Feb. 25, 2008 – In a move to narrow its focus to homeland security applications, Implant Sciences is putting its semiconductor subsidiary, Core Systems up for sale.
The deal achieves several objectives, according to president/CEO Phillip Thomas, in a statement. Primarily, by carving out what is now seen as a noncore operation — one that had purposefully been consolidated and grown in Sunnyvale, CA and now “presents an attractive acquisition opportunity as a stand-alone business or as an integral component of a strategic buyer” — the company can get back some ROI from
by M. David Levenson, Editor-in-Chief, Microlithography World Feb. 25, 2008 – Claiming the ability to print 32nm, 28nm and 22nm features at 4WPH with 35nm overlay, Molecular Imprints, Inc. (MII) says its latest imprint lithography tool for semiconductor applications, the Imprio 300, introduced at the SPIE Advanced Lithography Symposium on Feb. 25., is the “only game in town” for semiconductor prototyping and process development in the <30nm realm. “Our unique technology imprints into liquid at room temperature, facilitating overlay,” according to CEO Mark Melliar-Smith, who discussed the technology in an interview with WaferNEWS. The step and flash tools are drop-in replacements for optical exposure tools, completely compatible wit current processes.” He provided slides showing that working FinFET transistors have already been patterned at 20 and 30nm and resist CD uniformity demonstrated at 0.8nm with LER<2nm. Molecular Imprint’s stepping tools dispense the resist as droplets with density scaled to the local duty factor inside each imprint field. That results in a highly-uniform residual resist layer after imprint, which, they claim, can be removed using standard descum processes. The Imprio 300 is targeted for memory applications where circuit density is paramount. For NAND flash architectures, density and cost-of-ownership trump overlay, perhaps opening a niche for imprint lithography, according to Melliar-Smith. Over small fields, however, the Imprio 300 claims an overlay precision (mean +3[σ]) below 10nm. He estimated that the throughput of the Imprio 300 would make its CoO compatible with that of 193nm immersion and less than EUVL prototypes. Experience with previous-generation tools also led Molecular Imprints to improve the graphical user interface and operator features of the Imprio 300. First shipment of the new system is scheduled for mid-2008. Melliar-Smith also discussed Molecular Imprints’ roadmap to make the company the world leader in sub-30nm lithography for flash memory. A high-volume manufacturing tool with 15nm overlay and 20 WPH throughput is on track for introduction in 2010. At the 22nm flash node, that tool would be less expensive to operate than EUVL or spacer-type double patterning, in part because of its use of replicated templates. He also predicted that the disc drive industry will be ramping up patterned media production in 2010. In that technology, one disc will hold 1013 30nm posts (on each side), each post corresponding to a bit of data. Molecular Imprints is developing high-throughput tools based on their Imprio 1100 technology for that full-field application. Melliar Smith counted eight papers by MII customers at the 2008 Advanced Litho Symposium, plus four papers presented by MII itself, as evidence of the increasing acceptance of step and flash imprint. — M.D.L. Feb. 24, 2008 – Credence Systems has sold its diagnostics and characterization business to DCG Systems, an independent company led by Israel Niv, former GM of the business from 2003-2005 and founder of Optonics, an emission-based optical diagnostics and failure analysis supplier bought by Credence in late 2002. Sale price is “up to $10M” plus another $2.5M subject to unspecified terms, to be paid within three years. The deal includes up to $22M in book value of assets, including component inventory, fixed assets, intangibles and various liabilities, and Credence will fund ~$4M in existing warranty/service contracts and provide “reimbursable transaction services” for a limited time. Credence will take a ~22M charge in addition to its anticipated $37-$39M loss for fiscal 1Q08, including $19M in extraordinary charges. “We are pleased to find a new home for this highly specialized and important business,” said Credence president/CEO Lavi Lev, in a statement. “As Credence focuses on the consumer-based semiconductor ATE markets, one of our priorities was the continued care of our DCG customers, and the qualifications of the new management team. We believe DCG customers will benefit from the focus and experience Israel and his team bring to the business.” The “newly formed” Fremont, CA-based