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Researchers at the Georgia Institute of Technology want to put your signature up in lights – tiny lights, that is. Using thousands of nanometer-scale wires, the researchers have developed a sensor device that converts mechanical pressure – from a signature or a fingerprint – directly into light signals that can be captured and processed optically.

The sensor device could provide an artificial sense of touch, offering sensitivity comparable to that of the human skin. Beyond collecting signatures and fingerprints, the technique could also be used in biological imaging and micro-electromechanical (MEMS) systems. Ultimately, it could provide a new approach for human-machine interfaces.

Read more: Driven by Apple and Samsung, light sensors achieve double-digit growth

"You can write with your pen and the sensor will optically detect what you write at high resolution and with a very fast response rate," said Zhong Lin Wang, Regents’ professor and Hightower Chair in the School of Materials Science and Engineering at Georgia Tech. "This is a new principle for imaging force that uses parallel detection and avoids many of the complications of existing pressure sensors."

piezo LED

Individual zinc oxide (ZnO) nanowires that are part of the device operate as tiny light emitting diodes (LEDS) when placed under strain from the mechanical pressure, allowing the device to provide detailed information about the amount of pressure being applied. Known as piezo-phototronics, the technology – first described by Wang in 2009 – provides a new way to capture information about pressure applied at very high resolution: up to 6,300 dots per inch. The research was scheduled to be reported August 11 in the journal Nature Photonics. It was sponsored by the U.S. Department of Energy’s Office of Basic Energy Sciences, the National Science Foundation, and the Knowledge Innovation Program of the Chinese Academy of Sciences.

 Piezoelectric materials generate a charge polarization when they are placed under strain. The piezo-phototronic devices rely on that physical principle to tune and control the charge transport and recombination by the polarization charges present at the ends of individual nanowires. Grown atop a gallium nitride (GaN) film, the nanowires create pixeled light emitters whose output varies with the pressure, creating an electroluminescent signal that can be integrated with on-chip photonics for data transmission, processing and recording.

"When you have a zinc oxide nanowire under strain, you create a piezoelectric charge at both ends which forms a piezoelectric potential," Wang explained. "The presence of the potential distorts the band structure in the wire, causing electrons to remain in the p-n junction longer and enhancing the efficiency of the LED."

The efficiency increase in the LED is proportional to the strain created. Differences in the amount of strain applied translate to differences in light emitted from the root where the nanowires contact the gallium nitride film.

Read more: Student develops brighter, smarter and more efficient LEDs

To fabricate the devices, a low-temperature chemical growth technique is used to create a patterned array of zinc oxide nanowires on a gallium nitride thin film substrate with the c-axis pointing upward. The interfaces between the nanowires and the gallium nitride film form the bottom surfaces of the nanowires. After infiltrating the space between nanowires with a PMMA thermoplastic, oxygen plasma is used to etch away the PMMA enough to expose the tops of the zinc oxide nanowires.

piezo LED 2

A nickel-gold electrode is then used to form ohmic contact with the bottom gallium-nitride film, and a transparent indium-tin oxide (ITO) film is deposited on the top of the array to serve as a common electrode. When pressure is applied to the device through handwriting, nanowires are compressed along their axial directions, creating a negative piezo-potential, while uncompressed nanowires have no potential. The researchers have pressed letters into the top of the device, which produces a corresponding light output from the bottom of the device. This output – which can all be read at the same time – can be processed and transmitted. The ability to see all of the emitters simultaneously allows the device to provide a quick response. "The response time is fast, and you can read a million pixels in a microsecond," said Wang. "When the light emission is created, it can be detected immediately with the optical fiber."

The nanowires stop emitting light when the pressure is relieved. Switching from one mode to the other takes 90 milliseconds or less, Wang said.

The researchers studied the stability and reproducibility of the sensor array by examining the light emitting intensity of the individual pixels under strain for 25 repetitive on-off cycles. They found that the output fluctuation was approximately five percent, much smaller than the overall level of the signal. The robustness of more than 20,000 pixels was studied.

A spatial resolution of 2.7 microns was recorded from the device samples tested so far. Wang believes the resolution could be improved by reducing the diameter of the nanowires – allowing more nanowires to be grown – and by using a high-temperature fabrication process.

Computer simulations have revealed how the electrical conductivity of many materials increases with a strong electrical field in a universal way. This development could have significant implications for practical systems in electrochemistry, biochemistry, electrical engineering and beyond.

