Category Archives: Packaging

In the 1970s, the semiconductor industry was vertically integrated. Most companies were IDMs with manufacturing, design, intellectual property (IP) and marketing activities. During this period, manufacturing technology evolution was strong and required new fabs, which directly increased capital expenditures. Companies desired an attractive Return on Invested Capital (ROIC), and to obtain it they developed a new, lower-investment business model by including manufacturing services in their portfolio.

In the 1980’s, the first pure foundries emerged — and ten years later, the fabless business model was born. The rest, as they say, is history; according to GSA, in 2011 there were 1,800 fabless companies worldwide, covering a variety of sectors.

In the power electronics field, the fabless business model is not as common compared to the MEMS industry. For example, most power electronics players have their own capabilities/fabs dedicated mainly to silicon wafer manufacturing. According to Yole Développement, $4B was generated by MEMS fabless companies in 2012, against less than $300K in the power electronics area. Is power electronics a world apart?

“Less than 10 companies have been clearly identified in the Power Electronics industry. This trend is clearly linked to the introduction of new materials like GaN and SiC wafers in manufacturing technologies. New products already commercialized, for example photovoltaic inverters, use thesenew materials. Yole Développement is currently analyzing the Power Electronics industry in orderto understand what the next step will be,” explains Alexandre Avron, Power Electronics Technology & Market Analyst at Yole Développement.

Indeed, for a long time the power electronics field and its key players only considered silicon wafers. Today, however, the power semiconductor industry is entering a new era: for the first time, power electronics companies are developing new solutions based on “non-silicon” manufacturing technologies. This evolution is not without big investments, though, and in order to limit them, some companies have decided to become fabless and collaborate with large fabs to produce the necessary components.

The truth is that power electronics is not a world apart, and that the fabless business model has just become a reality in the field. It represents a real opportunity for power electronics companies to introduce new components and embrace the technology evolution.

For the second straight year, Yole Développement and Serma have joined forces to organize the Successful Semiconductor Fabless conference, a unique European event dedicated to the fabless business model. This event takes place in Paris, from April 10 to 12.

ALTIS Semiconductor, a global specialty foundry based in France, announced today the finalization of a foundry agreement with IBM Microelectronics. Under the terms of this agreement, ALTIS will be the foundry partner for the IBM 180nm SOI technology. ALTIS will deliver high volume products starting Q2 2013 and will secure capacity increase for 2014 and beyond to address the IBM forecasted demand.

This agreement allows the company to leverage its analog/mixed signal and RF expertise as well as its proven operational excellence and quality focus to serve a long term partner, who is well recognized within the industry for its technology leadership and innovation.

ALTIS has a long term relationship with IBM Microelectronics and has produced many product families for IBM over the past decades. This foundry agreement addresses the next generation of consumer products, including as an example, the RF/SOI chipsets used in the world most advanced mobile devices.

IBM’s 7RFSOI technology provides advantage by simultaneously enabling the required level of integration and performance for the large number of switches required in the modern smartphone for example cellular antenna switches, diversity antenna and WLAN.

“We are extremely pleased to expand our strategic relationship with IBM Microelectronics,” said Jean-Paul Beisson, CEO of ALTIS.

"It is another proof that ALTIS is able to provide a competitive solution to worldwide leading customers like IBM and we look forward to this continued collaboration with IBM for many years to come," said Yazid Sabeg, Chairman of ALTIS.

Altis Semiconductor is an independent and long-term innovative European based specialty foundry, servicing the growing demand for high quality end-to-end foundry services. The Altis process portfolio encompasses advanced CMOS based technologies for RF, low power, high performance analog mixed signal, non-volatile embedded memory, and high voltage requirements for a broad range of end market applications, including automotive.

Signetics Corporation today introduced their new MapBGA package to the industry. This alternative to standard PBGA packaging has improved reliability and design flexibility due to its unique assembly process. A one shot side gate map molding process is used to cover the entire substrate area, protecting the active traces and vias. This process allows for more efficient use of the substrate panels and strips with as much as 55% more units per panel verses a typical PBGA package. The process is very robust as it uses proven transfer molding equipment and the mold clamps only touch the non-active area of each strip. Also, the assembled devices are saw singulated, eliminating mechanical stress on the package from traditional punch methods of singulation. Finally, the map molding process allows the package to have a larger mold cap and in turn, accommodate a larger die.