DCG Systems will provide leading edge semiconductor design diagnostics and failure analysis technologies, including a “Ruby” laser voltage prober, “OptiFIB-IV focused ion beam system, “Meridian-IV” emission system, and “NEXS” suite of EDA link software. “DCG Systems provides the best bridge between the design community and the fab yield and failure analysis teams with its diagnostic systems and software to enhance yield ramp, silicon design debug and IC quality,” stated Niv, adding that the company will “focus fully on the specific needs of our customers as they move to the 45nm technology node and beyond.” Feb. 21, 2008 – The latest move in metrology industry consolidation has occurred with KLA-Tencor’s proposed “friendly” acquisition of Belgium firm ICOS Vision Systems in a proposed €316.9M (US $465.8M) cash transaction. The €36.50/share ($53.75) offer represented a 35% premium to ICOS’ three-month average closing price. KLA-Tencor also said will offer to purchase ICOS shares underlying all outstanding 2002 employee stock options and 2007 employee warrants. The deal, anticipated to close sometime in 2Q08, requires approval from 85% of ICOS’ shareholders. Also, a clause indicated by both companies notes the bid must not be subject to review by government/jurisdictional antitrust authorities “beyond the initial phase of review.” In a statement, KLA-Tencor CEO Rick Wallace noted “exceptional synergy” in markets and technologies, “with additional opportunities for both growth and diversification” — ICOS provides “a significant presence” in semiconductor packaging inspection, and inroads into growth sectors such as LED lighting and solar. For ICOS, the proposed combination “would significantly increase our growth potential and provide remarkable resources for advanced technical development of our existing products and technologies,” stated president/CEO Anton De Proft. Deb. 18, 2008 – Israeli company Pythagoras Solar, claiming to have a play in the photovoltaic sector, says it has completed a $10M round of Series A funding, led by led by Israel Cleantech Ventures and joined by Pitango Venture Capital and Evergreen Venture Partners. Funds will be used for domestic R&D and global commercialization of its technology and products, which the firm boasts “have the potential to change the economics of solar power.” Pythagoras was founded in 2006 by former Check Point Software exec Gonen Fink and Tel Aviv U.’s Itay Baruchi, and has been incubated in investment firm Precede Technologies. According to that firm’s Web site it offers “static low concentration photo-voltaic systems.” More cryptically, Pythagoras’ own site describes its work as combining “software models, optic design, semiconductor processes, materials science, and mass manufacturing techniques to build highly durable, cost effective solar energy products.” It has an R&D center in Hakfar Hayarok, Israel and a US office in San Mateo, CA. The company says it will disclose more about its products and technologies by early 2009. February 7, 2008 — The Merging Optics and Nanotechnologies (MONA) project has released its European Roadmap for Photonics and Nanotechnologies. The organization, launched in 2005 by the European Commission to bridge the gap between photonics and nanotechnologies, encourages interested parties to read and distribute the document. The MONA Roadmap identifies potential synergies between photonics/nanophotonics and nanomaterials/nanotechnologies. The challenge of mastering nano-electronics and nano-photonics science and technologies at an industrial scale is of utmost strategic importance for the competitiveness of the European industry in a global context. There are three principal objectives for the MONA Roadmap: A major component of the MONA Roadmap is the identification of the highest priority economic growth areas, taking into account market size, market growth, and the positioning of European industry and research in these areas. Highlights of the MONA Roadmap are: Eleven of Europe’s main players in nanophotonics have created the MONA Roadmap, led by the CEA LETI, and including Acreo AB, AIXTRON AG, Alcatel-Thales III-V LAB, ASM-International, the European Photonics Industry Consortium (EPIC), IMEC, Optics Valley, Schott AG, VDI Technologiezentrum GmbH (VDI TZ), and Yole Développement. The MONA Roadmap is the outcome of a two year process. Over 300 professionals coming from all over the world have contributed to its creation. The MONA project has been funded by the European Commission within its 6th Framework Programme. The ultimate objective of the project is the development of a European roadmap for photonics and nanotechnologies. Feb. 6, 2008 – Worldwide