The study, published in Nature Materials, investigated the electrical conductivity of a solid electrolyte, a system of positive and negative atoms on a crystal lattice. The behavior of this system is an indicator of the universal behavior occurring within a broad range of materials from pure water to conducting glasses and biological molecules.

Electrical conductivity, a measure of how strongly a given material conducts the flow of electric current, is generally understood in terms of Ohm’s law, which states that the conductivity is independent of the magnitude of an applied electric field, i.e. the voltage per metre.

This law is widely obeyed in weak applied fields, which means that most material samples can be ascribed a definite electrical resistance, measured in Ohms.

However, at strong electric fields, many materials show a departure from Ohm’s law, whereby the conductivity increases rapidly with increasing field. The reason for this is that new current-carrying charges within the material are liberated by the electric field, thus increasing the conductivity.

Remarkably, for a large class of materials, the form of the conductivity increase is universal – it doesn’t depend on the material involved, but instead is the same for a wide range of dissimilar materials.

The universality was first comprehended in 1934 by the future Nobel Laureate Lars Onsager, who derived a theory for the conductivity increase in electrolytes like acetic acid, where it is called the "second Wien effect." Onsager’s theory has recently been applied to a wide variety of systems, including biochemical conductors, glasses, ion-exchange membranes, semiconductors, solar cell materials and to "magnetic monopoles" in spin ice.

Researchers at the London Centre for Nanotechnology (LCN), the Max Plank Institute for Complex Systems in Dresden, Germany and the University of Lyon, France, succeeded for the first time in using computer simulations to look at the second Wien effect. The study, by Vojtech Kaiser, Steve Bramwell, Peter Holdsworth and Roderich Moessner, reveals new details of the universal effect that will help interpret a wide varierty of experiments.

Professor Steve Bramwell of the LCN said: "Onsager’s Wien effect is of practical importance and contains beautiful physics: with computer simulations we can finally explore and expose its secrets at the atomic scale.

"As modern science and technology increasingly explores high electric fields, the new details of high field conduction revealed by these simulations, will have increasing importance."

Nanometrics Incorporated, a provider of advanced process control metrology and inspection systems, today announced that SK Hynix has reported significant process control improvement by deploying the Atlas II platform for optical critical dimension (OCD) metrology across its memory device production.

"Nanometrics, with its Atlas II platform, has enabled key yield and performance learning on our DRAM devices," said a representative of SK Hynix. "Nanometrics continues to be a valuable technology supplier to SK Hynix and the Atlas II platform plays an important role in the production ramp of our next-generation products."

"We have a close collaboration with SK Hynix, and have provided the company metrology solutions across multiple technology generations of memory devices since first introducing our industry-leading NanoDiffract OCD analysis software," commented S. Mark Borowicz, senior vice president of silicon solutions at Nanometrics. "Our Atlas II system, with its advanced technology for in-line process control, has enabled this important customer to quickly identify and address manufacturing steps that impact device performance, and tune key processes to maintain process stability."

The Atlas II is a high-performance process control system capable of advanced thin film and OCD metrology, leveraging the industry-leading performance of Nanometrics’ NanoDiffract software for complex structure metrology.

Advanced semiconductor and computer manufacturer Adapteva today introduced its Parallella University Program (PUP) for academic institutions that conduct leading parallel programing research and/or education. The program is designed so universities can access inexpensive and open parallel computing hardware. Institutions participating in the PUP program will receive free hardware and developmental software specifically focused on parallel computing. The first offering via the PUP program will be the Parallella-16 computer, Adapteva’s breakthrough credit-card sized multicore processing platform.

To kick off the program, Adapteva is donating one Parallella-16 platform for each 100 units sold via the Adapteva online store. Universities eligible for the PUP must be actively involved in parallel computing research and education.

The Parallella platform, equipped with Adapteva’s energy-efficient Epiphany multicore processor and the Xilinx Zynq-7000 All Programmable SoCs that includes a dual-core ARM A9 CPU. The whole board is the size of a credit-card, consumes less than 5 Watts under typical workloads and has a $99 entry level price point. Adapteva’s Parallella was launched in a successful Kickstarter campaign in late 2012 and recently opened orders for the general public.

“The present and future of computing is clearly parallel but the world is still struggling with the transition from the serial computing model that has served it well for decades,” said Andreas Olofsson, CEO of Adapteva. “We created the Parallella platform to help make the world’s first open and affordable platform for the development of massively parallel programs. With the Parallella University Program we want to do our part to help accelerate the transition to parallel computing.”

