Category Archives: Advanced Packaging

The microelectronics industry in Russia has been receiving quite a lot of attention recently with growing realization that intensive industry development is crucial to achieve import substitution and eventually compete in the international market. At the conference that took place recently in Zelenograd as part of SEMICON Russia 2013, which is devoted to the development of microelectronics in Russia, Practise Director of Frost & Sullivan’s Technical Insight division in Europe, Ankit Shukla, shared with the audience his vision for growth of the microelectronics industry in changing business conditions.

"A number of fundamental aspects need attention for the harmonious development of microelectronics," noted Mr. Shukla. "The foremost is government and the private sector support for new trends in the technology. The formation of a nuanced state policy oriented towards the interests of the industry and the business community will play a strong role in the development of the microelectronics market, both in Russia and across the world. In this regard, providing tax exemptions and institutional support for the industry is a necessity for its progress."

During the event, Frost & Sullivan and Semiconductor Equipment and Materials International (SEMI) presented the first results of the research entitled "The Russian Microelectronics Market" based on a survey of representatives from domestic and foreign companies operating in the Russian market. Results showed that for a three-year outlook, all respondents expect a positive growth trend for the market. In addition, 45 per cent of those surveyed believe that their turnover will outpace industry growth rates.

A majority – 64 per cent – of respondents expect the processors segment, including microcontrollers (MCUs) and microprocessor units (MPUs), to be among the most promising in the market. Other indicated areas of development included radiofrequency modules and components by 43 per cent, optoelectronics by 36 per cent, and microcircuitry and sensors by 29 per cent of respondents.

An effective support tool for the microelectronics industry is the creation of special economic zones and clusters as evidenced by the experience in Russia as well as Asian and European countries. Such economic zones already exist in Zelenograd and Skolkovo. Human resources can also be a compelling aspect as the educational level of Russian technical specialists has traditionally been highly valued in the world. Such potential will unquestionably help market growth but the problem of migration of highly qualified personnel to other countries is one that cannot be ignored. Thus, retaining professionals within the country and creating an attractive work environment for them should be a fundamental task to further market development.

"In order to excel in the microelectronics market we must develop partnership programs on several levels since a simple a technology-oriented approach will not be enough," advised Mr. Shukla. "Market participants must concentrate their efforts on diversification, development of new technologies, optimization of expenditure, and development of new market niches."

Researchers at UC Santa Barbara, in collaboration with University of Notre Dame, have recently demonstrated the highest reported drive current on a transistor made of a monolayer of tungsten diselenide (WSe2), a two-dimensional atomic crystal categorized as a transition metal dichalcogenide (TMD). The discovery is also the first demonstration of an "n-type" WSe2 field-effect-transistor (FET), showing the tremendous potential of this material for future low-power and high-performance integrated circuits.

This is a schematic view of a back-gated field-effect-transistor fabricated by UCSB researchers using monolayer tungsten diselenide (WSe2) channel material.

Monolayer WSe2 is similar to graphene in that it has a hexagonal atomic structure and derives from its layered bulk form in which adjacent layers are held together by relatively weak Van der Waals forces. However, WSe2 has a key advantage over graphene.

"In addition to its atomically smooth surfaces, it has a considerable band gap of 1.6 eV," explained Kaustav Banerjee, professor of electrical and computer engineering and Director of the Nanoelectronics Research Lab at UCSB. Banerjee’s research team also includes UCSB researchers Wei Liu, Jiahao Kang, Deblina Sarkar, Yasin Khatami and Professor Debdeep Jena of Notre Dame. Their study was published in the May 2013 issue of Nano Letters.

"There is growing worldwide interest in these 2D crystals due to the many possibilities they hold for the next generation of integrated electronics, optoelectronics and sensors," commented Professor Pulickel Ajayan, the Anderson Professor of Engineering at Rice University and a world renowned authority on nanomaterials. "This result is very impressive and an outcome of the detailed understanding of the physical nature of the contacts to these 2D crystals that the Santa Barbara group has developed."

"Understanding the nature of the metal-TMD interfaces was key to our successful transistor design and demonstration," explained Banerjee. Banerjee’s group pioneered a methodology using ab-initio Density Functional Theory (DFT) that established the key criteria needed to evaluate such interfaces leading to the best possible contacts to the monolayer TMDs.