silicon wafer area shipments came in right around SEMI’s revised projections in 2007, squeaking back into positive growth territory by year’s end, according to the latest data from SEMI’s SEMI Silicon Manufacturers Group (SMG). Total area shipments rose 8.3% for all of 2007 to 8661 millions of sq. in. (MSI). Revenues maintained >20% Y-Y growth for a second consecutive year to $12.1B, though slightly slower growth than in 2006. Robust demand and the ongoing ramp of 300mm chip manufacturing “led to an overall strong year for the silicon industry,” noted Kazuyo Heinink, chairwoman of SEMI SMG and VP of new product marketing for MEMC Electronic Materials. “We expect that these drivers will fundamentally remain in place for 2008.” SEMI SMG’s projection of 8% growth in 2007 was a revision from initial forecasts of 9% growth. The industry started the year with 12% Y-Y growth in both 1Q and 2Q, and spiked to 4.8% Q-Q growth in 2Q07, but saw a -1.2% sequential decline in 3Q wafer shipments, and ultimately flat shipments through 4Q. SEMI SMG also is projecting mid-single digits over the next couple of years, following a 20% surge in 2006. February 4, 2008 — D-Wave Systems, developer of quantum computers targeted at commercial applications, has announced the closing of a $17 million Series C financing. The round was led by International Investment and Underwriting (IIU) of Dublin, Ireland and was strongly supported by existing investors. D-Wave will use the funds for product development, operations and business development activity. “Our vision is to make quantum computing power available globally and to accomplish this requires a network of international partners,” said D-Wave CEO Herb Martin. D-Wave is the first company to announce the development of a commercial quantum computer and has twice publicly demonstrated prototype systems running real-world applications, the company said. The D-Wave machine is intended to be deployed as a co-processor, which will provide acceleration to applications executing on classical digital computer systems. D-Wave’s system will be available for on-line access in early 2009 and will be useful for accelerating high value applications involving discrete optimization, pattern matching, machine learning and constrained search with preferences. Such applications are found throughout the operations research, life sciences, finance, travel, chemical and petrochemical industries. Applications in quantum simulation and electronic design automation will follow soon thereafter, the company said. The latest financing round was fully subscribed by existing investors Draper Fisher Jurvetson (DFJ), GrowthWorks Capital Ltd, BDC Venture Capital, Harris & Harris, bcIMC and Pender Fund. by Bob Haavind, Editorial Director, Solid State Technology Jan. 31, 2008 – Dr. Morris Chang, legendary founder of Taiwan’s TSMC, the world’s biggest foundry, sees healthy growth ahead in the world economy even if there is a 6-9 month slump in the US, with a steadily expanding role for semiconductors. “Thirty years ago our goal was to make semiconductors ‘pervasive,'” he stated in a talk at the recent International Electron Devices Meeting (IEDM) in Washington, DC. “Now it to make them ubiquitous.” He pinpointed major shifts in the semiconductor industry landscape, identifying disruptive innovations that led to the new course for the industry. The biggest value now, Chang believes, is in system architecture and circuit level software. In basic ICs the value is in design, in microprocessors it’s in subsystems, and in SoCs (systems-on-chip) it’s in systems. While Moore’s Law has been a tough taskmaster for the industry, and steady shrinks have expanded total markets for chips, it has also led to what Chang sees as a shift in the business model for the industry. From 1952 until recently, the industry was built around semiconductor companies that served a variety of systems companies, in sectors such as defense, autos, telecom, and consumer electronics. Back in 1985 it took about $200 million to build a new fab — an amount that was not easy to raise. At that time there were less than 50 fabless companies, Chang pointed out, and they could not get reliable fab service because chipmakers that leased them space would take it back when business picked up. Then the foundry concept began to emerge, and by 1995 there were 340 fabless companies bringing in about $6B, though still a fairly small part of the industry. Meanwhile, chipmakers had to continue to invest ever-larger sums to build bigger fabs, and they needed their markets to grow sufficiently to justify new fabs. By 2000 there were 750 fabless companies bringing in $17B — but by 2006 this had grown