Adapteva invites other companies dedicated to advancing education and research in the area of parallel computing to join the Parallella University Program and match Adapteva’s donation.

Displaybank’s recent market report on the cost competiveness of LED chips. This report conducts a thorough analysis on the supply price history, trends and forecast of main materials that compose packaged LEDs across the entire LED value chain. The key materials include sapphire ingot, substrate, LED chip (or die), frame (PCB, lead frame, ceramic), phosphor (YAG, silicate, nitride), and encapsulation. The supply price of the key materials used in the production of a packaged LED was assumed as the production cost. In addition, IHS has researched the average selling price (ASP) of a packaged LED every quarter since 2010, aside from this report.

In 2012, the 4-inch ingot/substrate lost its price premium compared to the 2-inch product, and the 6-inch product had to lower its margin because of excess supply in 2013. However, such drastic fluctuations in price are not expected to occur after 2014.

The LED chip suppliers have reaped great benefits with the falling production cost of 4-inch-substrate-based LED chips. However, it is expected that they will convert their production systems over to 6-inch or 8-inch substrates in the near future, with the falling prices of 6-inch substrates and enhanced yield rates. According to the report, the production cost competitiveness of LED chips produced on 6-inch substrates will outstrip that of 4-inch, by as early as 2015.

In addition, the report compares the production cost and selling price of packaged LEDs by application; analyzes the margin and cost structure; and forecasts for the cost and price until 2020.

We hope you had a productive and enjoyable time at SEMICON West.  Despite the lackluster marketplace, this year’s SEMICON West achieved a 15 percent increase in unique visitors and over an 18 percent increase in R&D titles.  We were also happy to see such strong attendance at the keynotes, executive panels and TechXPOT stages, confirming our claim that SEMICON West delivers the most well-informed and influential speakers (and audience) in the industry.

Read more news from SEMICON West 2013

One of the strongest programs at SEMICON West 2013 was the materials program produced by the Chemical & Gases Manufacturer Group (CGMG), a SEMI special interest group.  This session, entitled, “Materials Growth Opportunities at Both Ends of the Spectrum” attracted over 450 people, more than any dedicated materials session we’ve ever had at SEMICON West.  And it’s no surprise. Innovations in materials are driving leading-edge semiconductor development.  Material markets are growing as the result of opportunities for both large geometry devices such as wide bandgap and printed electronics, and nano-scale devices at sub 22nm and beyond.

As much as materials took center stage at SEMICON West, the subject is simply too big and dynamic to cover in-depth at SEMICON West.  For the real “deep dive” into the critical trends and opportunities in advanced electronic materials, you must attend the SEMI Strategic Materials Conference (SMC), held October 16-17 at the Santa Clara Marriott in Silicon Valley, California.  SMC is the only executive conference in the world dedicated to advanced electronic materials.

SMC provides valuable forecasting information and serves as a forum for collaboration among all sectors of the advanced materials supply chain. This year’s program will feature powerhouse keynote speakers including:

 Luc Van den hove, president and CEO, imec

Gregg Bartlett, chief technology officer, GLOBALFOUNDRIES

Laurie E. Locascio, Ph.D., director, Material Measurement Laboratory, National Institute of Standards and Technology, and co-chair of the US government’s ambitious and essential Materials Genome Initiative

Other top-tier speakers will address market forecasts, materials developments in memory and logic, packaging materials trends, and materials-enabled “Beyond CMOS” devices.  Speakers will also address emerging materials opportunities and challenges in printed electronics, wide bandgap power devices, and MEMS.   The conference will also explore regulatory threats to the microelectronics industry and directly confront the increasingly difficult collaboration challenges between manufacturers, process equipment companies and diverse materials suppliers.

Last year’s conference sold out and attendees are encouraged to register early to ensure participation.

For additional information, please visit, http://www.semi.org/smc.

Thank you for making SEMICON West such a great success and hope to see you at the Strategic Materials Conference, if not before.

Isola Group S.a.r.l. today announced Astra, the company’s breakthrough very low-loss dielectric constant (Dk) product for millimeter wave frequencies and beyond. Astra revolutionizes RF and microwave designs, as it delivers a thermoset solution, which is very easy to process and has stable electrical properties over a wide range of temperatures and frequencies.