The DFT technique was pioneered by UCSB professor emeritus of physics Dr. Walter Kohn, for which he was awarded the Nobel Prize in Chemistry in 1998. "At a recent meeting with Professor Kohn, we discussed how this relatively new class of semiconductors is benefitting from one of his landmark contributions," said Banerjee.

Wei Liu, a post-doctoral researcher in Banerjee’s group and co-author of the study, explained, "Guided by the contact evaluation methodology we have developed, our transistors achieved ON currents as high as 210 uA/um, which are the highest reported value of drive current on any monolayer TMD based FET to date." They were also able to achieve mobility of 142 cm2/V.s, which is the highest reported value for any back-gated monolayer TMD FET.

"DFT simulations provide critical insights to the various factors that effectively determine the quality of the interfaces to these 2D materials, which is necessary for achieving low contact resistances." added Jiahao Kang, a PhD student in Banerjee’s group and co-author of the study.

"Nanoelectronics and energy efficient computing technology are key areas of research at UCSB, fields in which our faculty members are renowned for their achievements. With these results, Professor Banerjee’s team continues to make important research contributions to next-generation electronics," commented Rod Alferness, dean of the College of Engineering at UCSB

MEMS devices are proliferating in mobile devices. Yole Développement counts 25+ sensors and actuators in production or in development for mobile applications, including MEMS accelerometers, MEMS gyroscopes, magnetometers, 6-axis e-compasses, 6-axis IMU combos, 9-axis combo solutions, silicon microphones, microspeakers, pressure sensors, humidity/temperature sensors, BAW filters and duplexers, MEMS switches and variable capacitors, silicon MEMS oscillators/resonators, micromirrors for picoprojectors, microdisplays, MEMS auto-focus, IR sensors and micro bolometers, bio-chemical detectors & gas sensors, MEMS touchscreen, MEMS joystick, radiation detectors, MEMS fuel cells, energy harvesting, UV sensors, ultrasonic sensors and more.

The past 12 months have seen big changes. While in the past, cell phone MEMS were limited to three categories (inertial, microphones and filters), we’ve seen strong adoption of new device types targeting environmental sensing. Also, pressure sensors are being heavily adopted in flagship phones and tablets, and humidity sensors are being adopted in the Samsung Galaxy S4. All of these new MEMS killer applications are detailed in Yole Développement’s report.

Changes have even occurred in existing high-volume MEMS areas:

  • Significant architectural changes have been observed in inertial sensors, with current strong adoption of IMU combo sensors. Likewise, a new opportunity has appeared with a camera module’s dedicated OIS gyroscope.
  • A trend has appeared involving integration of a third MEMS microphone to provide HD voice recording (i.e. in the iPhone 5), in addition to the dual microphone architecture described in the last report. This trend is a market booster.
  • Strong adoption of LTE in high-end platforms will boost the duplexer market for the next three years.

The long-term outlook for MEMS companies is brighter than ever, as existing products and products just ramping up will drive solid growth over the next few years. Additionally, a new wave of MEMS products will enable further growth. This report describes why some of these emerging MEMS will ramp up in volume almost overnight, just as pressure and humidity sensors did in the past few months. A nice 19 percent yearly growth is predicted for a market that reached $2.2 billion in 2012, and volume growth will be even more impressive, with 17.5 billion units expected by 2018, up from 4.5 billion in 2012.

Sensor fusion is heating up with its first commercial implementations

As sensor popularity enables new applications, software is key for obtaining the best performance and functionalities. Sensor hubs appeared at the end of 2012, in Windows Phone architectures and also in some Android platforms such as the Samsung Galaxy Note 2 and Galaxy S4, which integrate Atmel hub. This greatly impacts the MEMS value chain, since successful products must offer the right level of software and be qualified with sensor hubs in a timely manner.

