Category Archives: Top Story Right

January 13, 2012 — Taiwan’s light emitting diode (LED) chip and package manufacturers failed to reproduce the booming revenue growth of H1 2011 in the second half, according to LEDinside, a research division of TrendForce. Given inventory pressure, many LED makers are actively seeking joint ventures and improving product quality to create greater product differentiation.

LEDinside expects the difficult economic climate to weed out weaker LED makers. New manufacturers are still considering entering the LED market on the potential of LED lighting. Also read: China lights up LED roadmap; Taiwan leaders seek similar support

In terms of revenues in December, the upstream players’ revenues plunged by 30% YoY while the downstream package makers’ dipped by 10% YoY. The difference is attributed to LED chip makers’ higher base year value of December 2011. In December 2010, products such as tablet PCs and LCD TVs underpinned the backlight demand, while currently the LED chip market is slightly oversupplied, with prices plummeting quickly. Since LED package manufacturers supply the end market, the upstream oversupply has less impact on them, and they are benefitting from a recent surge in backlighting demand.

Revenues of Taiwan’s LED chip makers dipped to NT$45.4 billion, representing a 7% decrease compared to 2010. Revenues hit NT$2.64 billion in December supported by the end-market demand surge and the increasing rush orders, but this was a 30% decline from December 2010.

In 2011, revenues of Taiwan’s LED package makers totaled NT$54.92 billion, a 3% decrease compared to 2010. The revenues of Taiwanese LED package makers in December hit NT$3.9 billion, a 10% decline from the prior year.

Around the LED industry:
Epistar has foreseen the slowdown in backlight growth after 2013, and the demand from the lighting market will have to fill the vacancy. For this reason, Epistar has been actively seeking joint efforts with downstream lighting companies, increasing overseas market share through reinvestment. In addition, the company also cooperates with global lighting big names in terms of technology to secure its position in the light market. Epicrystal Cooperation (Changzhou), a subsidiary company of Epistar, began its production in September 2011.

The luminous efficacies of Forepi’s chips reached 120lm/W in 3Q11. Its production will increase considerably in 2012. Moreover, the Japanese big brand Mitsui & Co. brings Forepi a list of clients. LEDinside believes that in 2012, Forepi will be able to use the cooperation with Mitsui to its advantage in regard to backlight and lighting products.

Genesis Photonics joined forces with JFE Enginnering, targeting at the Japanese market. Although the lighting products merely account 10-15% of the total production at present, the portion is expected to increase in 2012.

Helped by its vertical integration model, Lextar successfully made way into the supply chain of global major makers, which canceled out the slump in the backlight market.

According to Lite-On Technology, the company has signed strategic alliance agreements with six lighting companies and will manufacture LED light source and LED light modules in the future.

According to LEDinside, the value of China’s lighting market will reach US$7.6 billion in 2015. With China’s comprehensive production bases and supply chains, and high domestic demand and market prospects, many manufacturers have been targeting the Chinese market. Epistar cooperates with Sunny Technology Lighting and NVC Lighting, Everlight with Yaming Lighting, and Forepi with NVC Lighting. Philips recently announced that it will set up a LED lighting product plant in Chengdu, which marks Philips’ second large-scale investment in China. Furthermore, LED makers including Liteon and Lextar are taking more aggressive actions to gain a place in the supply chain of global big names. The common goal for the companies is to continue increasing the portion of lighting product in their revenues and preempt an advantageous position in the lighting market.

Taiwan also re-elected its leader Ma Ying-jeou of the Kuomintang (KMT) for a second term this week. Ma is not expected to make any major economic and regulatory reforms, according to the US-Taiwan Business Council. Also read: New installed wafer capacity leader: Taiwan took over in 2011

TRENDFORCE is a global leading research institution providing market intelligence, in-depth analysis reports and consultant services on technology sector. Our company consists of 4 major research divisions: DRAMeXchange, WitsView, LEDinside and EnergyTrend, which cover the DRAM, NAND Flash, PC, display, LED and Green energy research sectors respectively. LEDinside is online at www.LEDinside.com.

 

Figure. Revenue at the Top 9 Taiwanese LED Manufacturers Fell (9%) Q/Q in 4Q11. SOURCE: Maxim Group Equity Research, January 2012.

Visit the new LEDs Manufacturing Channel on ElectroIQ.com!

