitness monitoring devices are attracting increased attention from health-conscious consumers, causing shipments of MEMS sensors used in these products to more than quadruple in just five years.

Starting with a stable base in the $20.0 million range, revenue for MEMS motion sensors in wearable electronics and fitness monitoring is set to climb to $31.0 million this year and then jump 33 percent to $41.3 million in 2014, according to the IHS iSuppli MEMS and Sensors service from information and analytics provider IHS. An even larger increase, equivalent to 47 percent, will occur in 2015 when takings amount to $60.8 million.

“The biggest leap will occur in 2016 when annual revenue rises 50 percent to $91.5 million,” said Marwan Boustany, senior analyst for MEMS & sensors at IHS. “That means the market by then will have expanded by more than a factor of four from $20.8 million in 2011.”

The below figure presents the IHS forecast of global MEMS shipments for wearable electronics and fitness monitoring devices.

MEMS sensors in fitness monitoring devices and wearable electronics

Two trends are spurring demand for wearable and mobile health technology, in turn fueling the MEMS motion sensor market for wearable and mobile health devices, said Boustany. “One trend is the higher average life expectancy of people all over the world, coupled with the amplified prevalence of illnesses like cardiovascular disease and diabetes. The second trend arises from greater awareness in the population of health, fitness and wellness issues—indicated by the rapid growth in demand for healthy nutrition, diet programs, gym memberships and even health-based mobile applications.”

Activity monitors such as the FitLinxx Pebble and Fitbug, for instance, are increasingly finding their way into consumers’ hands as employers seek to augment their corporate wellness strategies, noted Shane Walker, senior manager for consumer and digital health research at IHS. “In the United States, this is due in part to the growth of consumer-directed healthcare plans and the Affordable Care Act, which is incentivizing insurers. These corporate programs are opening yet another channel of distribution for new monitoring devices,” he said.

Market drivers and the top wearable electronics devices

“Several factors overall will help drive the market for wearable electronics and fitness monitoring devices,” Boustany said. “For one, the sensor technology has reached a state of maturity, having been introduced to consumers via smartphones and their use of accelerometers, gyroscopes and electronic compasses. The billions of sensors consumed by smartphones to date, meanwhile, have served to lower the average selling prices of the sensors and improved their production. A significant market stimulus also comes from patients diagnosed with health issues related to the lack of exercise, encouraged by their doctors—or in some cases, their employers—to track activity and manage their condition.”

Other important drivers are the proliferation and suitability of the Bluetooth Low Energy 4.0 communication protocol, as are the efforts of sensor manufacturers in combining and miniaturizing sensor technology.

For the latter, sensor fusion technology conjoined with small combo sensors—such as 9-axis inertial measurement units from French-Italian maker STMicroelectronics, California-based InvenSense and Bosch of Germany—make it easier than ever to incorporate motion sensors in a wide range of wearable devices.

Development kits proposed by sensor suppliers like InvenSense have likewise stimulated the imagination of designers for sports applications. Here new products are emerging, such as ski and snowboard goggles with motion sensors to monitor jump heights and the speed of runs, as well as 9-axis motion tracking armbands to improve swimming technique.

Electronics ready to wear

At the end of 2016, the top wearable electronics device overall for MEMS motion sensors will be activity monitors. Already in big demand today, the device features a built-in accelerometer to monitor movement and provide feedback, such as for calorie consumption.

Pedometers will rank second, helping to determine the number of each steps a person takes and popular as an exercise measuring device; followed by smart watches and smart glasses as the next largest application. In the smart watch category, Apple is rumored to be launching an iWatch soon, and both Google and Samsung are also looking to enter the segment.

While all the pieces are in place for the wearable technology and mobile health market to prosper, the mass adoption of activity monitors and similar devices will depend on the success of companies to move to so-called true lifestyle products. The devices by that point will be fashionable, resemble jewelry being worn or remain inconspicuous, allowing the wearer to integrate the gadgets with normal clothing and other accessories. The products should also be easy to use, reliable and competitively priced in order to maximize penetration among consumers.