The lead-free Astra laminate materials exhibit exceptional electrical properties that are constant over a broad frequency and temperature range. Astra features a Dk that is stable between 55 degrees Celsius and +125 degrees Celsius. In addition, Astra offers a lower dissipation factor (Df) of 0.0017, making it an extremely cost-effective alternative to PTFE and other commercial microwave laminate materials.

"Astra enables up to a 50 percent lower cost of ownership because of its processing advantages and lower price point. The product requires a press cycle that is roughly one-half that of competitive products and processing temperatures below 200 degrees Celsius, making it compatible with a wide range of hybrid products," stated Tarun Amla, Executive Vice President and Chief Technology Officer at Isola Group.

Astra does not require the use of plasma cleaning, an offline and expensive PCB hole-wall preparation process. Astra also enables lower drilling costs, as its unfilled system provides easier drilling and extends drill life. It is available in all glass styles and thickness configurations, which eliminates the barriers to board thickness. Astra also demonstrates a high-peel strength, which enables use of special copper types to deliver very-low passive intermodulation numbers.

Astra is suitable for many of today’s commercial RF/microwave printed circuit designs that operate at 24 GHz. and 77 GHz frequencies. Key applications include long antennas and such radar applications for automobiles as adaptive cruise control, collision avoidance, blind spot detection, lane departure warning and stop-and-go systems.

TriQuint Semiconductor, Inc., a RF solutions supplier, today announced that it has acquired CAP Wireless, Newbury Park, CA, and its patented Spatium RF power combining technology that replaces traveling wave tube amplifiers (TWTAs) in communications and defense systems. TriQuint estimates that the TWTA market opportunity will be about $600 million by 2015.

The combined company now offers a wider selection of high power / high frequency products. CAP Wireless’ Spatium technology adds to the exceptional bandwidth, efficiency and ruggedness of TriQuint’s product portfolio.

Spatium technology dramatically improves broadband RF power efficiency through the use of patented coaxial spatial combining techniques. Spatium provides other performance advantages including solid-state reliability, smaller form factors, higher power densities and reduced weight compared to either TWTA-based systems or conventional planar power combining products. Spatium can provide faster time-to-market and can seamlessly incorporate GaN MMIC performance breakthroughs while reducing product lifecycle costs.

TriQuint Vice President and General Manager for Infrastructure and Defense Products, James L. Klein, noted that TriQuint’s acquisition of CAP Wireless merges a unique approach to high power RF amplifier system design with the benefits of TriQuint GaN device technology.

“CAP Wireless initially developed its Spatium amplifier platform using gallium arsenide-based (GaAs) MMICs. GaN-based products from TriQuint can elevate Spatium to new levels of efficiency, power density, frequency coverage and output power.”

TriQuint will focus Spatium technology development as a solution for high efficiency power applications in commercial and defense markets, including electronic warfare (EW), communications and radar.

TriQuint is continuing operation of CAP Wireless product sales and contracts while it develops new devices based on Spatium technology using TriQuint GaN and GaAs MMIC amplifiers.

Transistors in ultra-high definition displays (UHD) possess particularly fine structures. Only extremely pure sputtering targets are suitable for use as the input materials for the fine conductor paths. “UHD-ready” will be the motto when Plansee present their ultra-pure coating materials at Touch Taiwan.

Ultra-high definition is a digital video format that transmits images at widths of up to 4000 pixels. Display manufacturers are now supplying the necessary hardware in the form of UHD screens. The advent of UHD technology is bringing with it more stringent requirements with respect to the purity of the materials used, such as molybdenum.

Molybdenum is a key component of the layer system in a thin film transistor and helps to determine the color with which an LED is illuminated. There are several million of these transistors in a single UHD screen. Ulrich Lausecker, Head of the Coating Business Unit at Plansee explains: “Any foreign particle in the thin film material is huge in relation to the fine transistor structures. Even the slightest contamination of the molybdenum layer can cause whole pixels to fail.”

The company is one of the leading manufacturers of molybdenum sputtering targets. When processed, these targets form key layers in the transistor system. Plansee is the only manufacturer to supply molybdenum at a guaranteed purity of 99.97 percent. As a rule, the material is even purer than this. Which means that Plansee’s sputtering targets are ready for ultra-high definition technology.