January 13, 2012 — Renesas Electronics America Inc. named Ali Sebt, who has served 20 years at the company, as its new president and CEO. Sebt succeeds the retiring Daniel Mahoney.

Sebt joined Renesas Electronics America (formerly Hitachi Semiconductor America) in 1991 and was most recently its chief operating officer (COO). He has led business development, sales, marketing and engineering operations of Renesas’ microcontroller business in the Americas during his tenure with the company.

Sebt will keynote at the ConFab 2012, in Las Vegas June 3-6, discussing high-growth markets. Learn more about The ConFab.

As president and CEO, Sebt will focus on Renesas Electronics America’s leading microcontroller position and target emerging markets with secure, low-power signal-processing technology building blocks, including analog components, power management ICs and software. Opportunity markets include automotive, industrial, building and home automation, appliances, and healthcare sectors.

Renesas will pull on its legacy of "signal processing technologies that are secure, connected and use less power and fewer resources," Sebt said, "to drive the next embedded technology growth phase by enabling smarter societies."

Also read: Renesas sells fab to TELEFUNKEN Semiconductors for >$50M

Renesas Electronics America Inc., a wholly owned subsidiary of Renesas Electronics Corporation (TSE: 6723), provides microcontrollers and advanced semiconductor devices. In the Americas, Renesas Electronics America markets and sells industrial-type active-matrix LCD modules from NEC LCD Technologies, Ltd. Business operations began as Renesas Electronics in April 2010 through the integration of NEC Electronics Corporation (TSE:6723) and Renesas Technology Corp., with operations spanning research, development, design and manufacturing for a wide range of applications. More information about the products offered by Renesas Electronics America can be found at http://am.renesas.com.

Also read: Renesas: Rebuilt and revitalized about Renesas Electronics America’s parent company Renesas Electronics Corporation.

Subscribe to Solid State Technology

January 12, 2012 — Semiconductor buyers have reduced orders under combined forces of moderately high inventory in the electronics supply chain and deteriorating macroeconomic sentiment. Gartner Inc. expects this inventory correction to work out in early 2012, with production and sell-through returning roughly to balance.

Semiconductor sales were weaker than expected in Q3 2011, and Q4 shows weak guidance. Chip makers are taking action to reduce production based on the weaker sales numbers. Near-term sequential growth prospects for the semiconductor industry are relatively poor, Gartner notes.

Relative inventory levels (expressed by days of inventory [DOI]) are starting to fall, indicates the Gartner Index of Inventory Semiconductor Supply-chain Tracking (GIISST). Relative inventory went from 1.13 in Q3 2011 to 1.11 in Q4. DOI declined quarter-to-quarter in all supply chain segments except electronics manufacturing service (EMS) providers/contract electronics manufacturers (CEM). Absolute inventory in dollar-value terms is still rising.

Another analyst firm, IHS iSuppli, also noted that chip inventories contracted in Q3 2011, reversing a 7 quarter trend. Sharon Stiefel, semiconductor analyst at IHS, said "With the global economy all but stalled, and in the face of declining orders as well as decreased visibility, many semiconductor manufacturers opted to reduce capacity utilization," adding that lead times have also lowered to normal. Read the IHS iSuppli take on the chip inventory correction here.

Figure. Gartner’s inventory index 2000 to present.

The proportion of total semiconductor inventory held by OEMs continues to rise, Gartner reports; OEMs will likely seek to reduce this from levels reached at the start of Q4 2011.

Gartner found that distributor lead times were affected by flooding in Thailand, but were returning to pre-flood levels as of late November. Read more about Thai floods & the semiconductor industry:

Learn more about the inventory correction in Market Trends: Semiconductor Inventory Correction Continues in 4Q11 at http://www.gartner.com/DisplayDocument?doc_cd=222590&ref=nl. Gartner Inc. (NYSE:IT) is a leading information technology research and advisory company.

Subscribe to Solid State Technology

January 11, 2012 — Worldwide light emitting diode (LED) manufacturing capacity will reach 2 million wafers in 2012 (4" equivalent per month), a 27% increase over 2011. More wafers do not neccessarily mean more LED fab equipment, however. Global LED manufacturing equipment spending will fall 18% from "massive" numbers in 2011, shows SEMI’s Opto/LED FabWatch and Forecast.

