Category Archives: Semiconductors

Skyera Inc. today announced it has selected 16nm NAND Flash from SK Hynix for its new skyEagle all-Flash enterprise storage array.

"We believe that building a strategic partnership with Skyera will open a new window to bring broad and deep expertise in Flash technology system-level issues to complement the world-class semiconductor excellence of SK Hynix," said Young Joon Choi, senior vice president of SK Hynix. "This pairing ensures that the industry’s very best Flash technology experts will be guiding this collaboration as the two companies continue to produce Flash chips and systems that raise the bar for the rest of the market."

"This is an exciting partnership that combines the expertise of one of the leaders in NAND Flash and the leader in all-Flash enterprise storage systems to ensure that the technology is optimized for new generations of enterprise applications," said Radoslav Danilak, CEO of Skyera. "The information exchange between Skyera’s team of elite Flash storage system designers and the chip design expertise and cutting-edge manufacturing process optimization of SK Hynix offers staggering potential for the future of enterprise Flash storage."

Skyera is the only enterprise array vendor with advanced Flash management technology that can take advantage of the cost and capacity benefits of the most advanced NAND Flash media, yet still deliver IOPS performance and durability that exceed enterprise standards. Skyera’s third-generation adaptive Flash controller, as implemented in the company’s new skyEagle solid-state array, provides a 5-year Flash life cycle at a price point now even lower than HDD-based enterprise storage arrays.  To achieve comparable performance and durability with conventional Flash controllers requires other array vendors to use older generation, more expensive eMLC or SLC Flash and sacrifice the density and capacity of the newest 16nm Flash chips.

View Inc. today announced Harold Hughes, a semiconductor industry veteran, is joining the company’s board of directors. Hughes previously held positions of CEO of Rambus and CFO of Intel and brings extensive experience driving global commercialization of innovative technology-oriented products.

"We are excited to welcome Harold to the View board of directors," said Dr. Rao Mulpuri, CEO of View Inc. "View is rapidly expanding its commercial capability and manufacturing operations to support the strong market momentum for our dynamic glass product.  Harold has held key leadership positions in innovative technology companies, and brings broad financial, operating and business strategy credentials to our board at this important juncture."

Hughes brings to View more than 30 years of experience in the high technology industry, including service as a corporate officer in major multi-national companies.  Hughes served as a director of Rambus Inc., a chip interface company from 2003 to 2012 and as its chief executive officer and president from 2005 to 2012.  He started his career as a United States Army Officer before starting his private sector career at Intel.  He held a variety of positions within Intel including treasurer, vice president of Intel Capital, chief financial officer, and vice president of planning and logistics. Following his tenure at Intel, Hughes was the chairman and chief executive officer of Pandesic, LLC. Hughes currently also serves on the board of directors of Cortina Systems and Cresta Tech.  He holds a B.A. in Liberal Arts from the University of Wisconsin and an M.B.A. from the University of Michigan.

"I’m excited to join View to help scale the company and its game-changing dynamic glass technology," Hughes said.  "I believe View has the right product and a world-class management team dedicated to bringing this technology into the mainstream.  I look forward to supporting View’s continued success."

The Storage Products Business Unit of Toshiba is pleased to announce that its solid state hybrid drive (SSHD) series has been honored with a Best of Show Award at this year’s Flash Memory Summit. The award, which recognizes excellence in innovation and flash memory consumer applications, was presented at the 8th Annual Flash Memory Summit at the Santa Clara Convention Center.

Read more: Micron 16nm NAND wins Flash Memory Summit Best of Show Award

Toshiba’s MQ01ABFH and MQ01ABDH SSHD series is equipped with Toshiba’s NAND flash and available in capacities ranging from 320GB to 1TB and in 7mm and 9.5mm form factors. The series continues Toshiba’s legacy of providing world-class storage products, and offers customers a complete lineup of 2.5-inch solid state hybrid drives for ultrathin, thin and light notebook PCs, multimedia and gaming applications, and traditional laptop PCs.

