Category Archives: Power Electronics

SEMI today announced the appointment of Osamu Nakamura to the position of president of SEMI Japan effective July 1, 2014. Nakamura will succeed Yoichi Nakagawa, who is retiring from SEMI.

Nakamura assumes full responsibility for SEMI operations in Japan and will oversee development of the association’s programs, committees, products and services in the region.  He is responsible for relationships with SEMI members as well as industry, government, academia and other local associations and constituents in Japan.  Additionally, he is charged with supporting SEMI members from all regions that have interests in SEMICON Japan and the region’s premier microelectronics and advanced manufacturing supply chain event.

“High-technology manufacturing in Japan and the overall industry are undergoing significant changes.  As a highly experienced industry executive and long-time supporter of SEMI, I have great confidence in Nakamura-san to lead the region’s activity for the many SEMI members located or doing business in Japan,” said Denny McGuirk, president and CEO of SEMI.

“On behalf of all those that have worked with Nakagawa-san over his six-year tenure with SEMI, we extend our greatest appreciation and wish him well in his future endeavors.”

Nakamura has over 30 years of experience in the semiconductor equipment business in Japan and overseas.  He has held various management positions at Hitachi High Technologies, including head of its Semiconductor Equipment Business.  Prior positions include Managing Director, President and Chief Executive Officer for Hitachi High-Technologies (Singapore) and management positions in semiconductor equipment business operations in both Germany and the United States.

While an industry executive, Nakamura served on the SEMI Japan Regional Advisory Board and was elected to the SEMI International Board of Directors, a position he has vacated to serve as the head of SEMI regional operations. Nakamura earned a Bachelor’s Degree in Electrical Engineering from Waseda University.

The Semiconductor Industry Association (SIA) today announced that global semiconductor industry leaders reached an agreement at the 18th annual meeting of the World Semiconductor Council (WSC) last week on a series of policy proposals to strengthen the industry through international cooperation. The WSC is a worldwide body of semiconductor industry executives from China, Chinese Taipei, Europe, Japan, Korea and the United States that meets annually to address issues of global concern to the semiconductor industry. Recommendations from this year’s meeting – held in Taipei, Taiwan – are presented in the 2014 WSC Joint Statement.

“The World Semiconductor Council provides a unique and effective forum for global semiconductor leaders to identify challenges of mutual concern and develop a plan to overcome them,” said Ajit Manocha, 2014 WSC chairman of the U.S. delegation and former CEO of GLOBALFOUNDRIES. “The initiatives presented in the 2014 Joint Statement represent a significant step toward enacting policies that encourage open communication, intergovernmental cooperation, and fair competition throughout the world. I’m especially gratified by the WSC’s unrelenting commitment to achieving duty-free treatment for next-generation semiconductors through expansion of the Information Technology Agreement, which would be one of the most valuable agreements for the global high tech industry in over a decade.”

The Information Technology Agreement (ITA) provides for duty-free treatment of certain information technology products, including semiconductors. An expanded ITA would generate an estimated total of $1.4 trillion in annual world trade. It would provide the first opportunity to include newly developed products resulting from the dynamic technological developments in the information technology sector since 1996, when the ITA was originally concluded.

The WSC seeks expanded coverage in the ITA for new and innovative semiconductor products, including multi-component semiconductors (MCOs). MCOs comprise a growing share of the global semiconductor market, and will be key to continued growth and innovation in a vast range of downstream products, services, and sectors, providing the basis for much needed economic growth and jobs. Inclusion of MCOs in an expanded ITA would result in global annual tariff savings of between $150-300 million.

Industry leaders are said to have discussed the following issues:

  • Developing a set of actions to combat semiconductor counterfeiting.
  • Strengthening intellectual property (IP) rights and protections via work and analysis of issues related to utility model patents, patent quality, abusive patent litigation, and trade secrets.
  • Working with global governments on implementation of encryption standards and regulations to eliminate problematic practices.
  • Expressing the need for all governments and industries to maintain market-oriented practices and make sure that success is based on real competitive value.
  • Affirming the global industry’s commitment to improving export control processes and procedures.
  • Maintaining progress toward reducing the industry’s PFC emissions and ensuring proper attention to other environmental and supply chain matters.
  • Asserting the critical importance of trade facilitation in achieving free and open markets, reducing barriers to trade, and improving business conditions that provide significant benefits to governments, industry, and consumers alike.

