Category Archives: Top Story Right

July 25, 2012 — Polarizers used in display manufacturing will form a $9.94 billion market in 2012, up 4% from 2011, according to Displaybank. Sequentially, the polarizer market decreased by 9% in Q1 2012, hitting 2.235 billion. This was down 6% from Q1 2011.

The majority of polarizers — 98% — will be used in thin-film transistor liquid crystal displays (TFT-LCDs), with the remainder divvied up between active matrix organic light-emitting diode (AMOLED) and other display technologies. Starting in 2012, the AMOLED TV market is expected to grow gradually. New films are being developed to meet this need, as compensation films used in small- and medium-sized AMOLED displays are inadequate for large-size AMOLEDs. While just 2% of the overall polarizer market in 2012 ($167 million), AMOLED-use polarizers will grow to 9% of the total segment by 2016, Displaybank reports, exceeding $1 billion.

Figure. Polarizer market forecast by technology/size. SOURCE: Displaybank, Polarizer Market & Industry Trend Analysis.

Acrylic films will also see growth. Acrylic films are used to replace Z-TAC, a polarizer compensation film for IPS. Now, acrylics are being investigated as an alternative to plane TAC films. This has been shown in small and medium-sized applications, and could emerge in 2013 and grow rapidly in 2014.

“Polarizer Market & Industry Trend Analysis” analyzes the market forecast of polarizer, production line status by manufacturer, supply chain, and price trend from 2010 to 2016. In addition, this report intends to give a better understanding of the polarize market where the competition of the  high value-added film production started in earnest through the market analysis of important optical sub-material films, TAC film, PVA film, PET protective film, release film, anti-reflection film, and compensation film.

Learn more and access the report at http://www.displaybank.com/_eng/research/report_view.html?id=15&cate=4

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July 25, 2012 — Micron Technology Inc. (MU) is more than doubling its dynamic random access memory (DRAM) manufacturing capacity by buying bankrupt Elpida Memory’s assets. But the move is “not without risk,” according to IHS.

Micron’s DRAM production volume will grow to approximately 370,000 wafer starts per month over the long term, up 131% thanks to the purchase. Micron will move past Hynix Semiconductor (300k WSPM) in the DRAM maker standings, falling behind only Samsung Electronics (400k WSPM) for market share.

Based on Q1 rankings, Micron’s Elpida acquisition will boost its standing to 24.8% share of the DRAM space, behind Samsung’s 40.8% and ahead of Hynix’s 24.2%.

Figure. Global DRAM forecast, wafer starts per month, before and after Micron’s purchase of Elpida. SOURCE: IHS iSuppli Research, July 2012.

With all this opportunity, the risks are present. “Integration could prove challenging or even messy if details are not worked out carefully enough,” said Mike Howard, senior principal analyst for DRAM & memory at IHS. Howard points to past memory company acquisitions by Micron — Numonyx and Inotera — that “presented unanticipated surprises,” which Micron is still “digesting.” Elpida could just pile on more challenges to the complicated integration process that Micron is involved with for these companies. Technology transfer from Elpida could be costly and take significant time, Howard says.

IHS considers the purchase price of the Elpida transaction, the way payments will be made and how the payments will be funded, to be worthy of analysis. The total purchase cost is $2.5 billion, of which $750.0 million is to be paid in cash. The cash portion of the payment is intended for Elpida assets and will be due at the close of the deal, expected sometime in 2013. The cash payment won’t necessarily reduce the cash balance of Micron, as it will gain access to all of Elpida’s cash and current assets on the bankrupt company’s balance sheet. Elpida at the end of December 2011 had approximately $1.4 billion in assets.

The balance of $1.75 billion will not be paid until December 2014 through 2019, and is paid out in interest-free installments, which benefits Micron.

The deal also calls for the payments to come from the free cash flow of a restructured Elpida, which will now turn into a Micron subsidiary. If Elpida is not cash-flow positive in its new role as Micron offspring, then no payments will have to be made by the parent company.