2012 will be the first time in over 5 years when overall LED equipment spending decreases — blame a 40% decline in metal organic chemical vapor deposition (MOCVD) tool purchases. Spending for non-MOCVD LED fab equipment — lithography, etch, test and packaging tools — will increase in 2012, as manufacturers optimize their production lines and improve product designs. "Future equipment and capital spending will drive LED cost reduction through larger wafers, automation, and dedicated equipment specifically designed to improve to LED manufacturing yield and throughput," said Tom Morrow, EVP, Emerging Markets Group, SEMI.

SEMI recorded 29 new LED fabs in 2011. For 2012, SEMI forecasts 16 new fabs coming on-line.   

Regional equipment spending shows China holding the lead with an expected $719 million planned for 2012, followed by Taiwan ($321M), Japan ($300M) and Korea ($260M). Taiwan will continue to lead in capacity at 25% of the world LED capacity, followed by China (22%).

LED makers have seen several years of rapid capacity expansion, driven by TV backlighting demand for high-brightness light-emitting diodes (HB-LEDs), as well as government incentives and economic development funding in China. HB-LEDs used in liquid crystal display (LCD) TV backlighting units (approximately 40% of the total HB-LED market) failed to reach growth expectations in 2011. Growth targets were missed for total TV unit sales, and for LED penetration into LCD TVs.

HB-LED demand continues to grow in solid state lighting. LEDs used in solid state lighting, currently totaling approximately $2.5 billion, may exceed $30 billion by 2020, according to many estimates. LED manufacturing capacity and technology investments will correspond, long-term, with demand for key applications: primarily solid state lighting, said Morrow, who added that this mirrors other microelectronics industries.

Looking at the back-end of the LED market, the recent Global Semiconductor Packaging Materials Outlook by SEMI and TechSearch Inc. shows very strong growth in LED leadframe shipments. Following the 69% unit shipment growth in 2010, LED leadframe shipments are estimated to have increased by another 10% in 2011. In 2012, shipments are forecasted to reach almost 83 billion units. Data are based on shipments reported by sixteen leadframe suppliers.

Table. Estimated LED leadframe units shipped globally (in billions of units).
2008 2009 2010 2011F 2012F
35.7 39.5 66.9 73.6 82.7

 

The SEMI Opto/LED Fab Forecast tracks over 250 Opto/LED fabs activities worldwide, with detailed information on fab construction and equipment spending, key milestone dates, capacity and ramp up schedule, and more. For more information, visit: www.semi.org/en/Store/MarketInformation/OptoLEDFabForecast.

SEMI is a global industry association serving the nano- and microelectronics manufacturing supply chains. For more information, visit www.semi.org.

Visit the new LEDs Manufacturing Channel on ElectroIQ.com!

January 10, 2012 — Philips Lumileds appointed Pierre Yves Lesaicherre as CEO, succeeding the company’s first CEO Michael C. Holt. Lesaicherre will report directly to Philips Lighting’s acting CEO, Frans van Houten.

The experience gained from NXP Semiconductors, where Lesaicherre was SVP and GM of the microcontrollers and logic business lines, among other titles, makes him "uniquely qualified to lead Philips Lumileds," van Houten asserts, adding that the LED lighting market is "fast changing." Lesaicherre has more than two decades of experience in the semiconductor and component industry. He lives in Silicon Valley and speaks multiple languages including French and Japanese.

Also read: LEDs are fundamentally semiconductors, running up against fab and packaging issues, says Philips Lumileds

Under Mike Holt, Philips Lumileds introduced high-power LEDs and entered new lighting segments, van Houten said. Holt, who worked with the company for a decade, is retiring to spend time with his family.

Philips Lumileds is a leading provider of LEDs for illumination. Royal Philips Electronics of the Netherlands (NYSE:PHG, AEX:PHI) is a diversified health and well-being company, operating in healthcare, lifestyle and lighting. Website: www.philips.com.

Visit the new LEDs Manufacturing Channel on ElectroIQ.com!

January 9, 2012 — The new Samsung Focus Flash Windows smartphone includes a radio frequency micro electro mechanical system (RF MEMS), marking the first known use of RF MEMS in a volume commercial product, IHS reports. This will start off a 200x expansion of the RF MEMS industry through 2015, the analyst firm predicts.