Industry representatives from the six regions will deliver these recommendations to an annual meeting of their governments, called the Governments and Authorities Meeting on Semiconductors (GAMS), which will take place in Fukuoka, Japan this October. The GAMS meeting represents an opportunity for industry to convey the importance of implementing the recommendations and explore areas of mutual interest with governments and authorities worldwide.

“The semiconductor industry is a key driver of economic growth and innovation in the United States and around the world,” said Brian Toohey, president and CEO, Semiconductor Industry Association. “Ours is a global industry with global challenges. We must work proactively and cooperatively with our international counterparts to ensure we have fair, open, and transparent access to international markets. The agreement reached by the World Semiconductor Council offers a path forward that opens markets, increases consumers’ ability to benefit from the latest semiconductor technologies, and strengthens market-based competition.”

The 60th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking the world’s best original work in all areas of microelectronics research and development. The paper submission deadline is Monday, June 23, 2014 at 23:59 p.m. Pacific Time.

Overall, the 2014 IEDM is seeking increased participation in circuit and process technology interaction, energy harvesting, bio-sensors and bioMEMS, power devices, sensors, magnetics, spintronics, two-dimensional electronics, devices for non-Boolean computing, and multiferroics. In addition, special focus sessions will be held on the following topics: novel devices for specialty imaging applications, microsystems for personalized medicine, solid-state power devices, and devices and circuits for analog applications.

The 2014 IEDM will take place at the Hilton San Francisco Union Square Hotel from December 15-17, 2014, preceded by a full day of Short Courses on Sunday, Dec. 14. Also, building on the growing popularity of the Saturday afternoon tutorial sessions and the Wednesday Entrepreneurs Luncheons held at recent editions of the IEDM, these events will be held once again, on Saturday, Dec. 13 and Wednesday, Dec. 17, respectively.

At IEDM each year, the world’s best scientists and engineers in the field of microelectronics from industry, academia and government gather to participate in a technical program of more than 220 presentations, along with panels, special sessions, Short Courses, IEEE/EDS award presentations and other events spotlighting more leading work in more areas of the field than any other conference.

Papers in the following areas are encouraged:
•    Circuit and Device Interaction
•    Characterization, Reliability and Yield
•    Display and Imaging Systems
•    Memory Technology
•    Modeling and Simulation
•    Nano Device Technology
•    Power and Compound Semiconductor Devices
•    Process and Manufacturing Technology
•    Sensors, MEMS and BioMEMS

Further information
For registration and other information, interested persons should visit the IEDM 2014 home page at www.ieee-iedm.org.  Or contact:

Phyllis Mahoney, Conference Manager
Widerkehr & Associates
19803 Laurel Valley Place
Montgomery Village, MD  20886
telephone (301) 527-0900 ext. 2
fax: (301) 527-0994
e-mail: [email protected] 

The global market for AC-DC and DC-DC power supplies rose by a modest 2.4 percent last year, but much of this growth was limited to specific markets, leading to some substantial shifts in the rankings of major players, according to a new report from IHS Technology.

The top 10 in 2013 together accounted for 53 percent, or more than half, of total global power supply revenue of $20.7 billion. Last year the top 10 had a nearly equivalent share of 52 percent, out of total industry revenue worth $20.1 billion.

The top four spots this year were unchanged with Delta Electronics remaining the market leader, even though the Taiwanese manufacturer incurred a slight loss in market share during the year, as shown in the attached table. In the runner-up spot was Missouri-based Emerson, which also lost revenue like Delta.

“The market-share standings for 2013 are quite turbulent with six of the top 10 manufacturers shifting in rank and two companies entering the circle,” said Jonathon Eykyn, power supply and storage component analyst for IHS. “It is clear from these results that manufacturers will have to continue to diversify their portfolios in order to remain competitive.”

Within the elite ring, the two suppliers that grew the most in 2013 were Finland’s Salcomp and Mean Well from Taiwan—both well entrenched in strong, emerging markets.

Overall, traditional power supply vendors serving sectors such as industrial and telecom applications continued to experience weaker demand for much of 2013.

“Manufacturers of power supplies sold to sectors where demand remained stronger, including smartphones, tablets and LED lighting,” Eykyn said. “These vendors experienced much greater revenue growth, allowing them to jump up the market-share rankings.”

