Category Archives: Packaging

STATS ChipPAC Ltd., a provider of advanced semiconductor packaging and test services, today announced the appointment of Mr. James A. Norling to succeed Mr. Charles R. Wofford as chairman of the Board of Directors with immediate effect. He was appointed to the Board of Directors at the Company’s Annual General Meeting held on April 24, 2013. Mr. Wofford will retire from over 15 years of service on STATS ChipPAC’s Board of Directors, including 11 years as Chairman of the Board.

Norling is presently the Executive Chairman of GLOBALFOUNDRIES Inc. and a Director of Harley-Davidson, Inc. A well respected electronics industry veteran, Mr. Norling served a distinguished 35-year career with Motorola Inc. from 1965 to 2000, where he was the president of the Personal Communications Sector. He was the former Chairman of Chartered Semiconductor Manufacturing Ltd., from 2002 until the company was acquired by Advanced Technology Investment Corporation in 2009. Norling also served as interim President and Chief Executive Officer of Chartered during 2002.

"It is my honor and privilege to have lead STATS ChipPAC through the past 11 years of growth to be one of the largest semiconductor assembly and test companies in the world,” Wofford remarked. “This would not have been possible without the leadership and guidance of my fellow Board members. Jim’s seasoned industry experience and wealth of perspectives will contribute greatly to STATS ChipPAC’s continued success as a leading semiconductor assembly and test company."

"I am delighted to join STATS ChipPAC as the Chairman of the Board and am excited to build on the firm foundations and momentum of the Company,” Norling said. The Board expresses its deep appreciation and gratitude to Charles for his leadership and exceptional contributions as the chairman of STATS ChipPAC."

The critical processes and technologies necessary to continue Moore’s Law are currently more uncertain than ever before in the history of advanced semiconductor manufacturing. To assess these uncertainties and provide the latest information on EUV lithography, 3D transistors, 450mm wafer processing, and other challenges to preserving the pace of Moore’s Law, the leading authorities on these crucial issues will provide their insights, perspectives and predictions at SEMICON West (www.semiconwest.org), held from July 9-11 in San Francisco, Calif.  Free Registration for SEMICON West 2013 ends on  May 10 — register now: www.semiconwest.org/registration.

Although progress to take EUV lithography into the realm of high-volume manufacturing continues to be made, the readiness of source technologies, mask infrastructure and resist performance are still not known with a high degree of certainty. Until EUV Lithography is ready for high-volume manufacturing, the industry will continue to rely on double-patterning and even multiple-patterning lithography schemes using 193 immersion technology to take it beyond 22nm. How the industry will address these barriers, uncertainties and alternatives will be the focus the lithography session at SEMICON West.

The mobile market is driving the move to novel transistor architectures that offer greater performance and power benefits than traditional planar architectures. Memory and logic manufacturers are pursuing different strategies including leveraging innovations in design rules, new channel materials and processes (e.g., MOCVD) and inspection and metrology challenges.

While materials, architecture and processing technologies are undergoing revolutionary change, wafer processing platforms are also being radically transformed with a planned transition to 450mm wafers. For chip manufacturers and suppliers, this will involve increased levels of collaboration, further advancements in tool prototypes, and increased visibility into related supply chain implications.  The SEMICON West 450 Transition Forum will provide the latest updates on the status of 450 R&D, as well as a review of key technology considerations and a discussion of implications and opportunities for the supply chain.

Each of these programs will take place in the TechXPOT conference sessions on the exhibit floor.  Other TechXPOT programs include sessions on 2.5D and 3D IC Packaging, Productivity Innovation at Existing 200mm/300mm Fabs, Silicon Photonics, Lab-to-Fab Solutions, MEMS, LED Manufacturing, and Printed and Flexible Electronics.  SEMICON West will features over 50 hours of free technical, applications and business programs with the critical, need-to-know information presented by industry leaders.  .

SEMI is the global industry association serving the nano- and microelectronics manufacturing supply chains. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. 

AG Semiconductor Services, LLC (AGSS), one of the largest global suppliers of used electronics manufacturing equipment and the leader in managing large scale turnkey projects, today announced that Michael (Mike) Mardesich has joined the company in the role of senior director of sales. An industry veteran, Mardesich is tasked with developing sales strategies, managing sales and contract remarketing services and managing AGSS’ global sales force.

“Mike brings energy and intensity that are ideally suited to support the expansion of our global market presence," said Julian Gates, a Managing Director of AGSS. "He is well known throughout the electronics industry; this experience and his skill set will help solidify AGSS as the leading provider of used equipment and customer solutions to the electronics manufacturing industry."

