Category Archives: Advanced Packaging

ISORG and Plastic Logic have co-developed the first conformable organic image sensor on plastic, with the potential to revolutionize weight/power trade-offs and optical design parameters for any systems with a digital imaging element. First mechanical samples will be publicly unveiled at LOPE-C 2013 (ISORG / CEA booth B0-509) from June 12 to 13 in Munich, Germany.

The collaboration is based on the deposition of organic printed photodetectors (OPD), pioneered by ISORG, onto a plastic organic thin-film transistor (OTFT) backplane, developed by the technology leader, Plastic Logic, to create a flexible sensor with a 4×4 cm active area, 375um pitch (175um pixel size with 200um spacing) and 94 x 95 = 8 930 pixel resolution.

organic image sensor

The backplane design, production process and materials were optimized for the application by Plastic Logic to meet ISORG’s requirements. The result, a flexible, transmissive backplane, represents a significant breakthrough in the manufacture of new large area image sensors and demonstrates the potential use of Plastic Logic’s unique flexible transistor technology to also move beyond plastic displays. Combined with ISORG’s unique organic photodetector technology, it opens up the possibilities for a range of new applications, based around digital image sensing, including smart packaging and sensors for medical equipment and biomedical diagnostics, security and mobile commerce (user identification by fingerprint scanning), environmental, industrial, scanning surfaces and 3D interactive user interfaces for consumer electronics (printers, smartphones, tablets, etc.).

ISORG’s CEO, Jean-Yves Gomez stated: “We are extremely pleased to showcase our disruptive photodiode technology in a concrete application for imaging sensing. The ability to create conformal and large area image sensors, which are also thinner, lighter and more robust and portable than current equipment is of increasing importance, especially in the medical, industrial and security control sectors.”

Indro Mukerjee, CEO Plastic Logic said: “I am delighted that Plastic Logic can now demonstrate the far-reaching potential of the underlying technology. Our ability to create flexible, transmissive backplanes has led us not only to co-develop a flexible image sensor, but is also key to flexible OLED displays as well as unbreakable LCDs.”

For the first time ever, no clear winner has emerged to claim top honors in the MEMS business for 2012, with Bosch of Germany and French-Italian STMicroelectronics ending up evenly splitting the title of No. 1 supplier for the year, according to a MEMS Competitive Analysis Report from information and analytics provider IHS (NYSE: IHS).

With both companies just shy of the $800 million mark, Bosch and STMicroelectronics each had MEMS revenue of approximately $793 million in 2012. The two companies do not use the same exchange rates every quarter when converting their revenue from euros to the U.S. dollar, and as a difference of less than 1 percent separates the revenue levels of both, IHS found it was not possible this time to declare a clear winner as to who was No. 1 for 2012.

“With billions of dollars up for grabs, competition in the MEMS market is intense,” said Jérémie Bouchaud, director and senior principal analyst for MEMS & sensors at IHS. “Nowhere is the rivalry more furious than the battle for the market’s top spot. In fact, the content for number one is so closely contested that Bosch and STMicroelectronics battled each other to a draw in 2012.”

MEMS in the money

Overall, the top 20 MEMS manufacturers last year accounted for a whopping 77 percent of the industry total of some $8.3 billion, as shown in Table 1. The figure excludes foundry revenue in order to avoid double-counting of fabless and foundry takings within the same ranking. For instance, excluded is MEMS foundry revenue from STMicroelectronics for its fabrication of Hewlett-Packard inkjet print heads, or similar foundry revenue from Texas Instruments for Lexmark inkjet print heads.

top 20 mems suppliers
Table 1.

Foremost among all the players were the four companies at the top, each with revenue ranging from $675 million to $800 million, and collectively well ahead of the rest of the pack.

Bosch vs. STMicroelectronics

Bosch, the No. 3 entity in 2011, enjoyed a MEMS revenue boost of 8 percent last year including a nearly 5 percent uptick in its primary automotive MEMS business, which accounted for 82 percent of overall Bosch MEMS takings. Bosch is unchallenged as the top automotive MEMS supplier with 27 percent share of the market. The company also has a growing consumer and mobile MEMS trade—up 17 percent for the year—thanks to the soaring sales of pressure sensors in handsets, compensating for slightly down revenues in accelerometers and microphones. But while the company did well in 2012, its result was impacted by an unfavorable exchange currency rate, especially in its U.S. automotive business.