Meanwhile, a steep decline in demand last year in previously strong growth markets such as notebooks led to a drop in revenue for some of the largest power supply manufacturers in the market. Exchange-rate fluctuations also exerted an effect, affecting the performance of some suppliers, especially those based in Japan such as TDK Lambda and Murata.

These findings can be found in the forthcoming report, The World Market for AC-DC & DC-DC Merchant Power Supplies, from the Power & Energy service of IHS. The full report from IHS includes analysis of the opportunities for commodity AC-DC, non-commodity AC-DC and DC-DC power supplies across 22 applications with forecasts through 2018. It also presents market-share estimates from more than 10 different markets.

ON Semiconductor has introduced a new family of six N-channel MOSFETS that have been designed and optimized to deliver efficiency.

The new NTMFS4Hxxx and NTTFS4Hxxx series of MOSFETs are ideally suited as switching devices for a wide range of applications including server and networking equipment and high power density DC-DC converters, or to support synchronous rectification in point-of-load (PoL) modules. Versions of these MOSFETs are available with or without an integrated Schottky diode that can help engineers achieve even greater efficiency.

ON Semiconductor recognizes the ever-increasing focus on the energy efficiency of end product performance, and has optimized the design, materials and packaging of the new power MOSFETs to reduce losses. Best-in-class RDSon performance of 0.7 milliohms (mΩ) and low input capacitance of 3780 picofarads (pF) ensure conduction, switching and driver losses are minimized. Careful consideration has also been given to ensure that the MOSFETs offer improved thermal performance and low package resistance and inductance compared to existing devices.

“Optimal overall efficiency derived from minimizing losses incurred through conduction and switching is very high on the wish list for designers across an increasing number of end markets,” said Paul Leonard, vice president and general manager for ON Semiconductor’s Power Discrete products. “By utilizing our process, materials and packaging expertise we have been able to advance the performance of power MOSFETs to a new level that will help our customers achieve their stringent design performance objectives.”

Worldwide silicon wafer area shipments increased during the first quarter 2014 when compared to fourth quarter 2013 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

Total silicon wafer area shipments were 2,364 million square inches during the most recent quarter, a 7.1 percent increase from the 2,208 million square inches shipped during the previous quarter. New quarterly total area shipments are 11.1 percent higher than first quarter 2013 shipments.

“Total silicon shipment volumes registered first quarter growth, with volumes also up relative to the same quarter last year,” said Hiroshi Sumiya, chairman of SEMI SMG and general manager of the Corporate Planning Department of Shin-Etsu Handotai Co., Ltd. “This growth at the start of the year is in-line with other semiconductor industry data showing improved conditions compared to the start of 2013.”

Quarterly Silicon Area Shipment Trends

 

Millions Square Inches

 

Q1 2013

Q4 2013

Q1 2014

Total

2,128

2,208

2,364

Semiconductor Silicon Shipments* — Millions of Square Inches

Silicon wafers are the fundamental building material for semiconductors, which in turn, are vital components of virtually all electronics goods, including computers, telecommunications products, and consumer electronics. The highly engineered thin round disks are produced in various diameters (from one inch to 12 inches) and serve as the substrate material on which most semiconductor devices or “chips” are fabricated.

All data cited in this release is inclusive of polished silicon wafers, including virgin test wafers, epitaxial silicon wafers, and non-polished silicon wafers shipped by the wafer manufacturers to the end-users.

The Silicon Manufacturers Group acts as an independent special interest group within the SEMI structure and is open to SEMI members involved in manufacturing polycrystalline silicon, monocrystalline silicon or silicon wafers (e.g., as cut, polished, epi, etc.). The purpose of the group is to facilitate collective efforts on issues related to the silicon industry including the development of market information and statistics about the silicon industry and the semiconductor market.

China’s largest and most advanced semiconductor foundry today announced that SMIC, Wuhan Xinxin, Tsinghua University, Beijing University, Fudan University and the Chinese Academy of Sciences and Microelectronics have collaborated to setup the “IC Advanced Technology Research Institute” to create the most advanced IC technology research and development institution in China.

As semiconductor technology continues to advance into the 20nm node, the difficulty of development and investment in the technology has substantially increased. By integrating the resources of the company and research institutions, the efficiency and pace of research and development will increase immensely. The IC Advanced Technology Research Institute will focus on forming a platform to integrate the domestic IC industry supply chain, equipment manufacturers, material suppliers, foundries, design firms and research institute. This is an industry, institute, research and application collaboration platform and can also act as a verification platform for domestic-made equipment and material research development.