The company also announced that former head of sales Tim Johnson will transition laterally to focus on growing AGSS’ turnkey services as well as spearhead development of future revenue channels including products and services that support non-traditional IC manufacturing such as MEMS, compound semiconductor, LED and photovoltaic. In his new role as Senior Director, Johnson will continue to support sales, remarketing and value added services as well.

Mardesich has over 30 years of experience in management, sales and equipment valuations in the electronics manufacturing used equipment industry. Prior to joining AGSS, Mardesich was the Senior Vice President of Sales with GE Capital Global Electronics Services. He also held similar positions with Comdisco Electronics Group where he was a founding member. He was an original Board Member of the SEC/N used equipment consortium.

AG Semiconductor Services, LLC is a provider of second-hand electronics manufacturing equipment and services. The company specializes in reselling pre-owned semiconductor manufacturing, IC test/assembly and printed circuit board assembly equipment acquired from leading electronics manufacturers around the world.

The market for Bluetooth semiconductors is expected to boom by nearly 100 percent from 2011 to 2017, with the majority of the growth driven by demand for wireless combination integrated circuits (ICs) and mobile system-on-chip (MSoC) devices with integrated wireless connectivity that are used in mobile devices like smartphones and media tablets.

Worldwide shipments of ICs that include Bluetooth technology are set to rise to 3.1 billion units in 2017, up 91 percent from 1.6 billion in 2011, according to a new report entitled Bluetooth—Classic or Smart Ready  from IMS Research, now part of IHS. While shipments of standalone Bluetooth chips are substantial, the market is currently dominated by combination ICs that incorporate support for multiple wireless technologies in addition to Bluetooth. However, the fastest-growing segment of the Bluetooth chip market is MSoCs, whose shipments are expected to rise by a factor of 18 from 2012 to 2017.

The graph below presents the IHS forecast of global Bluetooth-enabled chip unit shipments.

Bluetooth semiconductor shipments to double

“Smartphones and media tablets are packing increasing capabilities into products that have a lower cost and a thinner form factor,” said Liam Quirke, connectivity analyst at IHS. “All this is driving demand for more highly integrated ICs, including Bluetooth-enabled connectivity chips and MSoCs. Most of the leading smartphone platforms already make use of integrated connectivity ICs, and increasingly will adopt Bluetooth-enabled MSoCs in the future.”

No blues for Bluetooth chips

Combination connectivity ICs accounted for 75 percent of total Bluetooth chip shipments in 2012. However, due to the rise of MSoCs, the combination chips will see their share of the Bluetooth market decline to 55 percent in 2017, although their shipments will continue to rise as the overall market expands.

By 2017, MSoCs will account for 23 percent of the market, up from just 2 percent in 2012 and zero in 2011.  Standalone devices’ share of the market largely will remain flat, declining to 21 percent in 2017, down from 24 percent in 2011.

Combo ICs at the cutting edge

Many of today’s most popular and advanced smartphones and tablets are employing combination connectivity ICs.

For example, Apple Inc.’s iPad Mini and iPhone 5 employ Broadcom Corp.’s BCM4334 single-chip, dual-band combo device, as revealed by a dissection of the products conducted by the IHS iSuppli Teardown Analysis Service. The BCM4334 includes support for Wi-Fi and an FM radio receiver, along with Bluetooth.

Based on a virtual teardown, IHS iSuppli believes that Samsung’s new Galaxy S4 smartphone includes the Broadcom BCM4335, which integrates Bluetooth, along with the FM radio and a complete 5G Wi-Fi system.

MSoCs multiply

The MSoC takes the integration of combination chips to the next level, forming a single chip that incorporates the cellular baseband, applications processor and wireless connectivity.

The release of Qualcomm’s Snapdragon S4 family of processors in 2012 integrated these various elements, with many incorporating both Bluetooth and Wi-Fi. In these components, the digital portion of the connectivity IC is integrated into the SoC, taking advantage of benefits such as less power being required by the more advanced manufacturing process. The analog counterpart is situated in a companion IC, which includes components for both Wi-Fi and FM radio.

“MSoCs benefit manufacturers by reducing design complexity while providing lower-cost mobile platform solutions,” Quirke noted. “IHS is projecting that lower-end smartphones will be quick to adopt such solutions.”

North America-based manufacturers of semiconductor equipment posted $1.14 billion in orders worldwide in March 2013 (three-month average basis) and a book-to-bill ratio of 1.14, according to the March Book-to-Bill Report published today by SEMI.  A book-to-bill of 1.14 means that $114 worth of orders were received for every $100 of product billed for the month.