Growth of the wearable electronics and fitness monitoring market will, in turn, provide good revenue opportunities for MEMS motion sensor manufacturers.

U.S. television shipments are forecast to decline for a second year in a row in 2013, but growth will resume next year as the liquid crystal display television (LCD TV) segment regains some of the strength it had lost in the past year.

Shipments in 2013 of televisions into the U.S. market will amount to a projected 36.6 million units, compared to 37.6 million last year, according to an IHS iSuppli U.S. Television Market Tracker Report from information and analytics provider IHS. The anticipated 2.7 percent contraction will be smaller than the 5.8 percent slide suffered by the industry in 2012 when domestic TV shipments retreated from 39.9 million units in 2011. However, it will mean that shipments will have declined for two straight years by the time 2013 is over.

Despite the current negative picture, the industry is poised to see expansion return next year as shipments tick up to 37.8 million units, marking the beginning of at least a four-year run of steady growth, as shown in the below figure.

US TV market

“U.S. television demand is being hit by the double whammy of the plunge in both the plasma and LCD TV segments,” said Veronica Thayer, analyst for consumer electronics & technology at IHS. “After peaking in 2010, plasma sales now are on a terminal decline. Meanwhile, the mature U.S. LCD TV market contracted in 2012 as most consumers already own one or more sets.”

Plasma TV shipments last year shrank a steep 24 percent to 3.6 million units compared to their 2011 level, and LCD TV shipments descended 3 percent to 33.8 million units.

But while plasma shipments will continue to be down this year as part of an irreversible trend toward extinction, LCD TV shipments will be up 3 percent, reversing the losses of last year and coming close to the segment’s 2011 shipment level. LCD TV shipments will grow another 6 percent next year, pulling the overall U.S. TV space out of its slump.

Meanwhile, the introduction of organic light-emitting diode (OLED) televisions will start to work its magic on the industry, especially because the advanced sets will sport perfect black colors and much thinner profiles than already slim-based LED-backlit sets. South Korea’s LG Electronics and Samsung Electronics will lob the first volleys in the first half of 2013 by each launching 55-inch models—first previewed in January at the Consumer Electronics Show in Las Vegas, and vastly different from the tiny 11- and 15-inch OLED TVs shown several years ago.

A total of just 56,000 OLED TVs will ship cumulatively in 2013 and 2014, with sets commanding extremely high retail pricing because of a lack of large-scale manufacturing. But shipment numbers will grow quickly from 2014 onward, jumping to 370,000 by 2015, and then surging to 1.9 million units by 2017. Revenue from OLED TVs could reach as much as 21 percent of the total TV market revenue for that year.

Owing to the high retail price of OLED TVs, this display type will account for a larger percentage of revenue compared to shipments in the total U.S. TV market.

memsstar Limited, a provider of etch and deposition equipment and technology solutions to manufacturers of semiconductors and MEMS, today announced the appointment of Tony McKie as its new chief executive officer (CEO). McKie is tasked with capitalising on the company’s experience and reputation in the semiconductor and MEMS markets to drive its growth.

"memsstar is poised to take advantage of the significant growth potential of the MEMS and remanufactured semiconductor equipment markets," said Peter Connock, chairman of the board of memsstar. "Both MEMS and remanufactured equipment are forecast to see continuing growth over the next few years. Tony, with his industry experience and in-depth knowledge of technology, is ideally suited to ensure we maximize our opportunities in these markets. We look to Tony to advance our MEMS technology beyond our present capabilities and drive our efforts to expand our remanufactured equipment and services business."

Europe remains a center for semiconductor technology development in emerging applications along with the cost-effective manufacture of legacy products, both of which benefit from production-ready remanufactured legacy semiconductor processing equipment — a market poorly supported by conventional suppliers. Under McKie’s guidance, memsstar will expand its portfolio of process capabilities and services to better supply the needs of its customers.