"Mature packages such as the PBGA must continue to evolve to meet the changing demands of applications", stated YS Kim, vice president of engineering at Signetics. "The MapBGA package is able to provide that extra amount of design flexibility and reliability using proven assembly technologies and equipment to make it a cost effective alternative to standard PBGA," continued Kim.

 Signetics offers a broad range of ball grid array (BGA) packaging including flip chip, stacked die, multi-chip and thermally enhanced variations. Assembly partnerships with Tier 1 device manufacturers has helped drive Signetics to continue to develop these next generation BGA packages to create a dynamic portfolio of semiconductor assembly solutions.

OKI Engineering, provider of reliability evaluations and environmental conservation technologies for the OKI Group, recently delivered KGT-3MM-AP exhaust gas treatment equipment for atmospheric pressure CVD manufacturing equipment to semiconductor manufacturer ON Semiconductor’s European plants. The exhaust gas treatment equipment remove the special material gases used with atmospheric pressure CVD manufacturing equipment while controlling and maintaining constant exhaust pressure. Thus, it ensures reliability and consistency in the CVD thin film manufacturing line, ultimately helping to maintain the customer’s production environment.

In the manufacture of semiconductors such as Power FET and IGBT atmospheric pressure, CVD manufacturing equipment is vital at the stage of insulating film manufacture. However, this equipment uses harmful gases such as silane (SiH4), phosphine (PH3), and diborane (B2H6) and requires exhaust gas processing. OKI Engineering’s KGT-3MM-AP exhaust gas treatment equipment is a wet-type processor that effectively processes the special material gases and particulate matter used in CVD thin film manufacture. The treatment equipment contains a special stainless steel filter to improve scrubbing efficiency. The design minimizes filter clogging for extended maintenance-free use. A unique design intended to facilitate cleaning of the internal filter has won praise for ease of maintenance. The micromanometer used for pressure control was designed specifically for CVD gas use. Inverter control for the exhaust fan ensures the constant exhaust pressure essential for atmospheric pressure CVD thin film manufacture and extended operational reliability and consistency.

"Three years previously, OKI Engineering delivered the KGT-3MM-AP to ON Semiconductor as an exhaust gas processor for Amaya continuous atmospheric pressure CVD manufacturing equipment," says Yutaka Asai, President of OKI Engineering. "This latest order for ON Semiconductor’s European plants was prompted by ON semiconductor’s satisfaction with the processor’s pressure control configuration and exhaust gas scrubbing efficiency and by the benefits of consistent, trouble-free CVD thin film manufacture. Introduction of the treatment equipment ensures consistent film thickness distributions for CVD thin films, including NSG, PSG, and BPSG, at ON Semiconductor’s European plants. It also increases factory throughput while cutting exhaust gas processing costs."

OKI Engineering began manufacturing exhaust gas treatment equipment approximately 30 years ago. Since then, it has supplied treatment equipments to numerous semiconductor and solar cell mass production plants in Japan and Taiwan. This latest order expands its reach into Europe. OKI Engineering also plans to expand into new regions including Southeast Asia.

Cadence Design Systems, Inc. today announced plans to aquire Tensilica, Inc. for approximately $380 million in cash. Tensilica had approximately $30 million of cash as of December 31, 2012.

"With Tensilica, we will be able to provide designers with a more complete SoC solution that will speed the development of innovative and differentiated products, while reducing time to market," said Lip-Bu Tan, president and chief executive officer of Cadence. "We look forward to working with Tensilica’s dedicated employees as one team to bring even more value to our customers."

"Joining Cadence will provide a broader platform to expedite our product development strategy and customer engagement,” said Jack Guedj, president and CEO of Tensilica. “We will have the ability to accelerate IP subsystem development and integration while providing a more extensive support network to our customers."