The three-month average of worldwide bookings in March 2013 was $1.14 billion. The bookings figure is 5.9 percent higher than the final February 2013 level of $1.07 billion, and is 21.3  percent lower than the March 2012 order level of $1.45 billion.

The three-month average of worldwide billings in March 2013 was $1.00 billion. The billings figure is 2.8 percent higher than the final February 2013 level of $974.7 million, and is 22.2   percent lower than the March 2012 billings level of $1.29 billion.

“Continued improvement in three-month average bookings for new semiconductor manufacturing equipment is reflected in the March figures, which indicate a 23 percent improvement over the prior quarter," said Denny McGuirk, president and CEO of SEMI.  “While the overall expansion of new manufacturing capacity remains muted, we see continued investment in technology upgrades by the world’s chip makers.”

The SEMI book-to-bill is a ratio of three-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers. Billings and bookings figures are in millions of U.S. dollars.

  Billings
(3-mo. avg)
Bookings
(3-mo. avg)
Book-to-Bill
October 2012 985.5 742.8 0.75
November 2012 910.1 718.6 0.79
December 2012 1,006.1 927.4 0.92
January 2013 968.0 1,076.0 1.11
February 2013 (final) 974.7 1,073.5 1.10
March 2013 (prelim) 1,001.6 1,137.1 1.14

The data contained in SEMI’s release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.

SEMI is the global industry association serving the nano- and micro-electronic manufacturing supply chains.

Increasing HD video content, social networking, shared data via the cloud, low power consumption, and “instant on” features continue to drive growth of consumer, communication, and computing devices that use NAND flash memory. While applications are many, IC Insights forecasts smartphones, tablet computers, and solid-state drives (SSDs) to be among the biggest users of NAND flash memory in 2013 (see figure).

NAND flash memory

Smartphones are forecast to account for 26 percent of the $30.0 billion NAND flash memory market in 2013.  (The NAND flash market is forecast to grow 12 percent in 2013 from $26.8 billion in 2012).  According to data from IC Insights’ 2013 IC Market Drivers Report, approximately 56 percent of total cellphone shipments in 2013 (975 million of 1,745 total shipments) are forecast to be smartphones, up from 750 million or 42 percent in 2012 and 30 percent in 2011.  This is significant because smartphones contain as much as 9x more NAND flash than a basic or enhanced cellphone.

Another high-volume application for flash memory in 2013 is solid-state drives, which are built with high-density NAND flash chips and feature standard mass-storage interfaces that are found on hard-disk drives.  SSDs are forecast to account for 13 percent of NAND flash memory sales this year.

SSDs are built in form-factor sizes that are identical to hard-disk drives (such as 1.8- and 2.5-inch modules) so they can be easily plugged into existing PC and notebook designs.  In recent years, SSD-storage capacity has quadrupled annually, and now it appears that solid-state drives are becoming serious challengers to conventional hard-disk storage in portable computers.  Recently, SSD-storage solutions have gained favor in large server computers, which stand to benefit from the faster read/write speeds of flash-memory-built drives as well as reduced power consumption.  Notebook PCs, installed car navigation systems, industrial equipment, and digital video recorders (DVRs) are a few additional applications that are being targeted for SSDs.

Tablet PCs and HHP devices—handheld players such as music/video players and handheld game systems—are expected to be significant consumers of NAND flash in 2013 as well. Tablet PCs are the fastest growing segment of the PC market and represent one of the fastest-growing consumer devices of all time. Shipments of tablet PC devices like the iPad grew to 117 million units in 2012, almost double the 65 million shipped in 2011.  Tablet PC shipments are forecast to reach 167 million units in 2013.  Leading tablet PCs typically feature 16GB of NAND flash as a starting point.

With time running out until U.S. component manufacturers are legally required to disclose their usage of conflict minerals to the federal government, many companies are woefully unprepared for the new regulations, with more than one-third of firms indicating they haven’t even commenced compliance planning, according to a survey from information and analytics provider IHS.

In a poll conducted last week during an IHS webinar entitled “The Clock’s Ticking: How to Comply with the New Conflict Minerals Regulations,” more than 35 percent of respondents—a plurality of the attendees—said they have made no plans on how to conform with the rules set out by the SEC Dodd-Frank Wall Street Reform and Consumer Protection Act on conflict materials, which will start to go into effect in May 2014. Just 7.5 percent said that they were well-prepared for compliance.