WiSpry Inc. supplied the RF MEMS in Samsung’s phone, which launched in the US last November, according to the IHS iSuppli Teardown Service.

See WiSpry’s comments on the design win here.

The IHS Focus Flash teardown found a MEMS-based antenna tuning module (WiSpry A2101) in a die-on-LGA (land grid array) package near the antenna connectors. The tunable impedance match (TIM) device comprises a network of inductors and WiSpry’s CMOS-integrated, digitally tunable and low-loss MEMS capacitors. WiSpry’s single-chip design integrates logic circuits/serial interface for control, on‐board high-voltage charge pump and high-voltage MEMS drivers, together with fully encapsulated digital MEMS capacitors on a single chip.

WiSpry is leading the RF MEMS pack with its Samsung win. Other companies targeting this market include TDK-EPC, Sony, Omron, RFMD, and the start-ups Cavendish-Kinetics and DelfMEMS.

RF MEMS can be used to reduce signal interruptions and dropped calls, increase data transmission rates, and improve design and power efficiency. IHS expects other cellphone designs to adopt RF MEMS now.

Also read: RF MEMS to explode, solve phone antenna problems

Year 2011 2012 2013 2014 2015
USD millions 0.72 16.1 45.7 96.5 149.5
Figure. Global forecast of revenue generated by sales of RF MEMS for cellphones. SOURCE: IHS iSuppli January 2012.

Global sales of RF MEMS components will increased from $720,000 in 2011 to $150 million in 2015, up by a factor of 200. The potential for RF MEMS-enabled smartphones has been touted by suppliers for "nearly a decade," noted Jérémie Bouchaud, senior principal analyst, MEMS and sensors for IHS. In mid-2010, cellphone makers started to look for signal reception enhancers, after the infamous iPhone 4 antenna problems. Until then, RF MEMS had primarily found low-volume adoption for years in instrumentation products.

There are multiple direct benefits of using RF MEMS to tune and match the antenna for the network operators, cellphone makers and users:

  • They mitigate the signal dropout issue caused by user handholds (the "death grip" failing of the iPhone 4).
  • Antenna tuning can boost data rates by as much as 40% with LTE 4G standard phones.
  • RF MEMS enables cellphones to use smaller, thinner antennas with equal or greater efficiency than larger ones.
  • Network operators could recognize major savings on new wireless infrastructure deployment.

RF MEMS also efficiently implement numerous standards and are one way to cope with rising smartphone data usage. In conventional cellphone RF architectures, multiple standards and functions coexist with multiple parallel RF paths. This architecture is not adapted to the evolution of mobile handsets, since it raises the number of components, size and cost, as well as the power consumption of mobile handsets. New, reconfigurable architectures are required to increase the functionality of phones while keeping size, cost, and power consumption low. Antenna tuning and antenna matching via RF MEMS are among the solutions and the most popular approach.

Beyond RF MEMS, other technologies are being offered for cellphone antenna-tuning applications. Paratek Microwave Inc.’s barium strontium titanate (BST) tunable integrated circuits have gone into a handful of phones, starting in June 2011. Peregrine Semiconductor Corp.’s DuNE antenna tuning devices, based on its silicon-on-sapphire switch technology, also shipped in one cellphone since December 2011. Gallium arsenide (GaN)-based switches and tuners are being sampled by other vendors. Also read: GaN branches out from military apps

For more detail, see the IHS iSuppli upcoming special report, H1 2012 "RF MEMS Switches and Varactors" and the imminent teardown report on the Samsung Focus Flash Windows Smartphone. IHS (NYSE:IHS) provides information and insight on energy and power; design and supply chain; defense, risk and security; environmental, health and safety (EHS) and sustainability; country and industry forecasting; and commodities, pricing and cost. Learn more at www.ihs.com.

View recent issues of the MEMS Direct newsletter

Or subscribe now

January 9, 2012 — Camtek Ltd. (NASDAQ and TASE: CAMT) launched Xact200, its second generation transmission electron microscope (TEM) sample preparation system for the semiconductor industry. Camtek calls the system an alternative to traditional focused ion beam (FIB) analysis.

Camtek has received its first purchase order for the tool, from a leading semiconductor company in Asia.