STMicroelectronics, the No. 4 player in 2011, counted on a robust consumer and mobile business as its main source of MEMS revenue. While rival Bosch dominates automotive, STM leads in consumer and mobile MEMS with 32 percent of the market. STM also made inroads into automotive with $15 million in 2012, up from $10 million the year earlier. Gyroscopes were ahead of accelerometers in contributing to STM’s cache, and similar to Bosch, pressure sensors for handsets boomed because of shipments into smartphones like the Samsung Galaxy S III.

Texas Instruments tumbles from the top

Falling out of the No. 1 spot was Texas Instruments, down to No. 3, with revenue down 3 percent to $751 million. While front projectors for business and education still formed the majority of its digital light processing (DLP) chip revenue, the segment was flat last year. In particular, DLP revenue in home theater and rear-projection TVs was down, especially with the exit of Mitsubishi as the last remaining rear-projection TV brand in North America. DLP revenue for pico-projectors also has not taken off as expected, with the chipset still too expensive and its adoption slow in the consumer and mobile markets.

At the No. 4 spot was Hewlett-Packard with revenue of $677 million. HP also suffered a drop in ranking, down from No. 2 in 2011, as revenue associated with its inkjet printer heads contracted 10 percent last year. This follows a 15 percent decline in the shipment of inkjet printers. Moreover, HP’s revenue from the replacement of disposable print heads has been shrinking continually as the company long ago started to move to printers with permanent print heads.

Rounding out the Top 5 but at a relatively far remove from the four other companies above it was Canon of Japan, with revenue of $377 million.

InvenSense on the rise

In all, revenue for companies from the succeeding sixth spot all the way to No. 15 each had takings between $100 million to just under $300 million.

Worth noting outside of the Top 5 was California-based InvenSense at No. 13, with revenue up 30 percent to $186 million. InvenSense is the most successful MEMS startup ever, its market breakthrough coming in 2009 thanks to its design in the Nintendo Wii Motion Plus gaming accessory. While InvenSense initially had been heavily dependent on gaming, the company wisely diversified its business and now looks to handsets and tablets as even more important sources of revenue.

InvenSense has also pioneered serial production of 6-axis inertial measurement unit comprising accelerometers and gyroscopes in a 4 x 4-millimeter package. Combo sensors last year accounted for half of the company’s revenue, and InvenSense is now producing a very small 9-axis inertial measurement unit also containing a 3-axis magnetometer that measures only 3 x 3 millimeters.

In an industry where finer features are driving market needs, current deposition processes are no longer sufficient to address challenges like interconnect dimensions below 16/14nm or high aspect ratio TSVs (>8) without experiencing defects, voids, or low reliability. Beyond process performance, cost remains a critical consideration for manufacturing next-generation devices. Today, Alchimer is announcing a new collaboration with imec to validate its wet deposition technology.

Alchimer is a provider of wet deposition technologies for dual damascene, TSVs, MEMS and solar. The new joint development project with imec will evaluate and implement copper filling solutions for advanced nano-interconnect technologies. The focus of the project will be on Alchimer’s Electrografting products, which have demonstrated void-free filling on 7nm node devices and allow direct Cu fill on barrier with no seed layer required for damascene processes.

As CMOS scaling creates finer features, market requirements for copper damascene include smaller dimensions (≤16/14 nm) with a thin barrier layer, and thin or no Cu seed layer. Filling processes must be defect/void free to meet reliability specifications, and achieve high yields. Conventional physical vapor deposition (PVD) and chemical vapor deposition (CVD) processes are not meeting these requirements. Alchimer’s wet deposition technologies are based on a molecular build-up process that breaks through the limitations of dry deposition processes.

"We believe that as the industry moves to smaller technology nodes, performance and cost will drive technology adoption," said Bruno Morel, CEO of Alchimer. "The performance of eG in advanced damascene applications, including single and dual damascene below 20nm, hasbeen very promising both in terms of performance and cost of ownership. Collaborating with imec gives us access to tremendous resources to validate our technology’s suitability at 300mm and understand what it would take to get ready for 450mm."

The goal of the JDP is to obtain reliability data and electrical performance for eG wet deposition processes in a 300mm manufacturing environment for sub-22nm technologies. As part of the JDP, the companies will assess the plating chemistry and work to identify the optimal process conditions for 300mm wafer-level advanced damascene plating applications.