Sometime in 2013, evolution is still expected in value partitioning, in particular with sensor fusion integration in the application processor. Also, as the value chain continues moving and novel architectures appear, new killer functionalities will hit the market. In particular, an ecosystem for context awareness or indoor navigation is put in place, with technology demonstrations (such as Movea’s recent demo at CES) and release of the first commercial chipsets enabling new sensor and data fusion concepts (Qualcomm iZat, Gimbal, CSR SiRFusion Platform, etc.). The most recent end- user trends shaping demand for next-generation MEMS devices are carefully analyzed in this report. In fact, one of the strongest impacts on sensor fusion architecture is the growth of connected devices and the use of the cell phone as a hub.

A price war and market share erosion – all in the last year

A large, growing market often comes with a strong price decrease.

“This is true for MEMS in mobile devices, as was observed in 2012,” says Laurent Robin, Activity Leader, Inertial MEMS Devices & Technologies. “Continuous competition between STMicroelectronics and InvenSense, and the arrival of a third player in gyroscope and IMU, had a significant impact on pricing — which decreased 25 percent in just one year!”

In the magnetometer area, the price decrease was even more significant, at 35 percent. Memsic’s aggressive pricing strategy forced market leader AKM to realign. Detailed analysis is available in Yole Développement’s report.

While the big guys still dominate this field and possess most of the business, things are changing. For example, in some cases Yole Développement’s analysts have seen an erosion of market share, for reasons described in this report. In fact, this analysis shows that in one year, Knowles lost 19 percent market share, AKM eight percent and Avago two percent in their respective markets.

Opportunities for challengers are emerging every day, driven by several factors:

  • Technology shift linked to the demand for higher performance in order to enable new-end functionalities and integration levels (this may be happening for magnetometers)
  • New business models, such as integrating MEMS dies, which are sold off-the-shelf (typically by Infineon)
  • Adoption of disruptive concepts for new sensors and actuators

Out of the 20+ players currently doing business in mobile MEMS applications, only three have been able to successfully diversify by enlarging their MEMS product portfolio. It’s a difficult achievement because Yole Développement’s MEMS law remains valid: there is still no standardization for MEMS products and processes. However, all industry players are actively looking to provide new functions and launch new components.

Multitest’s James Quinn will present during the 2013 SEMICON West exhibition and conference, scheduled to take place July 9-11, 2013 at the Moscone Center in San Francisco, CA. The presentation, entitled “Quality in 3D Assembly- Is KGD Enough,” will enable the audience to understand the additional risks of 3D assembly and match them with their own situation.

Quinn will provide an overview of the current discussion in the industry and how to manage the risks of 3D assembly. Also, the audience will learn more about the special requirements of the new approaches and understand their pros and cons. The audience will be able to apply the presented concepts to their own 3D business models. The most appropriate equipment will be discussed: What are the limitations of using probing tools or deploying final test equipment? Which strategy will offer the most synergies and reduce cost of test in the end? Finally, an analogy with the MEMS will give an interesting perspective on how to leverage the expertise that has been gained during the last decade.

Quinn is the VP of Sales and Marketing at Multitest. He has a strong semiconductor background and has served as executive VP responsible for sales and marketing at respected companies including Süss Microtec AG, MD of Süss Microtec Inc. in the U.S., and most recently as CEO of a venture capital wafer front-end equipment company in Sweden and France. Quinn studied business administration and marketing at San Francisco State University.

Imec presents a CMOS image sensor capable of capturing 12-bit 4,000×2,000 pixel progressive images at 60 frames per second (fps). Based on a stagger-laced dual exposure, the image sensor developed with Panasonic, was processed using imec’s 130nm CMOS process on 200mm silicon wafers to deliver high-speed and high-quality imaging, at reduced output bit rate.

The number of pixels on image sensors in video and still cameras keeps increasing, along with the frame rate and bit resolution requirements of the images. 4K2K will be the next-generation broadcasting format, offering an increase by a factor of two in both horizontal and vertical resolution compared to current state-of-the-art High Definition TV. 

The image sensor chip is a floating diffusion shared 4T pixel imager, with a pitch of 2.5 micron and a conversion gain of 70 μV/e-, which allows for both a classical rolling shutter or stagger-laced scanning mode. The 4K2K 60-fps imaging performance is realized by 12-bit column-based delta-sigma A/D converters. The stagger-laced scanning method improves imaging sensitivity and realizes a 50 percent reduction in output data rate by alternating the readout of two sets of horizontal pixel pairs arranged in two complementary checkerboard patterns. Additionally, the overall power consumption of the imager is less than two Watts.