Flash memory is being used today in ways that raise the bar of innovation when coupled with hard drive technology to create hybrid storage solutions addressing applications which require accelerated performance and high capacity,” said Jay Kramer, Chairman of the Awards Program and President of Network Storage Advisors Inc. “We are proud to select Toshiba Solid State Hybrid Drive for the Best of Show Award based on bringing to market the innovation of ‘self-learning’ caching algorithms that learn the system user’s data access patterns to optimize performance and manage how user data is stored to the NAND Flash for quick response and integrated to the high capacity hard drive storage for the best of both worlds.”

“Toshiba’s SSHD series reflects our continued devotion to create innovative storage technology,” said Don Jeanette, director of product marketing at Toshiba Storage Products Business Unit. “Flash Memory Summit is one of the leading events in the storage industry, and Toshiba is honored to receive such recognition.”

Micron Technology, Inc. announced that its 16-nanometer (nm) NAND process technology has been chosen by Flash Memory Summit as the 2013 Best of Show award winner in the category of Most Innovative Flash Memory Technology. The annual Best of Show Awards are a premier opportunity for industry recognition of innovative products and solutions and how they are being used in the marketplace.

Read more: Micron unveils 16nm Flash memory technology

Micron’s 128Gb MLC NAND Flash memory devices are targeted at consumer SSDs, removable storage (USB drives and Flash cards), tablets, ultrathin devices, mobile handsets and data center cloud storage. They provide the greatest number of bits per square millimeter and the lowest cost of any MLC device in existence. In fact, the new technology could create nearly 6TB of storage on a single wafer.

"We’re thrilled with this recognition of our latest development in Flash technology," said Glen Hawk, vice president of Micron’s NAND Solutions Group. "This is a very cost-effective, capital-friendly technology that will be ramping this year and into next year."

Winning products were judged by a panel of industry experts who evaluated each nomination according to the following criteria:

  • Distinctiveness of the application, technology, or product
  • Central use of Flash memory as a solution or innovation
  • Technical and business significance to the general marketplace

"The judges of the Flash Memory Summit Awards Committee had the challenging assignment of selecting the most innovative Flash memory technology from an incredibly large pool of quality submissions. The industry’s advances in semiconductor technology is of paramount value in raising the bar with Flash technology," said Jay Kramer," Chairman of the Awards Program and President of Network Storage Advisors, Inc.

"We are proud to select Micron’s 16nm NAND technology, enabling the industry’s smallest 128Gb multilevel cell (MLC) NAND Flash devices, for the Best of Show Innovation Award."

Micron was honored at the Flash Memory Summit Awards evening reception in the Exhibit Hall on Wednesday, August 14.

 

Flexible thin film solar cells that can be produced by roll-to-roll manufacturing are a highly promising route to cheap solar electricity. Now scientists from Empa, the Swiss Federal Laboratories for Materials Science and Technology, have made significant progress in paving the way for the industrialization of flexible, light-weight and low-cost cadmium telluride (CdTe) solar cells on metal foils. They succeeded in increasing their efficiency from below eight to 11.5 percent by doping the cells with copper, as they report in the current issue of “Nature Communications.”

In order to make solar energy widely affordable scientists and engineers all over the world are looking for low-cost production technologies. Flexible thin film solar cells have a huge potential in this regard because they require only a minimum amount of materials and can be manufactured in large quantities by roll-to-roll processing. One such technology relies on cadmium telluride (CdTe) to convert sunlight into electricity. With a current market share that is second only to silicon-based solar cells CdTe cells already today are cheapest in terms of production costs. Grown mainly on rigid glass plates, these so-called superstrate cells have, however, one drawback: they require a transparent supporting material that lets sunlight pass through to reach the light-harvesting CdTe layer, thus limiting the choice of carriers to transparent materials.