 

 

Sapphire is currently used in some exotic, luxury phones. However, the sapphire price reduction combined with the massive adoption of touch screens in smartphones have stimulated the interest of cell phone OEMS for this material. Crystal growth equipment manufacturer GTAT is leading the charge and recently created a lot of buzz around this application and on the OEM front. Apple is rumored to have conducted an extended due diligence.

Adoption of sapphire in mobile display covers represents the single largest opportunity. It remains, however, uncertain. Yole Développement sees four major challenges: technology, supply chain, cost and market acceptance. Crystal growth and finishing technologies still need to be optimized in order to guarantee stable performance and reduce the price gap with chemically strengthened glass like Corning’s Gorilla. Yole Développement’s analyst estimates that the current cost of manufacturing a sapphire display cover is around $22 but could drop to $12 and ultimately below $10. It remains to be seen if the bill of material increase vs. the $3 glass display cover will be absorbed by the OEM in exchange for increased market share or if the consumer will value the increased durability brought in by the sapphire cover and accept paying a premium.

sapphire substrate use

It is difficult to predict the success of sapphire in this application. However, Yole Développement expects that some OEMs will probe the market and introduce some models featuring sapphire by late 2013 – early 2014. Initial customer reaction will have a strong influence on the future of the technology. If successful, strong market traction could ease the funding for the more than $1.5 billion in capex needed to serve this industry and set up the supply chain to serve this application.

Glass cover lens manufacturers might seize the opportunity. Because of their vast existing glass finishing capacity that could be converted to process sapphire and their privileged access to leading smartphone OEMs, those companies could beat established sapphire finishing companies into this market. However, another scenario would see collaborations between some leading sapphire and cover lens makers in order to pool technical knowledge, capacity and customer access under the push of some smartphone OEMs.

In any case, if this opportunity materializes, it will transform the sapphire industry with new players emerging, and overall production capacity increasing by a factor of more than 7x.

Defense semiconductor and other applications represent 25% of the sapphire industry revenue

“These applications will bring in revenue of $240 million in 2013 and, excluding the display cover opportunity, will increase at a nine percent CAGR to US$366 million in 2018. Watch windows are currently the single largest application with revenue of US$120 million in 2012. Most applications are fairly mature with relatively low growth opportunity with the exception of the emerging mobile device camera lens cover and the aerospace market, driven by the F-35 jet fighter program and the emergence of sapphire-based transparent armors,” explains Eric Virey, senior analyst, Compound Semiconductors, at Yole Développement.

Most applications have their own “eco-systems” with preferred material vendors, finishing companies, growth technologies and barrier of entrance. The defense market, for example, is characterized by strong technical barriers in both growth and finishing, combined with export restrictions and national preferences. The semiconductor market is also fairly concentrated with two companies, Saint-Gobain Crystals and Gavish which both hold the bulk of the market due to their technology for growing the large sapphire tubes used in many plasma tools. However, competition is increasing on simpler parts like viewports and lift pins.

Industry transformation could open the door for new applications

Driven by the promise of large volumes for the LED industry, sapphire crystal growth and manufacturing capacity has increased by more than 8x in the last five years. In just the last two years, more than 80 companies have announced their intention to enter the industry, bringing the potential number of players to 130+ with more than 50 of these potential new entrants located in China.

The entrance of aggressive new players with large idle capacity is likely to challenge established players in many applications. Yole Développement expects those players to initially enter domestic and international markets with low barrier of entrance and later expand their reach as their technology matures.

Excess capacity and increased competition have created a challenging environment for sapphire makers. However, they also drove prices down dramatically and stimulated technology improvements to further reduce cost and improve capability (crystal sizes, shapes …). Yole Développement expects that ultimately, this will be favorable for the industry: lower price and improved crystal growth and finishing capabilities will open the door to a large gamut of new applications where sapphire has been considered for its performance but never adopted because of its cost.

David DiPaola is managing director for DiPaola Consulting a company focused on engineering and management solutions for electromechanical systems, sensors and MEMS products.  A 17 year veteran of the field, he has brought many products from concept to production in high volume with outstanding quality.  His work in design and process development spans multiple industries including automotive, medical, industrial and consumer electronics.  He employs a problem solving based approach working side by side with customers from startups to multi-billion dollar companies.  David also serves as senior technical staff to The Richard Desich SMART Commercialization Center for Microsystems, is an authorized external researcher at The Center for Nanoscale Science and Technology at NIST and is a senior member of IEEE. Previously he has held engineering management and technical staff positions at Texas Instruments and Sensata Technologies, authored numerous technical papers, is a respected lecturer and holds 5 patents.  To learn more, please visit www.dceams.com.    