In-house production guarantees the highest levels of material purity

This is made possible by the proprietary production process. At Plansee, this starts with molybdenum trioxide, in other words shortly after the ore has been processed. In-house reduction processes then allow to convert this to extremely pure molybdenum powder. And Plansee is also responsible for further downstream process steps such as pressing, sintering and forming sputtering targets. Before the sputtering targets are delivered to the customers, Plansee bond them in their own machine shops in Asia.

Because all the production steps are kept in house, Plansee is able to control the quality of the material right from the start in a way that no other target manufacturer can.

“Even the raw material itself comes from part of our family,” said Lausecker. “The Plansee Group has a 14 percent stake in the Chilean company Molymet, the largest molybdenum ore processor in the world.”

apple logoIn an illustration of the massive power it wields in the electronics supply chain, Apple Inc.’s migration of the production of key semiconductors from Samsung to pure-play foundries will single-handedly boost the growth of the chip contract manufacturing market this year.

Read more: Apple confirms acquisition of Passif Semiconductor

By the end of the year, pure-play semiconductor foundry market revenue is forecast to rise 21 percent compared to 2012, according to the new IHS report entitled: “Low-Cost Tablet Processor Market Computes New Growth” from information and analytics provider IHS.

In contrast, takings for the overall semiconductor industry will expand by a more staid 5 percent.

The pure-play foundry industry is already on track to achieve such growth this year, with revenue amounting to $8.2 billion in the first quarter, up 4 percent from $7.9 billion in the fourth quarter last year, as shown in the attached figure. In comparison, the overall semiconductor market was down by 5 percent during the same period.

The foundry segment is also believed to have outperformed the rest of the industry in the second quarter when final figures are released, and then go on to perform strongly for the second half.

Pure-play foundries are companies that exclusively perform contract manufacturing of chips for other semiconductor suppliers. Major companies in the pure-play foundry business include Taiwan Semiconductor Manufacturing Co. Ltd. and United Microelectronics Corp.

Apple takes apps processor business elsewhere

“The growth outlook for the pure-play foundry business has risen considerably in anticipation of Apple’s transition of its applications processor chip manufacturing to third-party manufacturers,” said Len Jelinek, director and chief analyst of semiconductor manufacturing at IHS. “Previously, Apple had relied on Samsung as the primary supplier of applications processor chips for the iPhone and iPad. However, Samsung is not considered a pure-play foundry. Instead, it is designated as an integrated device manufacturer (IDM)—a chip supplier that not only builds products but also possesses design capabilities and sells devices under its own brand name, functions not performed by foundries.”

Read more: How Samsung is climbing the charts

Apple already has its own designs and does not need an IDM for its chips to be made, so it can just as easily move its semiconductors to a foundry.

“However, Apple’s anticipated shift is also the result of its well-publicized tiffs with Samsung over patent infringements on both makers’ smartphones that have strained relationships between the two,” Jelinek added.

Moving forward, Apple is likely to use a producer like TSMC, the largest foundry in the business, with $16.9 billion in revenue for 2012.

Wireless on the rise

While the overall semiconductor industry continues to be heavily dependent on components sold to the PC market, foundry players have hitched their revenue prospects to the rising fortunes of the wireless segment. As a result, revenue for foundries has been expanding steadily, while that for the overall chip industry has been less assured.

Read more: Personal computer shipments post worst quarter on record

Threats and risks ahead

Although strong growth is projected in 2013 for foundry suppliers, several concerns abound that foundry players must monitor throughout the year.

Foundry suppliers must be aware of the global economy, as well as the inventory that their clients maintain. Should the world market sputter, consumer demand for electronic products will weaken, thereby impacting chip makers and foundries alike. If inventory grows out of control for foundry clients as it did in the second half of 2012, manufacturing run rates for foundries could decline significantly for the remaining six months of 2013 as their customers hold back on chip orders.

A rising threat to foundries is also coming from IDMs like Samsung and chipmaker Intel. For the first time, the top foundry suppliers are facing technological competition from IDMs—which means that the leading foundries are no longer in competition with just one another.

As several IDMs attempt to revamp their manufacturing models and move to new and more efficient lithographies, incumbent foundries will be forced to accelerate internal technology development. The race between the two rival groups will result in a shortening of technology cycles and fierce competition among participants. A company unsuccessful in execution will inevitably lose important market share and be weakened, or worse, forced out, IHS believes.

Ultimately the consumer will be the winner. Technological developments will provide designers the ability to integrate multiple functions onto a chip, offered at a unit cost that results in cheaper, yet more powerful consumer products.