TEM enables analysis of small semiconductor feature dimensions and complex materials. The Xact200 enables sample preparation for 2X and 1X nodes, combining Adaptive Ion Milling (AIM) technology with an integrated FE SEM column and in-process STEM imaging capability. AIM can reduce lamella thickness <20nm over a large area with high precision, artifact-free quality, and higher throughput, Camtek reports.

Camtek Ltd. provides intelligent imaging, image processing, adaptive ion milling (AIM) and digital material deposition (DMD) for semiconductor and PCB and IC substrate production. Website: www.camtek.co.il.

Subscribe to Solid State Technology/Advanced Packaging

Update February 9, 2012 — After a fast start to 2011, GaAs device revenue growth slowed, maintaining an historical average of 6%. While growth drivers are still present, the rates are likely to continue to flatten in 2012.

There were revenue declines in the second half of 2011 at GaAs substrate manufacturers.

January 6, 2012 — The gallium arsenide (GaAs) device market recovered sharply (35%) in 2010, driven by increasing GaAs content in mobile handsets and growing data consumption. Increased use of pure-play foundries met the surge in demand and was in-line with a trend toward outsourcing, says Strategy Analytics.

The Strategy Analytics GaAs and Compound Semiconductor Technologies Service reports, "GaAs Device Vendor Market Share 2010: Asia-Pacific and Europe" and "GaAs Device Vendor Market Share 2010: North America," estimate that the GaAs device market grew by 35% from 2009 to reach nearly $5.5 billion of revenue. While the surge was the largest the industry experienced since the “telecom bubble” of the early 2000s, Strategy Analytics sees broad enough adoption that a popped bubble is not in our future.

"Pent-up demand from 2009 helped fuel the extraordinary growth of the GaAs industry in 2010, increasing GaAs content in mobile phones," noted Eric Higham, director of the Strategy Analytics GaAs and Compound Semiconductor Technologies Service. "Demand picked up much faster than captive foundries could increase capacity. Increasing GaAs content in handsets and the sheer volume of the handset market should still power GaAs growth. This, coupled with the increasing trend toward outsourcing propelled pure-play foundries in Asia Pacific, is the key to strong growth. We expect these drivers will continue, but growth is likely to be more in-line with historical averages of 5-7%."

Stategy Analytics found that the trend toward foundry outsourcing and the very rapid GaAs market recovery drove revenue growth at WIN Semiconductors to outpace the overall GaAs device market. WIN is now the largest merchant GaAs foundry in the world and the largest GaAs device supplier in the Asia Pacific and Europe region, shows the report.

Skyworks Solutions remains the largest GaAs device manufacturer. Skyworks increased its lead over second-place RFMD through a combination of product diversification and design wins at major handset manufacturers. TriQuint Semiconductor is still in third place, now less than half of a percentage point behind RFMD. Avago Technologies rounds out the top four. These companies account for nearly 60% of total GaAs device revenue. WIN Semiconductors is fifth. The other Asia-Pacific contender is Sumitomo Electric in eighth.

Also read: GaAs test services debut from WIN Semiconductors, Presto Engineering

Asif Anwar, Director in the Strategy Analytics Strategic Technologies Practice added, "Consolidation at large Japanese electronics companies like Renesas Electronics and Sumitomo Electric continued in 2010. Strategy Analytics expects renewed growth in this region."

Strategy Analytics estimates that only two of the top ten GaAs vendors are located in Asia-Pacific and Europe.

These reports provide strategic comments, representative products and selected news items for a comprehensive set of GaAs vendors in Asia Pacific and Europe, and North America. They identify the top ten global vendors in terms of GaAs device market share. Access the Asia-Pacific/Europe report at http://www.strategyanalytics.com/default.aspx?mod=ReportAbstractViewer&a0=6959. Access the North America report at http://www.strategyanalytics.com/default.aspx?mod=ReportAbstractViewer&a0=6958

Strategy Analytics, Inc. provides market intelligence focused on automotive electronics and entertainment, broadband connected home, mobile & wireless intelligent systems and virtual worlds. Website: www.strategyanalytics.com

January 6, 2012 — Fraunhofer Institute for Photonic Microsystems IPMS has placed its Light Deflection Cube (LDC) evaluation kit custom-configuration and ordering on the Internet. The LDC is used to evaluate single-axis micro electro mechanical system (MEMS) scanning mirrors.

Light Deflection Cube (LDC): custom-configurable evaluation kit for single-axis MEMS scanning mirrors.