In the development of new MEMS products, the team is the most important factor.  Executive management and investors will always evaluate teams and will only take large risks with teams that have earned their trust. In response to a question, I asked Rich Templeton (CEO of Texas Instruments) regarding how he made the decision to invest in a new technology, a portion of his response highlighted the evaluation of and betting on teams. This is driven by the fact that it is actually quite common for engineers and entrepreneurs to lead multiple successful projects or startups over their career. With this in mind, let’s review the necessary attributes that make these engineers and entrepreneurs so successful in MEMS new product development. 

Integrity:  This is the foundation upon which all other attributes are built. Truthfulness, consistency and accuracy of one’s actions is of utmost importance, as without it you have nothing. This is not something that is exercised in part or stretched. It needs to embody who you are.        

Good Judgment: An equally important attribute to integrity is a person’s ability to exercise discernment. It’s the skill of knowing what information is needed to make a sound decision, how to efficiently gather that information, being decisive and achieving positive outcomes a significant portion of the time. It also entails the ability to lead when large gaps in information exist and managing the associated risk. Engineers who use good judgment only reevaluate decisions for change as new information becomes available. Furthermore, they study given information, decisions made and outcomes to hone this skill over time. 

Details: The details are what make products robust with ultra high reliability. A small detail can often make the difference in achieving or missing a specified performance target. For example, overlooking the use of a getter in a MEMS device with a vacuum cavity could result in output drift if materials out gas over time. Understanding the detailed physics of the problem at hand is also critically important. 

Ability to Learn: Technology and human understanding of complex systems continues to evolve. In order to be successful, a individual must have the desire and ability to learn as new information becomes available. The MEMS industry is constantly changing with CMOS and nanotechnology integration, smaller feature sizes, optimized processes, standardization, sensor fusion and more.  Those who are unwilling to learn from not only their work but the credible work of others will have difficultly producing competitive products.       

Problem Solving:  This is really a combination of proper methodology, attention to details and the ability to learn. Experts in a field that know the answer before they start, rarely solve problems. In running a design of experiments (DOE) of a MEMS sensor with a flip chip on flex laminated to a plastic substrate, pressure, time and heat were varied in a effort to eliminate voids in the laminate material and optimize process parameters. The first DOE resulted in multiple large voids over all parameters showing no noticeable trends. Through a methodology of identifying alternate factors and testing hypothesizes, it was then discovered that moisture impregnated in the plastic substrate and flex circuit itself was actually introducing voids in the laminate as it out gassed during the lamination process. Once the moisture was removed either through a prebake or proper material handling, the voids were no longer present. A subsequent DOE was completed including moisture as a factor and the process was optimized. In a confirmation experiment, the predicted worst-case process parameters resulted in large lamination voids and the optimized case demonstrated lamination with no voids and excellent adhesion.     

Motivation / Passion:  The drive behind peoples’ actions and its alignment with project goals are essential. Are they doing it because they love it and in essence it is a part of their DNA or is it simply a paycheck? Does the subject matter wake them up in the morning because they can’t wait to get started? Do their eyes light up, their voice become invigorated and their body language become expressive when they speak? Do off shoots of their passion migrate into their personal time off? These are some of the characteristics that highly motivated and passionate people display. I had the privilege of discussing entrepreneurism and leadership with Ray Stata, founder and chairman of Analog Devices, a few years ago. Through words and action, his passion is intertwined throughout ADI. When their MEMS division was starting out and encountering difficultly, he showed his commitment to the business by becoming the general manager. He figured the company would not fire the founder although they could. In his spare time, he continues to show his entrepreneurial spirit as he lives vicariously through his investments in and mentoring of technology startups. Everyone I have spoken to at ADI speaks highly of him. Mr. Stata is an excellent example of the type of person you want on your team.

Creativity:  The ability to think in new ways is extremely important. It’s having the wherewithal to take an idea that appears crazy at the time and figuring out a way to make it work and provide a competitive advantage. Devices that provide outstanding function and have an elegant, eye-pleasing package with a captivating yet easy to use interface exude creativity. An example of creatively in action is the first generation Apple iPhone. When it was first released, it revolutionized the smart phone approach and the smart phone leader at the time is still recovering after large market share loss. 