The survey was taken of 134 electronics industry managers during the IHS webinar on April 9.

The Congo connection

Conflict minerals are raw materials mainly sourced in the war-torn country of the Democratic Republic of Congo.

The materials—tantalum, tungsten, gold and tin—are widely used in the electronics market, in products ranging from cellphones to hearing aids, to pacemakers. For example, IHS estimates that $0.15 worth of tantalum was contained in every smartphone shipped when Dodd-Frank was originally signed in 2010. In 2012, this would amount to $93 million worth of tantalum in smartphones.

The SEC rules took effect in August 2012, with initial reporting required by May 2014. The rules affect publicly traded companies in the United States.

However, electronics manufacturers procure products and materials from all over the globe, so the likelihood is high that one or more supply-chain partners will require information regarding the sourcing of the four conflict minerals.

Compliance costs

While complying with the SEC rules is time-consuming and costly, the process may not be as complicated as originally projected.

One of the key industries involved in processing conflict minerals —smelters— are getting involved in and supporting compliance efforts, said Scott Wilson, content solution strategist at IHS.

“Smelters are a good control point, and this simplifies how far back in the supply chain companies have to go,” Wilson told the webinar audience.

Nevertheless, Wilson advises companies across the electronics supply chain to be prepared to provide compliance information by next May. Even if a business does not use conflict minerals in its products, it has to demonstrate it has conducted due diligence in making that determination. There is existing guidance to assist in the process, Wilson said. These include guidelines already in use issued by the Organization for Economic Cooperation and Development that outline the key aspects of compliance.

Intermolecular, Inc. today announced that it has entered into a multi-year technology development and IP licensing agreement with Micron Technology, Inc., focused on technology development and related IP for advanced memory technologies.

In their official press release, Intermolecular said the collaboration will involve development activities at Intermolecular’s R&D center in San Jose and will leverage Intermolecular’s High Productivity Combinatorial (HPC) innovation platform. The collaboration is also anticipated to provide time-to-market improvements for Micron through acceleration of advanced materials development.

"New materials and device architectures are increasingly needed to meet future embedded and mobile technology requirements, and partnering with Micron in this exciting area is a significant milestone for Intermolecular," said Dave Lazovsky, president and CEO of Intermolecular.

"Micron’s global R&D efforts are focused on creating advanced memory solutions, and we believe development of new materials technology is a key enabler to many of our future challenges," said Scott DeBoer, Micron’s vice president of research and development. "We look forward to working with Intermolecular to enhance our novel materials development efforts."

Intermolecular’s mission is to improve R&D efficiency in the semiconductor and clean energy industries through collaborations that use its HPC platform, which allows R&D experimentation to be performed at speeds up to 100 times faster than traditional methods.

Founded in 2004, Intermolecular is based in San Jose, California. Intermolecular’s focus in on a proprietary approach to accelerate research and development, innovation, and time-to-market for the semiconductor and clean-energy industries. The approach consists of its proprietary High Productivity Combinatorial (HPC) platform, coupled with its multi-disciplinary team.

Read more on advanced memory trends.

BeSpoon, a fabless semiconductor company, and CEA-Leti have demonstrated an IR-UWB integrated circuit able to measure distances within a few centimeters’ accuracy, and have established a world-record operating range at 880m (standard regulation) and 3,641m (emergency situations).

IC world-record distance measurement

Impulse radio ultra-wideband (IR-UWB) is recognized as an ideal technology for indoor applications, both in terms of accuracy and robustness. It measures distances within a few centimeters’ precision and is not affected by walls or people passing by.

The BeSpoon and Leti collaboration overcame two challenges sometimes associated with this technology: the difficulty integrating it on a single chip and its perceived limited operating range.

The chip jointly designed by BeSpoon and Leti features a full-blown IR-UWB CMOS-integrated transceiver that is able to perform accurate distance measurements. The standalone chip (RF front-end and digital base band) is designed for a straightforward integration within smartphones or set-top boxes.

Furthermore, BeSpoon has demonstrated the capability to comply with the strict regulation of IR-UWB, and yet operate up to 880m in line of sight. A world record distance measurement has been established at 3,641 meters, in compliance with the regulation for emergency situations.

“Indoor location is only beginning and, very soon, robustness and precision will be key to offering great new services,” said Jean-Marie André, BeSpoon CEO. “Mobile geofencing is another exciting development of our technology.”

“This achievement capitalizes on the UWB expertise Leti has developed over the past 12 years,” said Laurent Malier, CEO of Leti. “The world record distance measurement is a major milestone in our partnership with BeSpoon, and a source of great satisfaction for the people involved in this collaboration.”