Concurrent to its Elpida acquisition, Micron spent $330 million to buy out Powerchip Semiconductor’s minority interest in Rexchip Electronics, in which Elpida had majority two-thirds share. Micron now holds 89% ownership share of Rexchip, which has a cost competitive, leading-edge manufacturing plant in Taiwan.

Read more of IHS iSuppli’s analysis in Micron Continues Role as DRAM Consolidator

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July 24, 2012 — Toshiba Corporation (TOKYO:6502) will reduce its NAND Flash memory semiconductor production by 30% with new, lower output at its Yokkaichi Operation fab in Mie Prefecture, Japan.

About one year ago, Toshiba and its partner SanDisk Corporation (NASDAQ:SNDK) opened Fab 5, the third 300mm NAND wafer fabrication facility at the site.

Toshiba blames a NAND Flash oversupply for USD memories and memory cards for the need to cut production. Prices for NAND in these sectors have fallen throughout 2012, Toshiba reports. This year, Toshiba is celebrating 25 years since it invented NAND.

In 2011, analyst firm IHS praised Toshiba’s ability to bounce back quickly from the 3/11 earthquake and tsunami off the coast of Sendai. “Strong demand, fortunate fab location, and quick wafer supply replenishment allowed Toshiba Corp. to quickly regain some of its lost market share,” according to the IHS iSuppli Memory & Storage Service. IHS puts Toshiba as the second largest NAND supplier globally, behind Samsung, both with 30+% market share.

Toshiba expects supply and demand for NAND flash chips to balance out by September, thanks to high growth rates for PCs and smartphones. Toshiba will adjust NAND Flash output accordingly.

Learn more at www.toshiba.com.

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July 24, 2012 — The automotive IC market will grow 8% this year, to $19.6 billion, reports IC Insights. Semiconductor content per vehicle is increasing to $380 in 2012, up 9% from 2011.

The 2008 automotive downturn initiated a structural change in the auto industry, with makers now offering user friendly, technological advanced, and more affordable vehicles, IC Insights notes. Automakers also are shifting more production towards electric vehicles (EVs) and hybrid electric vehicles (HEVs), due in part to the “green” movement and to high gasoline prices in the US.

IC Insights forecasts the automotive IC market will grow to $27.3 billion in 2015, which represents average annual growth of 11% from 2011-2015 (see the figure).

Figure. 2009-2015 automotive IC market forecast. SOURCE: IC Insights, July 2012.

Semiconductor content per vehicle is expected to increase 11% annually between 2009 and 2015, reaching $495 per vehicle at the end of the forecast period, which suggests that the “trickle-down effect” of technology into lower-priced cars will happen at a faster rate than was expected a few years ago. This also suggests that more HEVs and EVs will be sold; these cars use more semiconductors than a typical gas-powered vehicle. HEVs and EVs currently account for <2% of total new vehicle shipments. IC Insights forecasts that in 2015, full electric vehicles will contain about twice as much semiconductor content as a standard car.

Additional details and a revised forecast for the automotive, cellphone, PC, wireless networking, and digital television markets can be found in IC Insights’ Update to its 2012 IC Market Drivers Report–A Study of Emerging and Major End-Use Applications Fueling Demand for Integrated Circuits.  The report examines many of the leading system applications for ICs and evaluates the potential growth for new applications that are expected to fuel the market for ICs through 2015. To review additional information, visit www.icinsights.com.

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July 23, 2012 — The market for refurbished semiconductor manufacturing equipment has grown steadily — estimated at $6 billion (Semico report, 2010). Fabs looking to increase capacity quickly and minimize costs commonly acquire secondary equipment.

Various companies, from refurbishers to brokers, sell secondary semiconductor equipment at a lower cost than new equipment. While finding used tools is easy, semiconductor manufacturers must consider the additional installation, refurbishment, reconfiguration, warranty, service, support, and other factors involved in using secondary equipment.