Currently, the research institute will focus on the mainstream 20nm and below technologies for research and development which includes advanced logic technology, advanced non-volatile memory technology, verification of domestic equipment and materials, and related IP qualifications etc. It will also follow up with the industry’s technology development and the actual needs of the customers, and will invite design, equipment, material companies, and upstream and downstream industries. They can join in as a member or in project collaboration. This institute will strengthen its international exchange and cooperation, to promote the establishment our IP infrastructure, to speed up the cultivation of patents and talent, in order to raise the core competitiveness of innovation in China’s IC industry.

“The Institute will be formed to unite the strong players and combine their strengths with the initiative to explore and establish an open integrated circuit research and development platform. We will use this chance to integrate the strengths of corporations and research institutions to accelerate the development of advanced process technology, and address issues the industry faces, such as IP protection, and thus promote the rapid development of China’s IC industry,” said Dr. Tzu-Yin Chiu, Chief Executive Officer & Executive Director of SMIC, at the signing ceremony.

“Working together is a move in the right direction. Government supports the effective collaboration among industry, academic and research. By working together, our research can focus on the market and application and it can also give rise to stronger R&D institutions and drive a deeper international cooperation in technological development. I hope today is a good beginning, and our technological development in IC will get faster and better,” said Mr. Jian-Lin Cao, Vice Minister of China’s Ministry of Science and Technology.

By MARK DANNA, Vice President Business Development, OWENS DESIGN, INC.

After nearly a quarter of a century, the off-shoring manufacturing trend that decimated the U.S. manufacturing sector and played a significant role in the slow pace of the current economic recovery seems to be ending. A number of large manufacturers, including NCR, Apple, Google, Caterpillar, Whirlpool and Ford have recently announced plans to return some of their overseas manufacturing to the United States. Even Nissan recently announced it was relocating a manufacturing plant from Mexico to the U.S. Many other American firms are considering taking similar action.

While this reshoring trend might be considered a ripple rather than a wave in the economic waters, it is growing. According to a study conducted in August 2013 by the Boston Consulting Group (BCG), 54 percent of the more than 200 companies surveyed were planning or seriously considering reshoring some of their manufacturing. That is a 17 percent increase over the 37 percent considering reshoring in 2012 when BCG last conducted the survey. Twenty-one percent of respon- dents said they were actively engaged in reshoring or will do so in the next two years, double the number reporting such activity a year ago.

According to Harry Moser, former CEO of Charmilles Technology Corp. and founder of the Reshoring Initiative, over 50,000 manufacturing jobs returned to the U.S. between 2009 and 2012. In the five years previous, the number returning was close to zero. Those 50,000 jobs constitute about 10 percent of the new manufacturing jobs created in the U.S. over the last three years.

Contributing factors to the reshoring trend

There are a number of global and domestic economic factors that are causing many American, and even some foreign companies, to consider moving their manufacturing operations to American soil. The two most significant are wages and productivity.

For example, according to an April 2013 Bloomberg article, the average pay in Asia almost doubled between 2000 and 2011, while wages increased by only 5 percent in the developed world and by 23 percent worldwide. Labor costs were one of the prime drivers off the off-shoring trend, and this significant rise in labor costs in the region erodes one of the key economic benefits of moving manufacturing to that region.

When that upward wage trend is coupled with differences in the levels of productivity of American and foreign workers, reshoring becomes even more attractive. According to a U.N. report compiled by the International Labor Organization (ILO), American workers out-produced and worked longer hours than their counterparts in Japan, Switzerland and all 27 European Union countries. While workers in Asian countries do tend to work longer than their American counterparts, even this is changing. Chinese workers have recently been demanding shorter hours and in some cases, job tenure after a certain number of years of employment.

Further, even when working fewer hours, American workers consistently out-produce their Chinese counterparts. According to ILO statistics, the average Chinese industrial worker produces $12,642 worth of output per year, while the average Chinese farmer or fisherman produces about $910 worth of output in the same time. By comparison, an American worker in the industrial sector produced $104,606 worth of output and a worker in the farming or fishing sector produced $52,585 per annum.

When one considers the diminishing difference in labor costs and the magnitude of difference in worker productivity, reshoring starts to become a very attractive alternative. It becomes even more attractive if one takes some additional factors into consideration.