Light deflection over an axis is used in barcode reading, laser image projection, and 3D object measurement. Silicon resonant micromirrors are 0.5-3.0mm in diameter and suitable for mass production. These micro-scanners enable compact, energy-efficient, robust, affordable light-delection products.

Also read: Microvision’s MEMS scanning mirror proves shock-resistant

Micro-scanner-based products are limited due to time-consuming and costly complex MEMS development, noted Denis Jung, project manager at Fraunhofer IPMS. "Integration of the micro-scanners, position detection and drive electronics in the system environment can pose a hurdle."

Microscanner construction set VarioS – the online path to individually tailored microscanners.

By selling the LCD custom-configurable Evaluation Kit on the internet, Fraunhofer IPMS hopes to bring microscanner MEMS development in step with perpetually shorter product cycles. The encapsulated LDC kit is based on a standardized, configurable VarioS MEMS mirror and includes a position sensor, complete drive electronics, and software interface to specify the operating parameters. The circular mirror plate of the micro scanning mirror in the LDC module can be 0.5-3.0mm in diameter.

Inquiries about an LDC should be input at www.micro-mirrors.com. The website offers the user a configuration and ordering tool to specify the dimensions of the mirror plate, scan angle, scan frequency, and dynamic flatness of the mirror plate if neccessary. The software checks and lists the configurations that are technically possible and from which the user can select the chip type and batch size for a quote.

The Fraunhofer Institute for Photonic Microsystems IPMS focuses development and production services on the practical industrial application of unique technologicalknow-how in the fields of micro (optical) electro mechanical systems (MEMS, MOEMS). Learn more at http://www.ipms.fraunhofer.de/en.html.

View recent issues of the MEMS Direct newsletter

January 5, 2012 — Rensselaer Polytechnic Institute (RPI) scientists used the Rensselaer Center for Nanotechnology Innovations (CCNI) supercomputer to study a promising form of graphene: graphene nanowiggles. Graphitic nanoribbons were segmented into several different surface structures (nanowiggles), which each produce highly different magnetic and conductive properties.

The scientists used computational analysis to study several different nanowiggle structures. The structures are named based on the shape of their edges: armchair, armchair/zigzag, zigzag, and zigzag/armchair. All of the nanoribbon-edge structures have a wiggly appearance like a caterpillar inching across a leaf. The team named the four structures nanowiggles and each wiggle produced exceptionally different properties.

Figure. Graphene nanowiggles. Source: Rensselaer Polytechnic Institute (RPI).

They found that the different nanowiggles produced highly varied bandgaps. Different nanowiggles exhibited up to five highly varied magnetic properties.

RPI calls the research a "blueprint" for scientists to pick out graphene nanostructures for various tasks or devices, based on bandgap and magnetic requirements. "We have created a roadmap that can allow for nanomaterials to be easily built and customized for applications from photovoltaics to semiconductors and, importantly, spintronics," Meunier said.

"Graphene nanomaterials have plenty of nice properties," said Vincent Meunier, the Gail and Jeffrey L. Kodosky ’70 Constellation Professor of Physics, Information Technology, and Entrepreneurship at Rensselaer, "but to date it has been very difficult to build defect-free graphene nanostructures," because the nanostructures are hard to reproduce.

A group led by scientists at EMPA, Switzerland, recently discovered the graphene nanowiggle. These particular nanoribbons are formed using a bottom-up approach, since they are chemically assembled atom by atom. Standard graphene material design involves breaking down an existing material into new structures, which can lead to imperfect, zig-zag edges.

Graphene nanowiggles can easily and quickly be produced in very long and clean structures, Meunier reports, and easily modified to display exceptional electrical conductive properties. Meunier’s team is working to dissect the nanowiggles to better understand possible future applications. Nanowiggle properties are "even more surprising than previously thought," Meunier said.

By using CCNI, Meunier was able to complete sophisticated calculations in a few months, which would have taken over a year without supercomputing.

The findings were published in the journal Physical Review Letters in a paper titled “Emergence of Atypical Properties in Assembled Graphene Nanoribbons.” Access it at http://prl.aps.org/abstract/PRL/v107/i13/e135501.

Learn more about Rensselaer Polytechnic Institute at www.rpi.edu.

Subscribe to Solid State Technology