Fabs typically need a number of tools, requiring a fab to approach different vendors who handle each individual tool. Vendors may only be capable of handling part of the fab’s needs rather than a full turnkey project, necessitating a project manager at the chipmaker to oversee the process. Adhering to timelines, and ensuring quality and reliability, present significant challenges.

Flexibility creates stability and predictability

Instead of providing individual tools or services, a different model handles the fab’s needs as a single, seamless turnkey project.

In the common refurbisher/broker model, where neither party is fully integrated with the other, there is a potential for delays and cost over-runs as negotiation for core tools and configuration design issues arise. Refurbishment should be just one step of a refurbishment project, wherein a team of experts ensure quality and reliability at every stage — delivering on time, ramping to schedule and staying within budget are equally important.

The turnkey services model integrates each step as part of a process rather than a single service or product sold to a fab. This can be called a "project-process model" (as compared to providing a single step solution in which the user seeks out the supplier of the next step in the process elsewhere).

Secondary equipment options

The project-turnkey process aims to transform a complex series of tasks, each with a high degree of variability, into a predictable outcome — on time and within budget. To achieve this, the project begins with analysis of the fab’s needs, building a plan to deliver this at the highest quality, lowest risk, and lowest cost.

Once the fab’s configuration needs are understood, numerous options are available: for equipment there is anything from ‘as-is’ to Tier II process demonstration. Purchasing secondary equipment ‘as-is’ is the cheapest solution but it is also the riskiest. It is often difficult to accurately understand the condition of the equipment and if it will match the configuration needs of the fab. There are indeed no guarantees that the equipment will work. Some fabs will take this risk, as they have the in-house engineering capabilities to work with the tool.

On the other hand, a full Tier II installation eliminates the risk of the unpredictable at an additional cost. The turnkey model dictates that the project does not end at installation but rather all equipment is installed under warranty with the option of expert escalation, should the need arise.

Another way to minimize costs is for fabs to work with their equipment source to identify equipment running at other facilities, which can be de-installed, shipped and re-installed at the fab (this is known as a relocation project). From a cost and time to ramp perspective, this is normally the most effective way of getting tools in to production. However, the shutdown, documentation and de-install of the tools are critical steps in this process. It is not uncommon for fabs to purchase operational equipment only later to have it shut down incorrectly or without fingerprinting. This makes start up challenging and creates needless expense. When handling a turnkey project where tools from another facility are utilized, the best method is to shut down tool adhering to a well-documented iterative process. This helps ensure the same performance in the new location. Occasionally, relocation procedures may facilitate opportunities for repair or modification before install.

Whether its a complete Tier II turnkey approach or a blended approach with relocation tools, the aim is effective tool acquisition at minimal cost, for predictable, stable fab expansion within the company’s ramp timing.

Figure. RED Equipment warehouse.

Buying ahead of the market

Semiconductor manufacturing equipment is expensive. Without an acquisition model, buying a tool could easily be seen as a given expense — a certain tool is needed, it costs a certain amount, and there is nothing much that can be done about it. The turnkey project-process takes a different approach. Utilizing a more flexible model, users can obtain more, at lower cost.

Turnkey equipment suppliers can hold a large inventory, and buy the tools for customers’ future needs ahead of their budget availability. Often, fab tools become available when a fab’s capital expenditures (capex) budget has not yet been approved.

Buying ahead of the market can ease both cost and availability concerns. The market for used equipment is just as dynamic as the rest of the semiconductor industry, with its own cycles. When the market is good, tools become scarce and their prices go up. Often, tools are available at a lower cost in a weak market, but chipmakers do not have budget to acquire them. A forward-thinking partnership between semiconductor manufacturer and secondary equipment supplier can manipulate the ups and downs of semiconductors to their advantage. This approach requires a very close working relationship between the turnkey provider and fab.