Leti is an institute of CEA, a French research-and-technology organization with activities in energy, IT, healthcare, defence and security. NEMS and MEMS are at the core of its activities. CEA-Leti operates 8,000-m² of state-of-the-art clean room space on 200mm and 300mm wafer platforms. It employs 1,700 scientists and engineers including 320 Ph.D. students and 200 assignees from partner companies. CEA-Leti owns more than 2,200 patent families.

 BeSpoon is a fabless semiconductor company, responsible for cracking the individual positioning problem. BeSpoon chips can track items or individuals within a few centimeters.

The same material that formed the first primitive transistors more than 60 years ago can be modified in a new way to advance future electronics, according to a new study.

Chemists at Ohio State University have developed the technology for making a one-atom-thick sheet of germanium, and found that it conducts electrons more than ten times faster than silicon and five times faster than conventional germanium.

The material’s structure is closely related to that of graphene—a much-touted two-dimensional material comprised of single layers of carbon atoms. As such, graphene shows unique properties compared to its more common multilayered counterpart, graphite.  Graphene has yet to be used commercially, but experts have suggested that it could one day form faster computer chips, and maybe even function as a superconductor, so many labs are working to develop it.

 “Most people think of graphene as the electronic material of the future,” Goldberger said. “But silicon and germanium are still the materials of the present. Sixty years’ worth of brainpower has gone into developing techniques to make chips out of them. So we’ve been searching for unique forms of silicon and germanium with advantageous properties, to get the benefits of a new material but with less cost and using existing technology.”

In a paper published online in the journal ACS Nano, he and his colleagues describe how they were able to create a stable, single layer of germanium atoms. In this form, the crystalline material is called germanane.

Researchers have tried to create germanane before. This is the first time anyone has succeeded at growing sufficient quantities of it to measure the material’s properties in detail, and demonstrate that it is stable when exposed to air and water.

In nature, germanium tends to form multilayered crystals in which each atomic layer is bonded together; the single-atom layer is normally unstable. To get around this problem, Goldberger’s team created multi-layered germanium crystals with calcium atoms wedged between the layers. Then they dissolved away the calcium with water, and plugged the empty chemical bonds that were left behind with hydrogen. The result: they were able to peel off individual layers of germanane.

Studded with hydrogen atoms, germanane is even more chemically stable than traditional silicon. It won’t oxidize in air and water, as silicon does. That makes germanane easy to work with using conventional chip manufacturing techniques.

The primary thing that makes germanane desirable for optoelectronics is that it has what scientists call a “direct band gap,” meaning that light is easily absorbed or emitted. Materials such as conventional silicon and germanium have indirect band gaps, meaning that it is much more difficult for the material to absorb or emit light.

“When you try to use a material with an indirect band gap on a solar cell, you have to make it pretty thick if you want enough energy to pass through it to be useful. A material with a direct band gap can do the same job with a piece of material 100 times thinner,” Goldberger said.

The first-ever transistors were crafted from germanium in the late 1940s, and they were about the size of a thumbnail. Though transistors have grown microscopic since then—with millions of them packed into every computer chip—germanium still holds potential to advance electronics, the study showed.

According to the researchers’ calculations, electrons can move through germanane ten times faster through silicon, and five times faster than through conventional germanium. The speed measurement is called electron mobility.

With its high mobility, germanane could thus carry the increased load in future high-powered computer chips.

“Mobility is important, because faster computer chips can only be made with faster mobility materials,” Golberger said. “When you shrink transistors down to small scales, you need to use higher mobility materials or the transistors will just not work,” Goldberger explained.

Next, the team is going to explore how to tune the properties of germanane by changing the configuration of the atoms in the single layer.

Lead author of the paper was Ohio State undergraduate chemistry student Elizabeth Bianco, who recently won the first place award for this research at the nationwide nanotechnology competition NDConnect, hosted by the University of Notre Dame. Other co-authors included Sheneve Butler and Shishi Jiang of the Department of Chemistry and Biochemistry, and Oscar Restrepo and Wolfgang Windl of the Department of Materials Science and Engineering.

The research was supported in part by an allocation of computing time from the Ohio Supercomputing Center, with instrumentation provided by the Analytical Surface Facility in the Department of Chemistry and Biochemistry and the Ohio State University Undergraduate Instrumental Analysis Program. Funding was provided by the National Science Foundation, the Army Research Office, the Center for Emergent Materials at Ohio State, and the university’s Materials Research Seed Grant Program.