At the same time, single wafer dry release etch is seeing global adoption by the leading advanced MEMS manufacturers to overcome the process challenges associated with traditional wet etch and batch etch processes. memsstar’s proprietary sacrificial vapour release etch technology is market-proven and positioned to take advantage of emerging requirements for MEMS manufacturing.

"Tony has been a key resource as the company has developed," said Andrew Elder, non-executive director representing Albion Ventures. "His extensive knowledge of the industry, together with his vision for ongoing development and expansion, makes him the obvious choice to lead the company through its next stage of growth."

As one of memsstar’s founders, McKie was responsible for developing the memsstar range of technology products and managing business development activities for the single wafer release etch platforms. He brings an extensive background in semiconductor equipment manufacturing through prior management roles at Electrotech, Lam Research and Applied Materials.

The global semiconductor materials market decreased 2 percent in 2012 compared to 2011 while worldwide semiconductor revenues declined 3 percent. Revenues of $47.11 mark the first decline in the semiconductor materials market in three years.

Total wafer fabrication materials and packaging materials were $23.38 billion and $23.74 billion, respectively. Comparable revenues for these segments in 2011 were $24.22 billion for wafer fabrication materials and $23.62 billion for packaging materials. 2012 is the first time packaging materials revenues exceeded wafer fabrication materials revenues. A substantial decline in silicon revenue contributed to the year-over-year decrease to the total semiconductor materials market.

For the third year in a row, Taiwan is the largest consumer of semiconductor materials with record spending of $10.32 billion due to its large foundry and advanced packaging base. Materials markets in China and South Korea also experienced increases in 2012, benefiting from strength in packaging materials. The materials market in Japan contracted 7 percent, with markets also contracting in Europe, North America, and Rest of World. (The ROW region is defined as Singapore, Malaysia, Philippines, other areas of Southeast Asia and smaller global markets).

2011-2012 Semiconductor Materials Market by World Region
(Dollar in U.S. billions; Percentage Year-over-Year) 

Region 2011 2012 %Change
Taiwan 10.11 10.32 2%
Japan 9.21 8.53 -7%
Rest of World 8.21 8.09 -1%
South Korea 7.27 7.33 1%
China 4.87 5.07 4%
North America 4.86 4.74 -2%
Europe 3.31 3.03 -8%
Total 47.84 47.11 -2%

Source: SEMI April 2013

Note: Figures may not add due to rounding.

The Material Market Data Subscription (MMDS) from SEMI provides current revenue data along with seven years of historical data and a two-year forecast. A year subscription includes four quarterly updates for the material segments reports revenue for seven market regions (North America, Europe, ROW, Japan, Taiwan, South Korea, and China). The report also features detailed historical data for silicon shipments and revenues for photoresist, photoresist ancillaries, process gases and leadframes.

 

Controlling the shapes of nanometer-sized catalytic and electrocatalytic particles made from noble metals such as platinum and palladium may be more complicated than previously thought.

Using systematic experiments, researchers have investigated how surface diffusion – a process in which atoms move from one site to another on nanoscale surfaces – affects the final shape of the particles. The issue is important for a wide range of applications that use specific shapes to optimize the activity and selectivity of nanoparticles, including catalytic converters, fuel cell technology, chemical catalysis and plasmonics.

Results of the research could lead to a better understanding of how to manage the diffusion process by controlling the reaction temperature and deposition rate, or by introducing structural barriers designed to hinder the surface movement of atoms.

“We want to be able to design the synthesis to produce nanoparticles with the exact shape we want for each specific application,” said Younan Xia, a professor in the Wallace H. Coulter Department of Biomedical Engineering at Georgia Tech and Emory University. “Fundamentally, it is important to understand how these shapes are formed, to visualize how this happens on structures over a length scale of about 100 atoms.”

The research was reported April 8 in the early online edition of the journal Proceedings of the National Academy of Sciences (PNAS). The research was sponsored by the National Science Foundation (NSF).