A close working relationship with the equipment supplier may also yield alternate procurement models to the ones the fab envisioned, in the event that the requested core tools are not available in the market; the OEM no longer exists or no longer supports the tool; or parts or consumables are highly priced. In these cases, an alternate model may be a better option. The turnkey project model takes these situations into consideration, while a ‘one tool, one service’ model does not.

Engineering services

Usually, semiconductor fabs need more than just equipment for a new line or expansion. The engineering services required are unique to each fab and project, based on maturity of technology, experience of the chipmaker’s engineering team, and fab location. However, there is often an ongoing need for post-install engineering services, such as spares, training, or technical support.

Where appropriate, an engineering team from a turnkey equipment source will suggest cost-saving options during the design phase of the project. Ongoing spare parts costs can be reduced by qualifying new sources during the ramp. For example, alternate quartz in a furnace or strip tool, or a different type of ceramic in a process chamber. Installing tools to Tier II qualification provides the fab with the opportunity to fast-track part changes into their facility, avoiding months of process requalification.

Conclusion

The turnkey provider is motivated to ensure that a fab’s expansion project happens. The single tool provider is focused on selling the tool type that they specialize in without considering the whole view.

The turnkey model sees refurbishment from the fab’s point of view rather than that of the product or service provider. Refurbishment is more than just tool selection and adjustment. Frustration and expense can be mitigated by planning ahead and seeing the whole picture — handling the refurbishment as a project rather than simply providing a single tool or service. By equipment supplier/fab partnership, the resulting purchases meet technical requirements and time constraints, and minimize risk for the fab.

Carl McMahon is VP of North America sales at RED Equipment. He holds a BS in Information Technology and Economics from The Open University, United Kingdom.

Also read: Refurbished equipment: heating up and coming of age

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July 20, 2012 — Maxim Group LLC analyzed metal organic chemical vapor deposition (MOCVD) utilization and revenues at light emitting diode (LED) makers in Taiwan, finding that MOCVD orders are placed just to maintain capacity, not add, and high utilization rates are only at the top LED makers.

The next uptick in MOCVD spending is likely to “fall far short” of the peak seen in 2010-2011, Maxim reported. The analysts expect H2 2012 MOCVD orders at about 130 tools.

High tool utilization reports are coming from Epistar, ForEpi, and Genesis Photonics. Large LED players like Sanan are expanding in H2 2012. Epistar is planning new LED fabs (Miaoli and Fujian) by 2014. Still, near-term spending doesn’t signifies a return to growth, but instead what is needed to maintain spending levels in 2H 2012 and 2013, Maxim said. Higher MOCVD utilization rates are not the norm across all LED makers, but rather at sector leaders.

Figure. Revenue Rebound Points to High Utilization at Epistar and Genesis Photonics but Not Others

After falling three quarters in a row, revenue at seven Taiwanese LED chip makers jumped 29% Q/Q in Q2 2012 on a rebound in display backlighting applications. While this has driven utilization at high-quality vendors with exposure to general lighting like Epistar to >95%, Maxim estimated small, lower-quality players remain at ~70%. With Taiwan’s TV subsidy ending and Europe entering a recession, Maxim does not expect backlighting to drive a new wave of MOCVD spending.

Also read: LED cost and manufacturing topics of Veeco LED maker gathering in Taiwan

Lower subsidies and lower profitability will keep MOCVD spending in check, unlike 2010-2011. Maxim does not see a traditional cyclical downturn/boom, despite some pick up once general lighting adopts LEDs. In 2013-2014, expect MOCVD tool orders to hit about 300 systems, far below the peak numbers of 700+.

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July 18, 2012 — Purdue University researchers have demonstrated self-calibrating micro electro mechanical systems (MEMS), which enable higher accuracy for existing and new MEMS applications.