The inversion of the solar cell’s multi-layer structure – the so-called substrate configuration – would allow further cost-cuttings by using flexible foils made of, say, metal as supporting material. Sunlight now enters the cell from the other side, without having to pass through the supporting substrate. The problem, though, is that CdTe cells in substrate configuration on metal foil thus far exhibited infamously low efficiencies well below eight percent – a modest comparison to the recently reported record efficiency of 19.6 percent for a lab-scale superstrate CdTe cell on glass. (Commercially available CdTe superstrate modules reach efficiencies of between 11 and 12 percent.)

Copper doping for solar cells

One way to increase the low energy conversion efficiency of substrate CdTe cells is p-type doping of the semiconductor layer with minute amounts of metals such as copper (Cu). This would lead to an increase in the density of “holes” (positive charge carriers) as well as their lifetimes, and thus result in a high photovoltaic power, the amount of sunlight that is turned into electrical energy. A perfect idea – if CdTe weren’t so notoriously hard to dope. “People have tried to dope CdTe cells in substrate configuration before but failed time and again,” explains Ayodhya Nath Tiwari, head of Empa’s laboratory for Thin Films and Photovoltaics.

His team decided to try nonetheless using high-vacuum Cu evaporation onto the CdTe layer with a subsequent heat treatment to allow the Cu atoms to penetrate into the CdTe. They soon realized that the amount of Cu had to be painstakingly controlled: if they used too little, the efficiency wouldn’t improve much; the very same happened if they “over-doped.”

The electronic properties improved significantly, however, when Lukas Kranz, a PhD student in Tiwari’s lab, together with Christina Gretener and Julian Perrenoud fine-tuned the amount of Cu evaporation so that a mono-atomic layer of Cu would be deposited on the CdTe.

“Efficiencies increased dramatically, from just under one percent to above 12,” says Kranz. Their best value was 13.6 percent for a CdTe cell grown on glass; on metal foils Tiwari’s team reached efficiencies up to 11.5 percent.

Increasingly ambitious targets: hitting the 20 percent ceiling

For now, the highest efficiencies of flexible CdTe solar cells on metal foil are still somewhat lower than those of flexible solar cells in superstrate configuration on a special (and expensive) transparent polyimide foil, developed by Tiwari’s team in 2011. But, says co-author Stephan Buecheler, a group leader in the lab: “Our results indicate that the substrate configuration technology has a great potential for improving the efficiency even further in the future.” Their short-term goal is to reach 15 percent.

“But I’m convinced that the material has the potential for efficiencies exceeding 20 percent.”

The next steps will focus on decreasing the thickness of the so-called window layer above the CdTe, including the electrical front contact. This would reduce light absorption and, therefore, allow more sunlight to be harvested by the CdTe layer.

“Cutting the optical losses” is how Tiwari calls it.

The study was supported by the Swiss National Science Foundation (SNSF) and the Competence Center Energy and Mobility of the ETH Domain (CCEM-Dursol).

A team at the University of California, Riverside Bourns College of Engineering has developed a novel way to build what many see as the next generation memory storage devices for portable electronic devices including smart phones, tablets, laptops and digital cameras.

The device is based on the principles of resistive memory, which can be used to create memory cells that are smaller, operate at a higher speed and offer more storage capacity than flash memory cells, the current industry standard. Terabytes, not gigbytes, will be the norm with resistive memory.

Read more: Crossbar unveils resistive RAM with simple, three-layer structure

The key advancement in the UC Riverside research is the creation of a zinc oxide nano-island on silicon. It eliminates the need for a second element called a selector device, which is often a diode.

"This is a significant step as the electronics industry is considering wide-scale adoption of resistive memory as an alternative for flash memory," said Jianlin Liu, a professor of electrical engineering at UC Riverside who is one of the authors of the paper. "It really simplifies the process and lowers the fabrication cost."

resistive RAM; nano island on silicon
This is a series of images that shows the zinc oxide nano-island on silicon and the three modes of the operation.

The findings were published online this week in the journal Scientific Reports, which is part of Nature Publishing Group. The paper is called "Multimode Resistive Switching in Single ZnO Nanoisland System."