“This is an important milestone for imec to demonstrate our capability to co-design, prototype and manufacture high performance CMOS image sensors in our 200mm CMOS fab,” commented Rudi Cartuyvels, senior vice president of Smart Systems  and Energy Technologies at imec.

The glass slimming market topped $600 million in value in 2012 and is forecast to continuously grow to surpass $1 billion in 2014, according to a new report released by Displaybank.

 

Slimness and lightness are key competitive factors of consumer IT devices that use flat panel displays such as TFT-LCD and OLED. Display makers are responding to market changes by slimming down the glass substrate used in consumer goods as part of an effort to reduce the weight and thickness of finished goods, while finding ways to select the less heavy hardware at the same time.

Reducing the thickness of a glass substrate to cut its weight has proven to be the most effective way to make a flat panel display thinner and lighter. However, if a glass substrate used in the TFT or cell manufacturing process starts off as a thin sheet, it runs into many difficulties because of the variables arising from the LCD module, or OLED manufacturing process. Thus, it is essential to slim the glass substrate through chemical and physical methods at the time when the cell production process is completed. This process is called glass slimming.

The glass slimming industry requires both chemical materials and process technologies. The glass slimming process can be divided into a chemical etching method, in which the glass substrate of laminated LCD panels is chemically etched after TFT process and color filter process are completed, and a physical polishing method. The general trend these days is moving towards chemical etching.

This report analyzes glass slimming technologies, which are processes used to reduce the glass thickness and weight after TFT LCD or OLED panels are made, and provides the industry outlook and forecasts.

EV Group and Dynaloy, LLC today introduced CoatsClean—an single-wafer photoresist and residue removal technology designed to address thick films and difficult-to-remove material layers for the 3D-ICs/through-silicon vias (TSVs), advanced packaging, MEMS and compound semiconductor markets.  In its official press release, EVG said CoatsClean provides a complete wafer cleaning solution that offers significant efficiency, performance and cost-of-ownership (CoO) advantages compared to traditional resist stripping and post-etch residue removal methods.

"Increasing wafer processing challenges associated with the adoption of new materials, device architectures and packaging schemes requires a new, holistic view of wafer cleaning, where the chemistry, process and equipment are all critically important and must be addressed in combination," stated Steven Dwyer, business director at Dynaloy.  "We’re pleased to be working with EV Group on developing and commercializing CoatsClean technology to meet the needs of our customers for a more cost-effective, flexible approach to thick-film resist removal."

The CoatsClean process and chemical formulation are engineered to perform at higher temperatures, resulting in faster stripping rates and cycle times.  This enables CoatsClean to operate as a single-wafer process for thick resist films and difficult-to-remove resists—resulting in improved performance, consistency, reproducibility and repeatability.  The engineered formulation also enables selective stripping of the resist.

CoatsClean is also unique in its ability to dispense a small amount of material on the top of the wafer, and then activate the material with direct heat.  This direct utilization of the material and heat dramatically reduces the strip material used.  CoatsClean uses fresh solution for each processed wafer compared to competing techniques that use an immersion bath—resulting in greater process efficiency and eliminating cross contamination.  The highly selective application of resist strip material eliminates damage to the wafer backside.  The entire CoatsClean process is performed in a single bowl, which reduces tool footprint.

"CoatsClean applies the right chemistry at the right process conditions to provide optimal cleaning results," stated Paul Lindner, EV Group’s executive technology director.  

EV Group will be responsible for selling the CoatsClean systems and providing customer support, while Dynaloy will be responsible for selling the CoatsClean resist stripping materials.  CoatsClean systems have already been installed for customer demonstrations, and EVG and Dynaloy are now accepting orders for the systems and resist stripping materials.

At this week’s International Image Sensor Workshop (IISW 2013, Snowbird, Utah, June 12-16 2013), imec and Holst Centre presented a large-area fully-organic photodetector array fabricated on a flexible substrate. The imager is sensitive in the wavelength range suitable for x-ray imaging applications.