“Each MEMS device is slightly different due to variations that occur in manufacturing,” said Jason Vaughn Clark, an assistant professor of electrical and computer engineering and mechanical engineering at Purdue University, explaining the value of self calibration. Microstructure geometry, stiffness, and mass all influence performance, and can vary MEMS device to MEMS device. Conventional MEMS test methods are impractical and expensive, with unknown accuracy and large uncertainty, Clark added.

Clark developed the self-calibration theory, then demonstrated the device alongside doctoral student Fengyuan Li, validating the thesis.

Figure. A self-calibratable MEMS. SOURCE: Purdue University Birck Nanotechnology Center image/Jason Vaughn Clark.

The self-calibrating technology makes it possible to accurately measure displacement on a scale of micrometers to less than a nanometer. “Quantities like velocity, acceleration, force, stiffness, frequency, and mass can be related to displacement,” said Clark.

The heart of the self-calibrating MEMS are two gaps of differing size, electrostatic sensors and comb drives with meshing fingers drawn toward each other when a voltage is applied, and returned to their original position when the voltage is turned off. The comb drives measure the change in capacitance while gauging the distances of the two gaps built into the device. The fine measurements reveal the difference between the device’s designed layout and the actual dimensions.

"Once you learn the difference between layout and fabrication, you have calibrated the device," Clark said. "Many MEMS designs with comb drives can be easily modified to implement our technology."

The new self-calibratable MEMS could eliminate or reduce the need for rigorous factory calibration on high-accuracy MEMS for navigation or other applications,  Clark said, estimating up to 30% of manufacturing costs relate to calibration.

The self-calibratable MEMS could lead to high-performance data storage technologies and advanced lithography to create next generation computer circuits and nanodevices. “A $15 chip that can fit on your fingertip…is able to measure MEMS displacements better than a $500,000 electron microscope,” as a result of self-calibration, Clark noted.

Researchers will use the new self-calibration approach to improve the accuracy of atomic force microscopes (AFMs), calibrating AFM displacement, stiffness, and force.

The group also will use a calibrated MEMS to measure the difference in gravity between different heights above the ground. The ability to measure gravity with such sensitivity could be used as a new tool for detecting underground petroleum deposits. "Conventional gravity meters can cost over $200,000," Clark said. "They consist of a large vacuum tube and a mirrored mass. Gravitational acceleration is determined by measuring the drop time of the mass in free fall. Since oil or mineral deposits have a different density than surrounding material, the local gravity is slightly different." Other applications abound.

The self-calibratable technology also could allow MEMS to recalibrate themselves after being exposed to harsh temperature changes or remaining dormant for long periods.

The work is based at the Birck Nanotechnology Center in Purdue’s Discovery Park. The research is funded by the National Science Foundation.

Findings are detailed in a paper to appear later this year in the IEEE Journal of Microelectromechanical Systems (JMEMS), “Self-Calibration for MEMS with Comb Drives: Measurement of Gap,” Fengyuan Li and Jason Vaughn Clark, Purdue University, Discovery Park, Birck Nanotechnology Center.

Abstract:

We present a practical method for measuring planar gaps of MEMS with comb drives by on-chip or off-chip electrical probing. We show that our method is practical, accurate, precise, and repeatable. The option of on-chip, postpackaged electrical measurement enables MEMS to be autonomously self-calibratable. We use the measurement of gap to determine the geometrical difference between layout and fabrication, which can lead to measurements of other properties such as displacement, force, stiffness, mass, etc. Our method consists of applying enough voltage to close two unequal gaps and measuring the resulting changes in capacitances. Many MEMS designs with comb drives can be easily modified to implement our technology. Our results are an order better than convention, and suggest means for further improvement.

Courtesy of Emil Venere and Jason Vaughn Clark at Purdue.