Cadence intends to finance the transaction with available cash and an existing revolving credit facility. The transaction is expected to close in the second quarter of fiscal 2013, subject to customary closing conditions including regulatory approvals. Cadence expects the transaction to be slightly dilutive to its non-GAAP earnings per share in fiscal 2013 due to the impact of merger-related accounting and accretive to its non-GAAP earnings per share in fiscal 2014. The impact on GAAP earnings per share will be available after valuation and the completion of purchase accounting.

"The acquisition of Tensilica by Cadence will be a positive move for the industry," said Simon Segars, president of ARM Holdings plc. "We look forward to expanding our ongoing collaboration with Cadence to enable our customers to bring great products to market."

Tensilica customized DPUs augment traditional custom hardware design, offering both time-to-market and programmability advantages and can be optimized to achieve optimal power, performance and area efficiency. Tensilica IP provides application-optimized subsystems that work with industry-standard CPU architectures.

Tokyo-based Asahi Glass Co., Ltd. and nMode Solutions Inc. of Tucson, Arizona, have invested $2.1 million to co-found a subsidiary business, Triton Micro Technologies , to develop via-fill technology for interposers, enabling next-generation semiconductor packaging solutions using ultra-thin glass. The new company, headquartered in Tucson with a manufacturing facility planned in California, will combine nMode’s interposer technology for electrically connecting semiconductor devices with AGC’s materials technology and micro-hole drilling techniques to produce 2.5-dimensional (2.5D) and three-dimensional (3D) through-glass-via (TGV) interposers needed for advanced semiconductor devices.

To achieve the next generation in high-density semiconductor packaging, interposer technologies are needed to form the high number of electrical connections between a silicon chip and a printed circuit board. Interposers allow high packaging integration in the smallest available form factors.

Triton Micro Technologies will manufacture ultra-thin glass interposers using a high-efficiency continuous process that lowers costs and helps to commercialize the widespread use of interposers. The company will draw upon nMode’s intellectual property and AGC’s proven carrier-glass technology and via-hole drilling methodologies to fabricate its interposers. Triton then will apply its proprietary technology to fill the high-aspect-ratio via holes with a copper paste that has the same coefficient of thermal expansion as glass. This reduces the potentially damaging effects of thermal stress during manufacturing and long-term use. Triton’s process creates high-quality electrodes within the interposer to provide the electrical interface capable of accommodating advanced, high-density ICs.

Triton’s interposers are compatible with wafers having diameters from 100mm to 300mm and thicknesses of 0.7mm and below. The company also can design and manufacture customized solutions for unique applications.

“The global semiconductor industry recognizes that silicon is approaching its performance limits as an interposer material, but the need remains to create smaller, more efficient packages for today’s and tomorrow’s high-performance ICs,” said Tim Mobley, CEO at Triton. “Our technology allows us to achieve known-good-die testing at the highest levels of packaging integration, faster cycle times and the lowest cost per unit in the market.”

Heraeus will present numerous product highlights with regard to bonding wires, assembly materials and sputtering targets at this year’s Semicon China, taking place on March 19-21, 2013 in Shanghai.

New bonding wire innovations

Regarding bonding wires, the company shows the new silver alloy wire AgUltra. The good reflectivity surface, as well as good mechanical and electrical properties make it particularly applicable for LED device and IC packaging. Especially, silver makes this wire a cost-effective alternative to gold wires.

The MaxSoft2 is the newest copper wire in the current product range of Heraeus Bonding Wires. Due to its better workability, it can be especially used for high pin count and fine pitch applications.

Assembly materials

Heraeus will be featuring another product in its series of solder pastes: the new water soluble halogen free solder past F590.

The water-soluble halogen free flux activation system provides excellent wetting. There is minimal void formation on a variety of substrates, component terminations and surfaces.

In its range of water cleanable fluxes, Heraeus has developed the WSD3890. It is a water soluble halogen free tack flux designed for bumping, BGA and CSP applications. Some key benefits include its excellent cleaning properties and long tackiness life.

Sputtering targets

Conference attendees can also expect to hear about Heraeus’ advances in the area of sputtering targets. These are used in markets such as hard disk drives, electronics/semiconductor, displays, glass or photovoltaics.