to 1400 companies with $50B in revenue, about 20% of the industry total. The foundries had grown to become major manufacturers, with about 30% of their total revenue from making chips for the integrated device manufacturers (IDMs) as well as fabless companies. In the early days foundries offered standard processes, but to make more advanced chips, they had to start customizing processing to achieve the specifications for individual process designs. This means that foundries must now collaborate with designers in achieving continuous improvement in fab processing. “Now designers and fab people must work in partnership under the same roof,” Chang said. To achieve this, foundries need to put more effort, offering intellectual property (IP) that can make chipmaking more design-friendly. EDA, SoCs, competitive threats Following his talk, Chang chatted with reporters, explaining his views on the world economy, changes sweeping the semiconductor industry, and what would be needed for chipmakers to succeed in the future. He suggested that foundries have become the biggest power users of EDA tools as they work cooperatively with chip designers. While individual process technologies are needed for each fab customer, he said, these are often based on generic technology with some variations in order to be economically realistic. In SoCs, Chang feels that embedded memory is a key to success, but it is still necessary to have additional memory off-chip. He thinks there is a long way to go in developing successful SoC methods, and he sees 8%-10% growth a year over the next 10 years. To be successful, he explained, foundries need to provide differentiable services, particularly as there is a shrinking number of IDMs so that more chips must be made by the foundries. When asked if he saw China as a threat to Taiwan’s dominance in foundry work, Chang replied that he never thought that the Chinese would become big competitors. “Foundry work is a tough business,” Chang said, and he believes that TSMC has an unassailable lead not just because of its IP, but also because it retains a large number of highly skilled people. The entry barriers are so high, he believes, that semiconductor manufacturing, and particularly foundries, have almost become a closed industry. After getting his BS and MS degrees in mechanical engineering at MIT, Chang earned a PhD in electrical engineering from Stanford. He spent 25 years at Texas Instruments, and was president and COO of General Instruments before founding TSMC in Taiwan in 1987. — B.H. Jan. 28, 2008 – KLA-Tencor says it has “agreed in principle” to pay $65M to settle a shareholder lawsuit stemming from its longtime backdating of employee stock options — if approved it would be the second-biggest shareholder payout stemming from the backdating scandal, notes the Associated Press. The Louisiana Municipal Police Employees’ Retirement System was stated as one of the co-lead plaintiffs. Back in 2006, KLAC was the poster child when much of the US business sector, and particularly tech/Silicon Valley, was swept up in a stock-option backdating scandal — it ultimately led to ~$400M in restatements spanning nearly a decade, condemnation of former CEO Ken Schroeder, and retirement of founder/chairman Ken Levy. Mercury Interactive holds the dubious top spot for backdating settlements with a whopping $117.5M, which was absorbed by new parent company Hewlett-Packard, the AP notes. The scandal first unfolded in early 2006 when Merrill Lynch and The Wall Street Journal shed doubt on the timing of stock option distribution at companies listed in the Philadelphia Semiconductor Index. For example, those reports calculated a 1:20 million chance that 10 stock option grants to Levy from 1994-2001 which preceded KLAC stock rallies could have been just coincidence, noted the San Jose Mercury News.
1. Create a consensus viewpoint on the development of research, technologies and innovation in the areas of photonics and nanotechnologies.
2. Promote the timely world-wide exchange on scientific results, market development perspectives, and technology trends related to photonics and nanotechnologies.
3. Contribute to the intelligent deployment of resources at the regional, national, and European levels for the development of photonics and nanotechnologies.
— Nanophotonics benefits for 9 key applications
— Nanomaterials challenges and impact
— The most important nanophotonic devices
— Recommendations for European science and industry
— Custom-made roadmapping methodology
— 10-year roadmap for 12 key nanomaterials
— 10-year roadmap for 9 key types of equipment and processes
— 10-year roadmap on 9 key applications and related marketsPost navigation