Liu’s co-authors were: Jing Qi, a former visiting scholar in Liu’s lab and now an associate professor at Lanzhou University in China; Mario Olmedo, who earned his Ph.D. from UC Riverside and now works at Intel; and Jian-Guo Zheng, a director of the Laboratory of Electron and X-ray Instrumentation at UC Irvine.

Flash memory has been the standard in the electronics industry for decades. But, as flash continues to get smaller and users want higher storage capacity, it appears to reaching the end of its lifespan, Liu said.

With that in mind, resistive memory is receiving significant attention from academia and the electronics industry because it has a simple structure, high-density integration, fast operation and long endurance.

Researchers have also found that resistive memory can be scaled down in the sub 10-nanometer scale. Current flash memory devices are roughly using a feature size twice as large.

Resistive memory usually has a metal-oxide-metal structure in connection with a selector device. The UC Riverside team has demonstrated a novel alternative way by forming self-assembled zinc oxide nano-islands on silicon. Using a conductive atomic force microscope, the researchers observed three operation modes from the same device structure, essentially eliminating the need for a separate selector device.

Memory devices like disk drives, flash drives and RAM play an important role in our lives. They are an essential component of our computers, phones, electronic appliances and cars. Yet current memory devices have significant drawbacks: dynamic RAM memory has to be refreshed periodically, static RAM data is lost when the power is off, flash memory lacks speed, and all existing memory technologies are challenged when it comes to miniaturization.

Increasingly, memory devices are a bottleneck limiting performance. In order to achieve a substantial improvement in computation speed, scientists are racing to develop smaller and denser memory devices that operate with high speed and low power consumption.

Prof. Yossi Paltiel and research student Oren Ben-Dor at the Hebrew University of Jerusalem’s Harvey M. Krueger Family Center for Nanoscience and Nanotechnology, together with researchers from the Weizmann Institute of Science, have developed a simple magnetization progress that, by eliminating the need for permanent magnets in memory devices, opens the door to many technological applications.

Published in Nature Communications, the research paper, A chiral-based magnetic memory device without a permanent magnet, was written by Prof. Yossi Paltiel, Oren Ben Dor and Shira Yochelis at the Department of Applied Physics, Harvey M. Krueger Family Center for Nanoscience and Nanotechnology, Hebrew University of Jerusalem; and Shinto P. Mathew and Ron Naaman at the Department of Chemical Physics, Weizmann Institute of Science.

The research deals with the flow properties of electron charge carriers in memory devices. According to quantum mechanics, in addition to their electrical charge, electrons also have a degree of internal freedom called spin, which gives them their magnetic properties. The new technique, called magnetless spin memory (MSM), drives a current through chiral material (a kind of abundantly available organic molecule) and selectively transfers electrons to magnetize nano magnetic layers or nano particles. With this technique, the researchers showed it is possible to create a magnetic-based memory device that does not require a permanent magnet, and which could allow for the miniaturization of memory bits down to a single nanoparticle.

The potential benefits of magnetless spin memory are many. The technology has the potential to overcome the limitations of other magnetic-based memory technologies, and could make it possible to create inexpensive, high-density universal memory-on-chip devices that require much less power than existing technologies. Compatible with integrated circuit manufacturing techniques, it could allow for inexpensive, high-density universal memory-on-chip production.

According to the Hebrew University’s Prof. Paltiel, “Now that proof-of-concept devices have been designed and tested, magnetless spin memory has the potential to become the basis of a whole new generation of faster, smaller and less expensive memory technologies.”

The technology transfer companies of the Hebrew University (Yissum) and the Weizmann Institute of Science (Yeda) are working to promote the realization of this technology, by licensing its use and raising funds for further development and commercialization. With many possible applications, it has already attracted the attention of start-up funds.

The Hebrew University’s Center of Nanoscience and Nanotechnology helped with device fabrication and advice. Prof. Paltiel acknowledges the Yessumit internal grant from the Hebrew University, and Ron Naaman and Shinto P. Mathew acknowledge the support of the Minerva Foundation.