Experience: When looking at job descriptions, the top requirement is often education level. This approach is not robust. Let me explain. If you were going to launch a MEMS device in production and wanted to hire an engineer, who would you choose: 1) A person with a bachelor’s degree in physics who launched several profitable MEMS products in millions of units per year successfully or 2) a person with a PhD in the subject matter of interest and an MBA with little industry experience? This is hypothetical, but it illustrates a point. Education is extremely important, but the method through which it is obtained is less critical and can take many forms. The CEO of Tumblr dropped out of high school in his freshman year because his school system had a weak computer science program. Instead he and his parents agreed for him to pursue his education through alternative, more productive channels. As recently highlighted in the news, he just sold his company for $1.1 billion to Yahoo. He cites that he worked with and learned a tremendous amount from the smart people he surrounded himself with.      

Persistence: The quality of steadily continuing despite difficult challenges along the way is a necessary characteristic of all accomplished engineers. People who are persistence are often mislabeled as stubborn. The key difference is persistent people listen to good reason and are cooperative. However, being cooperative does not mean going along with the direction from those in authority that logical reason and data shows is the wrong path. Instead staying the course and using influential communication with supporting data and analysis to gain needed support is a better approach.      

Communication:  Proper communication is not only used to transfer information but also to persuade doubters with good reason. This is an essential skill for interaction with customers, colleagues, investors and management. An engineer with good communication skills can explain a complex problem in a well-articulated, concise and simplified manner without skipping critical details. In the end, the listener understands what was accomplished, how it was done, critical details and the resulting impact of the project. 

Influence:  Individuals in MEMS new product development will encounter resistance from various people along the way. This could be from management, investors or colleagues. Hence the ability of individuals to affect the thinking and actions of others through sound reasoning, credible data, persistence and convincing plans is necessary to bring MEMS products to fruition. For many years, there were critics who stated that standards for MEMS will never happen. Instead of accepting the status quo, engineers from Intel and Qualcomm with the support of MIG and other companies worked together to produce the first MEMS standard on sensor parameters. These actions are now influencing the MEMS community to accept that maybe some level of standardization is possible and beneficial. 

Risk Tolerance: New product development and higher levels of risk go hand in hand. Engineers who take on this challenge, need to have a greater tolerance for this risk and be able to manage it. The key benefit of higher risk is the larger reward that is typically associated with it. With any new product development, there is always the possibility for cancellation, low adoption, project delays and insufficient funding. However, building teams on the principles above is the first step to lowering risk.      

Other Points to Consider:  When choosing a team leader, vision is another important factor to consider. Leaders with vision have the foresight to see the potential in an idea before it exists.  Not all team members have to be visionaries but it is important that trust is built between those who have it and those who don’t. In addition, carefully consider the chemistry when building a team. Having proper technical and business depth, meshing personalities and clear leadership is extremely important.

The team is essential for success in any MEMS new product development. Focusing on the key attributes mentioned above will help companies hire the best individuals for MEMS new product development. In next month’s blog, proper execution of MEMS validation will be discussed.   

Demand for flexible displays is set to undergo massive growth during the next seven years, with a broad variety of applications—ranging from smartphones to giant screens mounted on buildings—driving a nearly 250 times expansion in shipments from 2013 through 2020.

Global shipments of flexible displays are projected to soar to 792 million units in 2020, up from 3.2 million in 2013, according to a new IHS report entitled “Flexible Display Technology and Market Forecast.”  Market revenue will rise to $41.3 billion, up from just $100,000 during the same period.

“Flexible displays hold enormous potential, creating whole new classes of products and enabling exciting new applications that were impractical or impossible before,” said Vinita Jakhanwal, director for mobile and emerging displays and technology at IHS. “From smartphones with displays that curve around the sides, to smart watches with wraparound screens, to tablets and PCs with roll-out displays, to giant video advertisements on curved building walls, the potential uses for flexible displays will be limited only by the imagination of designers.”

Generation flex

IHS classifies flexible displays into four generations of technology. The first generation is the durable display panels that are now entering the market. These panels employ a flexible substrate to attain superior thinness and unbreakable ruggedness. However, these displays are flat and cannot be bent or rolled.

Second-generation flexible displays are bendable and conformable, and can be molded to curved surfaces, maximizing space on small form-factor products like smartphones.

The third generation consists of truly flexible and rollable displays that can be manipulated by end users. These displays will enable a new generation of devices that save space and blur the lines separating traditional product categories, such as smartphones and media tablets.