Controlling the shape of nanoparticles is important in catalysis and other applications that require the use of expensive noble metals such as platinum and palladium. For example, optimizing the shape of platinum nanoparticles can substantially enhance their catalytic activity, reducing demand for the precious material, noted Xia, who is a Georgia Research Alliance (GRA) eminent scholar in nanomedicine. Xia also holds joint appointments in the School of Chemistry and Biochemistry and the School of Chemical and Biomolecular Engineering at Georgia Tech

“Controlling the shape is very important to tuning the activity of catalysts and in minimizing the loading of the catalysts,” he said. “Shape control is also very important in plasmonic applications, where the shape controls where optical absorption and scattering peaks are positioned. Shape is also important to determining where the electrical charges will be concentrated on nanoparticles.”

Though the importance of particle shape at the nanoscale has been well known, researchers hadn’t before understood the importance of surface diffusion in creating the final particle shape. Adding atoms to the corners of platinum cubes, for instance, can create particles with protruding “arms” that increase the catalytic activity. Convex surfaces on cubic particles may also provide better performance. But those advantageous shapes must be created and maintained.

Natural energetic preferences related to the arrangement of atoms on the tiny structures favor a spherical shape that is not ideal for most catalysts, fuel cells and other applications. 

In their research, Xia and his collaborators varied the temperature of the process used to deposit atoms onto metallic nanocrystals that acted as seeds for the nanoparticles. They also varied the rates at which atoms were deposited onto the surfaces, which were determined by the injection rate at which a chemical precursor material was introduced. The diffusion rate is determined by the temperature, with higher temperatures allowing the atoms to move around faster on the nanoparticle surfaces. In the research, bromide ions were used to limit the movement of the added atoms from one portion of the particle to another.

Using transmission electron microscopy, the researchers observed the structures that were formed under different conditions. Ultimately, they found that the ratio of the deposition rate to the diffusion rate determines the final shape. When the ratio is greater than one, the adsorbed atoms tend to stay where they are placed. If the ratio is less than one, they tend to move.

“Unless the atomic reaction is at absolute zero, you will always have some diffusion,” said Xia, who holds the Brock Family Chair in the Department of Biomedical Engineering. “But if you can add atoms to the surface in the places that you want them faster than they can diffuse, you can control the final destination for the atoms.”

Xia believes the research may also lead to improved techniques for preserving the unique shapes of nanoparticles even at high operating temperatures.

“Fundamentally, it is very useful for people to know how these shapes are formed,” he said. “Most of these structures had been observed before, but people did not understand why they formed under certain conditions. To do that, we need to be able to visualize what happens on these tiny structures.”

Xia’s research team also studied the impact of diffusion on bi-metallic particles composed of both palladium and platinum. The combination can enhance certain properties, and because palladium is currently less expensive than platinum, using a core of palladium covered by a thin layer of platinum provides the catalytic activity of platinum while reducing cost.

In that instance, surface diffusion can be helpful in covering the palladium surface with a single monolayer of the platinum. Only the surface platinum atoms will be able to provide the catalytic properties, while the palladium core only serves as a support.

The research is part of a long-term study of catalytic nanoparticles being conducted by Xia’s research group. Other aspects of the team’s work addresses biomedical uses of nanoparticles in such areas as cancer therapy.

“We are very excited by this result because it is generic and can apply to understand and control diffusion on the surfaces of many systems,” Xia added. “Ultimately we want to see how we can take advantage of this diffusion to improve the catalytic and optical properties of these nanoparticles.”

The research team also included Xiaohu Xia, Shuifen Xie, Maochang Liu and Hsin-Chieh Peng at Georgia Tech; and Ning Lu, Jinguo Wang and Professor Moon J. Kim at the University of Texas at Dallas.