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July 18, 2012 — IC Insights’ latest survey and ranking of the major semiconductor capital spenders shows that only 6 of the 35 major semiconductor suppliers — Intel, Samsung, Hynix, TSMC, UMC, and Rohm — with significant capital expenditure budgets are expected to spend more in 2012 than they did in 2011. 

Though only six companies are expected to increase their capital spending this year, the total semiconductor capital spending forecast figure for 2012 was raised to $63.3 billion from an earlier estimate of $60.7 billion; total 2012 semiconductor industry capital expenditures are now forecast to decline only 3% this year as compared to the previous expectations of an 8% decline.

Table 1. Major capital spenders planning 2012 increases in capex. SOURCE: IC Insights, company reports.

2012F

Company

2011 ($M)

2012F ($M)

12/11 change (%)

1

Intel

10,764

12,500

16

2

Samsung

11,755

13,100

11

3

TSMC

7,333

8,250

13

4

Hynix

3,165

3,680

16

5

UMC

1,585

2,000

26

6

Rohm

385

685

78

Total

34,987

40,215

15

Others

30,568

23,055

-25

WW Total

65,555

63,270

-3

The six major companies that plan to increase semiconductor capital spending this year are expected to collectively spend about $5.2 billion more in 2012 than in 2011.  In contrast, the total of the remaining capital spending outlays are forecast to decline by about $7.5 billion this year.

With an increase of $1.7 billion, Intel is expected to post the biggest dollar increase in capex spending for 2012, though it is likely to trail Samsung in overall capex spending for the year.

A few of the major outsourced semiconductor assembly and test (OSAT) companies also plan to significantly increase capital spending this year. IC Insights believes that these increased spending budgets by some of the major OSAT companies indicates their belief that semiconductor unit volume shipments will be on the rebound this year.

Table 2. Major capital spenders in the OSAT sector planning 2012 capex increases. SOURCE: IC Insights, company reports.

Company

2011 ($M)

2012F ($M)

12/11 change (%)

Amkor

493

550

12

SPIL

376

585

56

STATS ChipPAC

304

400

32

Total

1,173

1,535

31

IC Insights will examine and provide further details on semiconductor capital spending in its 250+ page Mid-Year Update to The McClean Report, scheduled for release at the end of July. To review additional information about IC Insights’ new and existing market research products and services, visit: www.icinsights.com.

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July 17, 2012 — Total touchscreen module revenue will reach $16 billion in 2012, and nearly double in six years, reaching $31.9 billion by 2018, according to the most recent NPD DisplaySearch 2012 Touch Panel Market Analysis. The market growth is being driven by increased demand from display applications such as iPads and other tablet PCs, smart phones, and emerging notebook PC designs.

Touch screen penetration has rapidly increased in mobile phones, handheld games, and game consoles, as well as in tablet PC applications, which are forecast to collectively account for more than $13.6 billion in touch screen revenues this year. In addition, NPD DisplaySearch forecasts strong touch screen growth over the next several years driven by demand in larger display applications such as convertible/hybrid notebook PCs.

Mobile phones are the biggest application for touch screens in terms of unit shipments, accounting for three-fourths of units shipped in 2011. NPD DisplaySearch forecasts that 1.2 billion touch screens will ship for mobile phone applications in 2012, up 68% Y/Y.

Tablet PC is a fast-growing application for touch screens. Shipments tripled in 2010 and reached 79.6 million in 2011. Growth continues to be strong, with NPD DisplaySearch forecasting more than 130 million touch screens for tablet PCs in 2012, and more than 190 million in 2013. Revenues for touch screens in tablet PCs are expected to grow by more than $3 billion in 2013.

Touch penetration is expected to increase dramatically in convertible/hybrid notebook PCs. The Ultrabook by Intel will start to adopt touch screens by end of this year, and Microsoft Surface tablets will also integrate touch screens. NPD DisplaySearch forecasts touch screen penetration on notebook PCs will increase from 2% in 2011 to about 8% in 2013.