 

MRAM: disruptive technology for storage applicationsEveryone wants faster access to stored data, and the issue is becoming critical with Big Data and cloud initiatives. With the speed of DRAM and the non-volatility of storage, Magnetoresistive Random Access Memory (MRAM) encourages a new way of thinking about storage applications. Storage is associated with longer latencies, but with MRAM storage can have similar latencies to memory. These capabilities and others make MRAM a catalyst for new thinking about how we design storage applications.

MRAM Overview

MRAM stores data using magnetic polarization rather than electric charge. As a result, MRAM stores data for decades while reading and writing at RAM speed without wearing out. MRAM products use an efficient cell with one transistor to deliver the highest density and best price/performance in the non-volatile RAM marketplace.

The first generation of commercial MRAM uses the magnetic field from current pulses in corresponding metal digit lines and bit lines. Toggle MRAM uses a unique sequence of pulses, bit orientation and proprietary layers in the magnetic tunnel junction. Products developed with Toggle MRAM are SRAM compatible in specification and package, filling a need where data persistence is critical.

Prior to MRAM, system designers had to provide a way to protect critical data in the event of power loss. In the case of SRAMs, a battery is required to keep the device powered up to retain critical data, but batteries present a host of issues such as replacement, frequent failures and disposal. Chipmakers have also resorted to integrating both SRAM and non-volatile memory such as EEPROM or Flash in a single chip, commonly called nvSRAM. The complexity of this approach drives up chip cost and adds to system complexity in order to ensure that critical data is backed up when power fails. With the inherent, automatic non-volatility of MRAM, system designers have been utilizing MRAM in a broad base of applications including enterprise storage, industrial automation, smart meters, transportation, and embedded computing. Whenever frequent writing of critical data that must be protected in the event of power loss is a requirement, Toggle MRAM based persistent SRAM is now the preferred choice because of the simplicity of implementation, compatibility with CPU memory busses, and elimination of less reliable, more complex methods to protect the critical data.

Advances in Spin Torque MRAM development expands the market

The introduction of ST-MRAM, the second generation of MRAM technology, with a high bandwidth DDR3 DRAM interface brings MRAM into a category of the memory market with DRAM-like performance, combined with non-volatility, called persistent DRAM. Now MRAM can be utilized in the data path of applications that need extremely low latency, high endurance and, again, protection of data on power loss. Storage devices, appliances and servers will benefit from a persistent DRAM class of product.

Storage servers have resorted to employing large, bulky super capacitors to DRAM modules to provide enough residual energy to capture last written data, or they have employed non-volatile DIMMs (modules), which have both DRAM and non-volatile memory at a significant cost adder. MRAM, with its relatively simple, 1 transistor + 1 magnetic tunnel junction structure, eliminates the need for costly batteries, capacitors or complex mixed technology RAMs to provide the best combination of non-volatile memory and RAM-like performance.

Scaling the MRAM bit cell to allow for higher density in more advanced lithography nodes will require a transition from field switching to spin torque switching. Figure 1 shows a comparison between the two. In spin torque, the free layer is flipped with the angular momentum from the electrons going from one magnetic layer to the other through the tunnel barrier. This approach eliminates the need to generate a magnetic field with current in metal lines as is done in the toggle write technique. The simpler structure has the potential to provide the path to higher densities and lower cost per bit, which are fundamental to becoming a mainstream memory technology.

Although the density of initial spin torque MRAM (ST-MRAM) products will not be as high as the aforementioned DRAM and NAND Flash products, the added benefit of non-volatility at RAM speeds will make ST-MRAM a valuable addition to those memory technologies. This breakthrough approach is leading to new thinking about memory hierarchy as system designers, both hardware and software, start utilizing ST-MRAM as a performance and reliability enhancement in systems such as enterprise storage.

For example, there is a potential to complement and extend the system life of NAND based SSDs by providing a layer of persistent memory that does not have an endurance issue, or to extend the performance of high-end storage appliances that cannot tolerate the longer latency required to program NAND Flash memory. Loss of data on power outages can be addressed by adding a bank of ST-MRAM in a traditional DRAM cache in a server application and protect the last data being written. Making memory controllers, RAID controllers or SSD controllers both aware of and capable of talking to ST-MRAM is part of the ecosystem development in storage that is taking place now.