 CITATION: Xia, Xiaoho, et al., “On the role of surface diffusion in determining the shape or morphology of noble-metal nanocrystals,” (Proceedings of the National Academy of Science, 2013). http://www.pnas.org/content/early/2013/04/05/1222109110

Silex Microsystems, the world’s largest pure-play MEMS foundry, and BroadPak, a provider of ultra-high performance 2.5D silicon interposer and 3D integration technologies, today announced the immediate availability of their jointly developed silicon interposer solution in high-volume manufacturing. Leveraging the advanced interposer co-design methodology and system integration expertise of BroadPak with the proven interposer manufacturing capabilities of Silex, this new solution delivers a cost-effective, ultra-high performance, reliable and high-yield silicon interposer that will enable a broader market to realize the benefits of 2.5D packaging

 While market analyst firm Yole Dévelopement expects the market for interposers to grow by 88 percent annually through 2017, Silex and BroadPak believe their partnership can accelerate this market adoption by overcoming the cost, engineering, reliability and supply chain bottlenecks.  3D-IC designs are widely recognized as the next step towards meeting the growing performance requirements such as increased bandwidth, reduced latency, and lower power.  2.5D silicon interposers, which are double-sided die used to stack chips side-by-side, have emerged as the most effective way to accelerate the adoption of 3D-IC, but these solutions are costly and complex, which presents significant design, integration, reliability and supply chain challenges. Recognizing these bottlenecks, Silex and BroadPak believe their new 2.5D silicon interposer product solves these hurdles that have prevented many companies from participating in this space.

“This partnership is a critical step in enabling companies to benefit from silicon interposers because most companies don’t have the integration techniques and methodologies to even start a 2.5D IC design and the current solutions have been too costly and high-risk to implement,” said Peter Himes, Vice President of Marketing and Strategic Alliances for Silex Microsystems.  “The combined Silex/BroadPak solution opens up this market to a very large portion of customers that have been unable to compete in this space due to overwhelming cost, engineering and integration challenges.”

“BroadPak and Silex have created a technical solution and the supply chain infrastructure that the industry has been waiting for,” said Farhang Yazdani, President and CEO of BroadPak. “To date, silicon interposer technology has been limited to a very small number of companies. We are now enabling the mass adoption of silicon interposer by lowering the cost and providing the co-design, heterogeneous integration and the required supply chain infrastructure in a complete package.”

 The Silex/Broadpak finished product consists of a robust interposer for 2.5D packaging, which has been designed and characterized for thermal-stress and signal integrity performance by BroadPak and also optimized for manufacturing by Silex. The unique challenges of 2.5D/3D-IC packaging require special engineering expertise to deliver cost effective solutions to meet the reliability, warpage and signal/power integrity requirements of the packaged components as well as an optimized and robust manufacturing process.

STMicroelectronics has introduced the world’s smallest TVS diode for protecting sensitive electronics in consumer products and handhelds.

As the first such device to be offered in the industry’s smallest standard surface-mount outline of 0.45 x 0.2mm, the ESDAVLC6-1BV2 is one size smaller than today’s 0.6 x 0.3mm devices.

The value of the space saving to designers can be seen by comparing with other chip sizes used in smartphones and tablets.

"A complete motion-sensing IC for features such as indoor navigation and advanced user interface, such as ST’s LSM303D, measures just 3 x 3mm, while some power chips are as small as 2 x 2mm," explains Eric Paris, product marketing director, ASD & IPAD Division, STMicroelectronics. "Trimming 0.2mm or 0.1mm from each TVS can simplify placing components and routing connections, especially if the design contains several such devices."

The ESDAVLC6-1BV2 TVS diode fully satisfies the protection requirements specified in the international standard IEC 61000-4-2. Although other types of electrostatic-discharge (ESD) protectors, such as varistors, are available in the same size, these generally do not protect as effectively. ST’s new ESDAVLC6-1BV2 has a clamping voltage half that of the nearest competing varistor in the same size package, offering greater safety for the internal components. Although useful in many applications, varistors also age, providing progressively less protection with each ESD event clamped.