Over the next few years, all-in-one PCs and automobile monitors are expected to contribute to touch screen market growth as well. Touch technologies with high transmittance, low power consumption, multi-touch or gesture recognition will benefit the most.

Currently, the leading touch technology is projected capacitive touch; however demand for other technologies is on the rise.

“Demand is growing for thinner, light weight, and lower cost touch panels and devices. In addition, we see strong touch screen growth over the next several years in larger display applications such as convertible/hybrid notebook PCs and all-in-one PCs,” noted Jennifer Colegrove, PhD, Vice President of Emerging Display Technologies at NPD DisplaySearch. “Over the next few years, in-cell, on-cell, and sensor-on-cover touch technologies will surpass the add-on type projected capacitive touch.”

Figure. Touchscreen module revenue forecast. SOURCE: NPD DisplaySearch 2012 Touch Panel Market Analysis.

The NPD DisplaySearch 2012 Touch Panel Market Analysis report is a comprehensive analysis of the touch panel technologies and their market forecasts through 2018. This report has detail breakdown of 23 applications (with TV application added this year), with 12 touch technology categories (including sensor-on-cover and gesture-in-air) and 9 size categories. It also has details on touch controller ICs, the sensor market, shipments by area, and forecasts for multi-touch through 2018. NPD DisplaySearch surveyed over 200 suppliers of touch screen modules, controller ICs, ITO film, and other components.

NPD DisplaySearch is a global market research and consulting firm specializing in the display supply chain, as well as the emerging photovoltaic/solar cell industries. Learn more and access reports at www.displaysearch.com.

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July 16, 2012 — Light-emitting diode (LED) prices are declining, as revenues are growing through 2016, according to a report from Strategies Unlimited. Trends include multi-chip packaging and different LED power levels for different applications.

Global revenue for LED packages hit $2.04 billion in 2011, according to Strategies Unlimited.

Between 2010 and 2011, LED prices declined by more than 25%; for some suppliers the decline was more than 40%. The decline in prices stimulated demand for LED lighting products, increasing overall revenue by 46.3%. LED suppliers diverted excess manufacturing capacity to produce LEDs for the lighting industry, picking up the slack from the slower-than-expected display backlighting sector.

LED prices will continue to decline 2012-2016 at a 13% compound annual growth rate (CAGR). In the same period, CAGR for revenues for LEDs in lighting is forecast to grow 10%.

In 2011, all major players in the LED industry made a big push in the sales of multi-chip packages (MCP). The use of high-lumen-output packages helps reduce the size of the light source as well as the time for luminaire design development.

Use of high-power LEDs continues where high lumen output from compact light sources is required in applications such as streetlights, flashlights, recessed lights and PAR replacement lamps. In the forecast period, more luminaire manufacturers will use MCPs, while ambient lighting applications will use low- and mid-power LEDs for diffused lighting applications such as troffers and linear fluorescent tube replacement products.

Figure. Forecast for LEDs in lighting, by application, 2010-2016 ($M). SOURCE: Strategies Unlimited.

Although the demand for white LEDs increased to 84% of the total revenues, the lighting industry is increasingly using remote phosphor with blue LEDs or red LEDs with cool white LEDs to make warm white light. Also read: Phosphor trends for LED manufacturing

China was the largest LED market in 2011, with 49% of the revenues, with high penetration rates in outdoor, industrial and building decoration lighting applications. The improvements in quality of LED lighting products for retail displays — refrigerated and general merchandise displays — is forecast to be the fastest growing segment.

This report is the latest in a series of reports on LED Markets from Strategies Unlimited. Strategies Unlimited specializes in market research and strategic consulting directed
at photonics systems and components. The company is a research unit of PennWell Corporation, a global media and information company that also publishes Solid State Technology. Strategies Unlimited’s new report, The Market for High-Brightness LEDs in Lighting Applications: Market Review and Forecast- 2012, is now available. Learn more at www.strategies-u.com.

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