Because of their very high absorption coefficient, organic semiconductors allow extremely thin active layers (10 to 50 nm). Also, given their low processing temperature, they can be processed on foils. As a result, organic imagers can be more robust and light-weight compared to their traditional counterparts and may be used for conformal coating of randomly shaped substrates. Moreover, the wide variety of organic molecules available ensures that the properties of the active layer can be tuned to applications requiring specific wavelength ranges.

The presented imager is sensitive in the wavelength range between 500 and 600nm, making it compatible with typical scintillators and therefore suitable for x-ray imaging applications. It was fabricated by thermally evaporating an ultrathin (submicron) photosensitive layer of small, organic molecules (SubPc/C60) on top of an organic readout circuit. A semi-transparent top contact enables front-side illumination. The readout backplane was manufactured on six-inch foil-laminated wafers. It consists of pentacene-based thin-film transistors (TFTs) in arrays of 32×32 pixels with varying pitch (1 mm and 200 µm). To prevent degradation of the organic semiconductors in the air, the photodetector array is encapsulated. The imager was characterized under illumination with a calibrated green light-emitting diode (LED), yielding a linearly increasing photocurrent from the incident power of 3 µW/cm2. Dark current density is below 10-6 A/cm2 at a bias voltage of -2V.

organic, flexible imager
Fully-organic, flexible imager developed by imec, Holst Centre and Philips Research

“This latest achievement is a significant step forward in not only finding the optimal materials, but pinpointing the best ways to process materials into reliable organic circuits and systems with state-of-the-art performance,” said Paul Heremans, technology director at the imec/Holst Centre. “Once again, we’re proud to demonstrate how imec’s top-notch research leads to relevant industrial solutions, and subsequently brings added value to our partners’ businesses.”

This research results are presented in collaboration with Philips Research, at the (2013 International Image Sensor Workshop (IISW), sponsored by the International Image Sensor Society (IISS), June 12-16, 2013.

The global semiconductor foundry United Microelectronics Corporation announced the opening of its UMC Korea office. UMC intends for this office to help expand regional business and provide local support to customers. In its official release, UMC said the proximity of its new office to its Korean customers will create working synergies that will help expedite engagement and support, thus shortening time-to-market for Korea-based customers designing and manufacturing on UMC process technologies.

Steve Wang, vice president in charge of Asia sales division at UMC said, "Korean companies have been deeply involved in the global IC supply chain as high-tech applications become increasingly mobile with more demands on power saving, portability, and performance. We see this as a great opportunity to partner with Korea based IC companies as they can take advantage of UMC’s expertise in power management, display driver, touch panel IC, and leading-edge process technologies as well as our flexible, collaborative foundry working model. We look forward to creating new opportunities with Korea-based customers with the opening of UMC’s new Korea office."

In addition to opening its Korea office, UMC was the first independent foundry to introduce a Korean language website.

SEMI, the global industry association for companies that supply manufacturing technology and materials to the world’s chip makers, today reported that worldwide semiconductor manufacturing equipment billings reached US$ 7.31 billion in the first quarter of 2013. The billings figure is 8 percent higher than the fourth quarter of 2012 and 32 percent lower than the same quarter a year ago. The data is gathered jointly with the Semiconductor Equipment Association of Japan (SEAJ) from over 100 global equipment companies that provide data on a monthly basis.

Worldwide semiconductor equipment bookings were $7.78 billion in the first quarter of 2013. The figure is 23 percent lower than the same quarter a year ago and 14 percent higher than the bookings figure for the fourth quarter of 2012.

The quarterly billings data by region in billions of U.S. dollars, quarter-over-quarter growth and year-over-year rates by region are as follows:

The Equipment Market Data Subscription (EMDS) from SEMI provides comprehensive market data for the global semiconductor equipment market. A subscription includes three reports: the monthly SEMI Book-to-Bill Report, which offers an early perspective of the trends in the equipment market; the monthly Worldwide Semiconductor Equipment Market Statistics (SEMS), a detailed report of semiconductor equipment bookings and billings for seven regions and over 22 market segments; and the SEMI Semiconductor Equipment Consensus Forecast, which provides an outlook for the semiconductor equipment market.