The fourth generation consists of disposable displays that cost so little that they can serve as a replacement for paper.

Starting small

With their thin, light and unbreakable nature, flexible displays initially are expected to be used in smaller-sized products, such as mobile phones and MP3 players. However, once large-size displays are available, flexible technology will be used in bigger screen-size platforms, such as laptops, monitors and televisions.

The largest application for flexible displays during the next several years will be personal electronic devices. This segment will be led by smartphones, with shipments climbing to 351 million units by 2020, up from less than 2 million this year.

Flexible stars at SID

Flexible displays were a major topic at the Society for Information Display (SID) Display Week event in Vancouver in May.

During an SID keynote address, Kinam Kim, president and CEO of Samsung Display Co., discussed his company’s flexible organic light-emitting diode (OLED) display technology. Kim said that the technology will be suitable for wearable electronics devices like Google Glass.

Also at SID, LG Display showed a 5-inch OLED panel constructed out of plastic that was both flexible and unbreakable.

Furthermore, Corning at SID showed its Willow Glass, which can be used as with both OLEDs and liquid-crystal displays (LCD) in mobile devices such as smart phones, tablets and notebook PCs. Because of its thinness, strength and flexibility, Willow Glass could enable future displays to be wrapped around a device or a structure.

IHS predicts OLEDs will be the leading flexible display technology during every year for the foreseeable future, accounting for 64 percent of shipments in 2020.

Shipments of television sets in the United States declined by 11 percent in the first quarter of 2013 compared to one year earlier, according to a TV Systems Intelligence update from information and analytics provider IHS.

U.S. TV shipments dropped to 6.6 million units, down from 7.4 million a year ago in the first quarter of 2012. Liquid-crystal display televisions (LCD TV) decreased by 7 percent, while plasma plunged 39 percent, as presented in the attached figure.

However, the news was not all bad: The average selling price (ASP) for LCD TVs increased 3 percent, driven by a recovery in consumer confidence and a focus on replacing main TV sets with more full-featured products and larger screen sizes.

The fall in the United States reflected the worldwide decrease of television shipments during the first quarter. However, global TV shipments declined far lower, down by less than 2 percent.

The contraction in global volumes was driven by the decline in the remaining markets for bulky analog cathode ray tube (CRT) sets as well as by the reduction in plasma demand. Other factors responsible for the decrease included a widespread cutback in LCD TV manufacturing volumes by major Japanese vendors, and a repositioning of the market toward fewer, larger-sized TV sets in the mature markets.

Consumers spend more as feature demand increases

As a result of the ASP increase for LCD TVs, revenue was relatively stable by comparison, with total TV revenue dropping by 11 percent in line with total shipments, while LCD TV revenue declined significantly less than shipments, by 4 percent.

For brands relying on the LCD market, this creates an opportunity to expand their margins in the highly competitive TV market.

“The U.S. market is starting to reposition toward higher-end TV sets,” said Veronica Thayer, analyst for consumer electronics & technology at IHS. “Now that most homes have at least one flat-panel TV, consumers have become more discerning in their tastes and place more value on features like light-emitting diode (LED) backlighting, supersized screens and interactive smart TVs.”

Supersized LCD TVs and LED lead the way

Supersized LCD TV sets larger than 50 inches in the diagonal dimension accounted for 27 percent of U.S. LCD TV unit shipments in the first quarter, up from 15 percent one year before.

Furthermore, these large sets represented over half of all U.S. LCD TV revenue, at 53 percent, up sharply from 39 percent one year earlier.

For top television manufacturers, such high-cost sets represent an opportunity to maintain pricing despite declining unit sales in the United States.

Primarily because of increased shipments of 50-inch and 60-inch sets, the ASP for LCD TVs in the United States increased year-on-year in the first quarter. The ASP stood at $704, up from $682 one year earlier.

Meanwhile, LED-backlit sets increased their share of U.S. TV unit shipments to 72 percent, up from 37 percent during the first quarter of 2012. LED sets accounted for 76 percent of total TV revenue, up from 52 percent.

Samsung and Vizio remain the top US TV brands in Q1

In terms of competitive positioning, Samsung Electronics Co. Ltd. earned the highest revenue from the U.S. market for all types of televisions and in the key LCD TV segment, despite strong gains by Vizio Inc.

South Korea’s Samsung during the first three months of 2013 accounted for 31 percent of overall U.S. television market revenue, up from 30 percent during the same period in 2012. The company also expanded its share of U.S. LCD TV revenue to 28 percent, up from 27 percent one year earlier.