The longer-term promise of ST-MRAM is that it will rapidly scale down the semiconductor technology feature size roadmap and attain Gigabit densities in the coming years at feature sizes in the 20nm range. This opens up even further market opportunity as ST-MRAM can be thought of as either a DRAM replacement technology or an alternative mass storage technology. In the meantime, MRAM has quickly become the preferred choice for protecting critical data in a wide range of systems and will reach into storage systems as a performance and reliability enhancement as ST-MRAM products move to production.

A New Storage Tier

There is a gap between DRAM and NAND Flash when it comes to performance. MRAM makes it possible to disrupt computer design by adding a new tier of storage between the DRAM and NAND Flash. You have a microprocessor with one, two, or three levels of cache memory so the processor doesn’t wait for data to come to it over a memory bus. The DRAM keeps loading that microprocessor cache with updated information, trying to anticipate what the CPU will want next.

DRAM has a speed on the order of tens of nanoseconds, but DRAM is quite expensive in storage terms. Rather than putting in hundreds of gigabytes of DRAM, designers use data storage. The data still has to go over a storage bus like SATA or SAS, and even though these storage buses are quite fast there’s still a latency getting data from a spinning disk – milliseconds of time. NAND Flash has changed that tremendously, and this is why we see a tremendous adoption of NAND Flash SSDs.

However, NAND Flash has asymmetrical performance. It is very fast when reading data, but the limitation is that it doesn’t write very fast. When it comes time to put data back into storage there’s a latency there that can be measured in microseconds. And what NAND offers in density and cost it lacks in endurance – it wears out quickly. DRAM and MRAM have virtually infinite endurance, on the order of 1015 or more writes, but some of the NAND on the market now has only tens of thousands of wear cycles.

So even with NAND Flash, computer and storage systems are still limited by data storage in terms of performance. In order to increase IOPS, you have to break that bottleneck. That’s where MRAM comes in. MRAM can supplement the cache RAM in a microprocessor as well as buffer data storage.

Because MRAM is persistent and also has the speed of DRAM, system architects can start thinking about where that boundary is between RAM to the processor and storage to the storage system. In an ideal world, you would have MRAM at high enough densities to where it can act as a storage layer. Because it has infinite endurance you no longer care about wear leveling or overprovisioning as you have with NAND Flash. This is not to say that MRAM will take the place of NAND Flash, but it will create a new storage tier that bridges the gap between DRAM and NAND Flash. MRAM would be a faster, solid-state array for very performance-intensive applications, or another caching tier where the NAND Flash is loading into and out of MRAM.

If the operating system is aware that there’s a tier of non-volatile memory out there, it can really begin to take advantage of that from a performance standpoint. The IOPS will go way  up, and performance is greatly enhanced.

 RAM Cache Applications

The other application for MRAM is in the RAM cache itself. While data is in RAM, it’s vulnerable. When there’s a power glitch, the data that’s in RAM may not be stored permanently anywhere yet. For high-reliability storage, system architects jump through hoops to mitigate that problem with supercapacitors or batteries. These provide enough power to the RAM to flush whatever’s in DRAM to NAND Flash in the event of a power disruption. But supercapacitors add tens to even a hundred dollars to the BOM for a DRAM tier, and batteries are notoriously unreliable.

If you use MRAM instead of DRAM, data written to the MRAM cache is permanent. Power losses don’t affect the storage of data in MRAM. So we have an opportunity to simplify system design, enhancing reliability and eliminating the need for these other ways to provide energy to DRAM. In this case, MRAM will replace DDR3 DRAM.

MRAM can sit on the same memory bus as the DDR3 DRAM, and you can have a couple of banks of DRAM and a couple of banks of MRAM. This allows designers to segment the cache between writes and reads. Typically you need a very large read buffer for the amount of data coming off the disk arrays to the CPU, but where you’re writing there’s a relatively small amount of data. The concept is to have the MRAM function as the write cache.