Established in 2001, the Center for Nanoscience and Nanotechnology deals with diverse fields of nanoscience such as new materials, molecular and nano-electronics, nano-electrooptics, nanomedicine and nano-biology. The research will enable technological development of new transistors, memory elements, sensors and biosensors, renewable energy sources, directed drug delivery schemes, and more. Operating within the Faculty of Science, the Center aims to create an enabling environment for interdisciplinary research, education, technological development and commercialization of scientific achievements in the field of Nanoscience and Nanotechnology, in order to participate as a leading force in the world nanotechnology revolution and contribute to Israeli academia, industry and society. The Center has almost 70 member groups and is expected to expand further through recruitment of promising young faculty members.

 

Research and Markets today announced the addition of the "Global Semiconductor Foundry Market 2012-2016" report to their offering.

One of the key factors contributing to this market growth is the customer’s need to restock inventory. The global semiconductor foundry market has also been witnessing an increased adoption of expansion strategies. However, the fluctuating revenue of the semiconductor market could pose a challenge to the growth of this market.

The key vendors dominating this space include GlobalFoundries Inc., Semiconductor Manufacturing International Corp., Taiwan Semiconductor Manufacturing Co. Ltd., and United Microelectronics Corp.

The other vendors mentioned in Research and Market’s report are Apple Inc., Dongbu HiTek Co. Ltd., IBM Microelectronics, Magnachip Semiconductor Corp., Powerchip Technology Corp., Samsung Semiconductor Inc., Tower Semiconductor Ltd. (TowerJazz), Vanguard International Semiconductor Corp., and WIN Semiconductors Corp (GaAs).

According to Research and Markets, the global semiconductor foundry market is witnessing an increasing consolidation and strategic alliances between market players, which are expected to continue even in the future. Both existing vendors and new entrants prefer the acquisitive route to either enter the market or broaden their portfolio of offerings. For instance, Hua Hong NEC Electronics and Grace Semiconductor Manufacturing Corp. completed their merger in 2011. In addition, IBM, Global Foundries, and Samsung Electronics Co. Ltd. have formed an alliance in the market. Since the market is highly fragmented and competitive, players are adopting strategies such as alliances, agreements, and mergers to sustain the competition.

One of the main drivers is the restocking of inventory by customers. As the demand for semiconductor devices is increasing, customers are replenishing the stock to keep pace with the current as well as near-future market conditions. For the past few years, this has been one of the major contributing factors to the growth of the market.

Jon Peddie Research (JPR) announced estimated graphics chip shipments and suppliers’ market share for 2013 2Q.

While the news was disappointing year-to-year, the news was encouraging quarter-to-quarter.

AMD overall unit shipments increased 10.9 percent, quarter-to-quarter, Intel increased 6.2 percent, and Nvidia decreased by 8 percent.

Read more: In first quarter, Nvidia is clear winner but bad news for Intel

The overall PC market declined 2.5 percent quarter-to-quarter while the graphics market increased 4.6 percent. Overall this net 7.1 percent increase reflects an interest on the part of consumers for double-attach—the adding of a discrete GPU to a system with integrated processor graphics, and to a lesser extent dual AIBs in performance desktop machines.

On a year-to-year basis we found that total graphics shipments during Q2’13 dropped 6.8 percent while PC shipments which declined by at a faster rate of 11.2 percent overall. GPUs are traditionally a leading indicator of the market, since a GPU goes into every system before it is shipped and most of the PC vendors are guiding down to flat for Q3’13.

The popularity of tablets and the persistent economic slowness are the most often mentioned reasons for the decline in the PC market and the CAGR for PC graphics from 2012 to 2016 is -1.4 percent; JPR expects the total shipments of graphics chips in 2016 to be 319 million units.

JPR’s findings include discrete and integrated graphics (CPU and chipset) for Desktops, Notebooks (and Netbooks), and PC-based commercial (i.e., POS) and industrial/scientific and embedded. This report does not include handhelds (i.e., mobile phones), x86 Servers or ARM-based Tablets (i.e. iPad and Android-based Tablets), Smartbooks, or ARM-based Servers. It does include x86-based tablets.