Meanwhile, Vizio increased its share of TV revenue sharply, rising to 16 percent, up from 11 percent in 2012. The U.S.-based company also boosted its portion of U.S. LCD TV revenue to 18 percent, up from 14 percent one year earlier, due to the increase in number of large-screen-size TV models offered, particularly the very successful 60-inch, and helped by the brand’s entry into Best Buy.

In terms of volume, the squeeze on the total number of shipped TVs still favored Samsung, with 1.6 million units in the first quarter this year. However, Vizio managed to edge out Samsung on U.S. LCD TV volume during the period by a few thousand units.

“Samsung has retained its position as the leading premium television brand in the United States by capitalizing on demand for premium features, but Vizio is making strong moves in volumes and larger-sized models, although its current revenue is still lower,” Thayer added. “Ultimately, feature-rich sets and large screen sizes lead to higher TV ASPs, which can provide an opportunity for manufacturers to regain margins.”

 

Advanced packaging technology is undergoing dramatic changes as the smart phones and new sensor technologies demand continued improvements in form and function.  To address these massive changes, SEMICON West will feature a number of programs on new packaging technologies and processes with speakers from leading chip makers, equipment manufacturers, and material suppliers.

According to IDC, forecasts semiconductor revenues will log a compound annual growth rate (CAGR) of 4.1 percent from 2011-2016, but revenues for 4G phones will experience annual growth over 100 percent for the same period. NanoMarkets estimates that the global market for “Internet of Things” sensors will reach $1.6 billion this year and grow to a value of $17.6 billion by the end of the decade as sensors become increasingly connected to the Internet directly or through hubs.  Both trends will significantly impact semiconductor and microelectronics packaging.  Demand for equipment and related tools in the 3D-IC and wafer-level packaging area alone is forecasted to grow from approximately $370 million in 2010 to over $2.5 billion by 2016, according to Yole Developpment.

To address these changes, SEMICON West 2013 (register at www.semiconwest.org/registration), held on July 9-11 in San Francisco, will feature a number of programs on new packaging applications, requirements, technologies, and products, including:

  • Generation Mobile:  Enabled by IC Packaging Technologies — Speakers from ASE, UBM Tech Insights, Amkor Technology, SK Hynix, and Universal Scientific Industrial will present on the latest advances in wafer-level packaging, new materials, and multi-die integration, including new System-in-Package (SiP) and Package-on-Package (PoP) methods. Location: Moscone Center (North Hall), TechXPOT North, Tuesday, July 9, 10:30am-12:30pm.
  • “THIN IS IN": Thin Chip & Packaging Technologies as Enablers for Innovations in the Mobility Era — IEEE/CPMT will hold a technical workshop on the overall trend of maximum functional integration in the smallest and thinnest package with lowest packaging costs with speakers from Intel, Cisco, ASE, Micron, SK Hynix, Nanium, Kyocera and more. Location: San Francisco Marriott Marquis, Tuesday, July 9, 1:30-4:45pm.
  • Advancing 2.5D and 3D Packaging through Value Engineering — Speakers from Altera, Amkor, ASE, ASET, KPMG, UMC, STATS ChipPAC and more will take a critical look at 2.5D implementations and the current outlook for 3D packages, including tools and technologies for heterogeneous stacks. Location: Moscone Center (North Hall), TechXPOT North, Wednesday, July 10, 1:00-3:30pm.
  • MEMS & Sensor Packaging for the Internet of Things— This session will feature speakers from all parts of the ecosystem to address how future visions of a pervasive interconnected world will be realized through the heterogeneous integration of MEMS and ICs.  The program will feature keynote speaker Janusz Bryzek from Fairchild Semiconductor, and speakers from VTT Research, Fraunhofer IZM, Robert Bosche, EV Group, Dai Nippon Printing, and more. Location: Moscone Center (North Hall), TechXPOT North, Thursday, July 11, 10:30am-1:00pm.

In addition to the packaging programs, SEMICON West 2013 will also feature over 560 exhibitors with the latest innovation on microelectronics manufacturing, including over 150 exhibitors with equipment and technology solutions for advanced packaging.  Other programs and exhibitors at West will address lithography, advanced materials and processes, silicon photonics, test, LED and MEMS manufacturing, and other subjects.  For more information on SEMICON West and to register, visit www.semiconwest.org

CEA-Leti will present recent advances and a preview of future developments in micro- and nanotechnologies, followed by workshops on key technical fields, during Leti Innovation Days, June 25-28, on the MINATEC campus.