We can also think about MRAM as a new storage tier, where what they’ve done to accelerate storage is to put NAND arrays in front of HDDs on a serial ATA bus. Now we’re proposing that there be a smaller array but with even higher performance in MRAM that can talk to any kind of controller or processor.

As we can see, MRAM presents several different disruptive applications for storage and computer design. As MRAM densities improve and costs decline, it will become a standard part of storage infrastructure.

Joe O’Hare is the director of product marketing at Everspin Technologies.

 

Smartphones are set to become even more flexible and more satisfying to use, thanks to a unique sensor system developed by STMicroelectronics. Combining three optical elements in a single compact package, the VL6180 is the first member of ST’s FlightSense family and uses a new optical-sensing technology that reduces the incidence of dropped calls and enables innovative new user interactions with smartphones.

The VL6180 uses a ground-breaking proximity measuring technology to offer unprecedented accuracy and reliability in calculating the distance between the smartphone and the user. Instead of estimating distance by measuring the amount of light reflected back from the object, which is significantly influenced by color and surface, the sensor precisely measures the time the light takes to travel to the nearest object and reflect back to the sensor. This “Time-of-Flight” approach ignores the amount of light reflected back and only considers the time for the light to make the return journey.

"This marks the first time that Time-of-Flight technology has been made available in a form factor small enough to integrate into the most space-constrained smartphones,” said Arnaud Laflaquière, General Manager of ST’s Imaging Division. “This technology breakthrough brings a major performance enhancement over existing proximity sensors, solving the face hang-up issues of current smartphone and also enabling new innovative ways for users to interact with their devices."

The key to ST’s patented new solution is an infra-red emitter that sends out light pulses, an ultra-fast light detector that picks up the reflected  pulses, and electronic circuitry that accurately measures the time difference between the emission of a pulse and the detection of its reflection.

Combining electronic, optical and packaging unique expertise from across the company, the VL6180 embeds both a robust ranging time-of-flight sensor and a wide dynamic ambient light sensor die, along with an infra-red emitter. Thanks to its all-in-one, ready- to-use architecture, the VL6180 is easy to integrate and saves the phone-makers long and costly optical and mechanical design optimizations.

Addressing dropped calls is not the only benefit that ST’s new technology brings to the smartphone market.  The ability to measure a reliable absolute distance from the phone to a hand or other object opens up new user interaction scenarios that phone manufacturers and app developers can rapidly exploit.

Broadcom has been ranked number one vendor in three recent competitive assessments released by ABI Research on wireless connectivity IC markets. One was for overall wireless connectivity ICs, another on Bluetooth ICs, and a final on Wi-Fi ICs.

Broadcom is the market leader for wireless connectivity ICs, with by far the largest market share. It has had particular success with media tablets and successive wireless connectivity combo ICs, used predominantly in smartphones from handset vendors such Apple, Samsung, LG, HTC, Nokia, and many more. Qualcomm claimed second place overall in each of the Competitive Assessments and is snapping at Broadcom’s heels.

“The wireless connectivity IC market has gone through a transition period over the last few years, from one served by technology specific companies, to one served largely by technology agnostic companies that have wide product portfolios,” commented Peter Cooney, practice director. “As more devices have embraced 2 or more short-range wireless technologies it has been those suppliers that have been able to integrate Bluetooth, Wi-Fi, GPS, NFC, FM, etc., such as Broadcom, that have grabbed market share from competitors and become market leaders whilst others have been marginalized.”

In the next fivwe to 10 years, as the Internet of Everything (IoE) market develops and there will be two distinct markets: hubs and nodes. There will be increased integration into platform ICs, vendors will need to be able to provide all of the building blocks for devices (such as smartphones) in order to populate the market with multi-radio hubs capable of interacting with the billions of new node devices that will tend to be single technology solutions. Each of these will require IC vendors to have a multi-technology strategy to take advantage of the expanding market, and it is the vendors with the widest product portfolios that will be most successful.

ABI Research provides in-depth analysis and quantitative forecasting of trends in global connectivity and other emerging technologies.