The quarter in review:

  • AMD’s shipments of desktop heterogeneous GPU/CPUs, i.e., APUs declined 9.6 percent from Q1 and increased an astounding 47.1 percent in notebooks. The company’s overall PC graphics shipments increased 10.9 percent.
  • Intel’s desktop processor-graphics EPG shipments decreased from last quarter by 1.4 percent, and Notebooks increased by 12.13 percent. The company’s overall PC graphics shipments increased 6.2 percent.
  • Nvidia’s desktop discrete shipments were down 8.9 percent from last quarter; and, the company’s mobile discrete shipments decreased 7.1 percent. The company’s overall PC graphics shipments declined 8.0 percent.
  • Year-to-year this quarter AMD overall PC shipments declined 15.8 percent, Intel dropped 12.9 percent, Nvidia declined 5.1 percent, and VIA fell 12.4 percent from last year.
  • Total discrete GPUs (desktop and notebook) were down 5.5 percent from the last quarter and were down 5.2 percent from last year for the same quarter due to the same problems plaguing the overall PC industry. Overall the trend for discrete GPUs is up with a CAGR to 2016 of -2.2 percent.
  • Ninety nine percent of Intel’s non-server processors have graphics, and over 67 percent of AMD’s non-server processors contain integrated graphics; AMD still ships IGPs.

Year-to-year for the quarter the graphics market decreased. Shipments were down 16.1 million units from this quarter last year.

Samsung today introduced the first solid state drive (SSD) based on its recently released 3D V-NAND technology. Samsung announced its new SSD, designed for use in enterprise servers and data centers, during a keynote at the Flash Memory Summit 2013.

 Samsung V-NAND SSD

Read more: Samsung starts mass producing industry’s first 3D vertical NAND flash

“By applying our 3D V-NAND – which has overcome the formidable hurdle of scaling beyond the 10-nanometer (nm) class, Samsung is providing its global customers with high density and exceptional reliability, as well as an over 20 percent performance increase and an over 40 percent improvement in power consumption,” said E.S. Jung, executive vice president, semiconductor R&D center at Samsung Electronics and a keynote speaker at the Flash Memory Summit. “As we pioneer a new era of memory technology, we will continue to introduce differentiated green memory products and solutions for the server, mobile and PC markets to help reduce energy waste and to create greater shared value in the enterprise and for consumers.”

Read more: SSD market scores big in Q1

Samsung’s V-NAND SSD comes in 960 gigabyte (GB) and 480GB versions. The 960GB version boasts the highest level of performance, offering more than 20 percent increase in sequential and random write speeds by utilizing 64 dies of MLC 3D V-NAND flash, each offering 128 gigabits (Gb) of storage, with a six-gigabit-per-second SATA interface controller. The new V-NAND SSD also offers 35K program erase cycles and is available in a 2.5 inch form factor with x, y and z-heights of 10cm, 7cm and 7mm, which provides server manufacturers with more design flexibility and scalability.

Samsung’s proprietary 3D V-NAND technology achieves manufacturing productivity improvements over twice that of 20nm-class planar NAND flash, by using cylinder-shaped 3D Charge Trap Flash cell structures and vertical interconnect process technology to link the 24 layers comprising the 3D cell array. During his keynote remarks, EVP E.S. Jung emphasized that “The 3D V-NAND will drive disruptive innovation that can be compared to a Digital Big Bang in the global IT industry, and contribute to much more significant growth in the memory market.”

Samsung will continue to introduce next-generation V-NAND products with enhanced performance to meet diverse customer needs for NAND flash-based storage. These customer focuses will range from large data centers that can realize higher investment potential based on greater performance and energy efficiency to PC applications that place a high priority on cost-effectiveness and high density, further strengthening Samsung’s business competitiveness.

Samsung said it began producing its new V-NAND SSDs earlier this month.

Read more: How Samsung is climbing the charts