The gathering incorporates Leti’s two-day Annual Review, now in its 15th year. That event provides an update of developments from Leti’s labs and its success in transferring technology to industry.

The 15th Annual Review kicks off on June 25th with two plenary sessions:

  • Envisioning the Future, chaired by Leti CEO Laurent Malier, will include insights from industry leaders into the technological innovations that will shape the future.
  • Enabling the Future, chaired by Pierre-Damien Berger, Leti VP of business development and communication. Presentations will include Leti’s latest developments and the key enabling technologies that will drive advancements in a broad range of sectors.

June 26th presentations by Leti specialists and partners will cover security and safety, environment and health, green IT and nanoelectronics.

“This year’s review powerfully highlights the wide-ranging strengths of Leti’s offer, from continuous innovation to technology transfer and support for SMEs,” said Leti CEO Laurent Malier. “Leti last year demonstrated a new FD-SOI solution that offers a 40 percent improvement in power consumption and a 30 percent frequency improvement, at lower costs. Transferred to manufacturing, it delivered the first application processor product dedicated to smartphones exceeding 3 GHz. We also particularly expanded our actions for SMEs, with a specific initiative allowing them to benefit from the expertise of our researchers and engineers and to access our state-of-the-art equipment.”

The Annual Review will be followed on June 27-28 by five in-depth workshops on design for 3D, memory, photonics, imaging and nanopackaging.

Leti Innovation Days participants will include international and European decision-makers: CEOs, CTOs, marketing and strategy directors, R&D managers, IT and semiconductor companies, innovative SMEs, end-user companies, research institutes, startups and international press. Represented industries include advanced microelectronics, green IT, memory, imaging, LEDs and lighting, safety and security, and healthcare and the environment.

 

Fab equipment spending will grow two percent year-over-year  (US$ 32.5 billion) for 2013 and about 23 to 27 percent in 2014 ($41 billion) according to the May edition of the SEMI World Fab Forecast. Fab construction spending, which can be a strong indicator for future equipment spending, is expected to grow 6.5 percent ($6.6 billion) in 2013, followed by a decline of 18 percent ($5.4 billion) in 2014. The new World Fab Forecast report covers fab information on over 1,140 facilities, including such details as capacities, technology nodes, product types, and spending for construction and equipment for any cleanroom wafer facility by quarter.

Fab equipment spending for the second half of 2013 is expected to be much stronger with a 32 percent growth rate or $18.5 billion compared to the first half of 2013. The equipment spending increase in the second half is attributed to growing semiconductor demand and improving average selling price for chips. 2014 is expected to have about 23 to 27 percent growth year-over-year (YoY) to reach about $41 billion, which would be an all-time record.

Looking at product types, the largest amounts of spending on fab equipment in 2013 will come from the foundry sector, which increases by about 21 percent. This is driven mainly by capex increases by TSMC. The memory sector is expected to have an increase of only one percent — after a 35 percent decline in the previous year. The MPU sector is expected to grow by about five percent. A double-digit increase in the Analog sector in 2013 will still translate into low absolute dollar amounts, compared to the other sectors.  

 

Construction spending is a good indicator for more equipment spending.  Fab construction spending in 2013 is expected to be almost 15 percent growth YoY ($6.6 billion) with 38 known construction projects. Top spenders for fab construction in 2013 are TSMC and Samsung, who plan to spend between $1.5 and $2 billion each, followed by Intel, Globalfoundries and UMC. The SEMI World Fab Forecast report reveals more detail.

2014 shows a decline of about 18 percent ($5.4 billion) in construction spending with only 21 construction projects expected to be on-going. These construction projects include large fabs; some are 450mm-ready. 

Since the last fab database publication at the end February 2013 SEMI’s worldwide dedicated analysis team has made 389 updates to 324 facilities (including Opto/LED fabs) in the database. The latest edition of the World Fab Forecast lists 1,144 facilities (including 310 Opto/LED facilities), with 61 facilities with various probabilities starting production this year and in the near future. Seventeen new facilities were added and 8 facilities were closed.

The SEMI World Fab Forecast uses a bottom-up approach methodology, providing high-level summaries and graphs; and in-depth analyses of capital expenditures, capacities, technology and products by fab. Additionally, the database provides forecasts for the next 18 months by quarter.