Logistics are vastly simplified. The distances parts and finished goods have to be shipped will generally be shorter, which saves on both time and cost. The expenses and risks in maintaining a global supply chain are significantly reduced, as is the time and expense involved in dealing with customs issues. Communication across multiple time zones is also minimized.
Reshoring to the U.S. can also help reduce employee stress and increase productivity, since fewer employee hours will be lost to overseas travel. Business travel expenses will also be reduced. In addition, employees will experience fewer frustrations due to linguistic or cultural misunderstandings, making it easier for them to do their jobs.

Additional potential benefits of reshoring manufacturing to the U.S. include greater security and a more stable political environment, better protection of intellectual property and lower energy costs as the U.S. becomes a global leader in energy production.

In BCG’s survey, 43 percent cited labor costs as a factor in their interest in reshoring, 35 percent cited proximity to customers and 34 percent cited quality issues. Additional considerations cited skilled labor, transportation costs and supply chain management efficiencies. According to Moser, when the total cost of ownership of overseas manufacturing is considered, domestic manufacturing in the U.S. is the clear economic winner.

Reshoring challenges

Of course, a decision to move a company’s manufacturing back to the U.S. offers its own set of challenges. It takes time to build a manufacturing facility and train workers. This can easily take a couple of years and a considerable investment in capital. In the mean time, one still has to be producing the goods needed to meet customer demand.

Once a company decides to reshore, it has to handle the logistics of ending production in its overseas facilities and ramping up in the new U.S. facility. It also may have to deal with overseas employees and even its host country being less than supportive of its reshoring decision. Indeed, an American factory manager in China was briefly held hostage by his factory workers over rumors the company planned to move its manufacturing back to the U.S.

In addition to the purely logistic issues, it is critical to consider your customers in your reshoring equation. It’s vitally important to assure them that your reshoring transition will not interrupt their expected flow of finished products or lead to significant increases in their price.

Easing the reshoring transition with domestic outsourcing

Ironically, a potential solution to these reshoring transi- tional challenges can be found in outsourcing. In this case, however, it’s a domestic outsourcing, rather than overseas outsourcing that offers a viable business solution. A domestic outsourcing partner can provide the engineering and manufacturing resources that are needed to minimize the pain involved reshoring.

Partnering with a domestic design house offers a number of advantages. The outsource partner will have a core of experienced engineers and design teams used to bringing multiple new designs to volume production every year. In addition, most will have access to established U.S. manufacturing facilities capable of producing products in volume. As a result, whether it is bringing an estab- lished production line back to the U.S. or building one for a company’s next generation product, collaboration with the right outsourcing partner can essentially make a company’s reshoring transition seamless from a customer point of view. Of course, the key is picking the right outsource partner.

Picking the right outsourcing partner

The very first things to consider when deciding to choose a domestic outsource partner to smooth your company’s reshoring transition is their size and experience in your particular industry. Are they large enough, and do they have the resources to give you the level of manufacturing support you require? On the other hand, are they so large with so many clients that your project won’t receive the attention and support needed for it to succeed? Most importantly, do they have experience in your industry or one that is closely related?

An outsourcing company with lots of semiconductor manufacturing experience, for example, may be an excellent partner for a company in other high technology industries such as LED, flat panel or solar manufacturing, but it may not be the best choice for a company manufacturing home appliances.

Finally, you need to consider the kind of working relationship you want to have with your partner. Do you want a very close association with a lot of communication between your team and theirs? Would you rather have a more hands-off approach, where you provide them the project specifications and expect only periodic updates unless a problem arises? Is their preferred working relationship compatible with yours? Getting the answers to all these questions will require research in terms of formal references, word of mouth from others in your industry and online research, but the time spent researching your potential partners upfront will pay dividends in the long run.

By Prakash Arunkundrum, PwC Strategy and Operations Consulting Director

There is continued evidence that despite spending several millions on IT transformations, improving internal planning processes, maturing supply chains, and streamlining product development processes- several companies still struggle with predicting their financial and operational performance.

Don’t think so? Take a look at the PwC analysis on earnings surprises for 2012-2013 – many companies were poor at predicting revenue one quarter out, and the guidance on certain metrics such as gross margins and OpEx were poorer.

graph 1

Some attribute these results to fast product lifecycles, behavioral factors (i.e., sandbagging to exceed performance), market volatility, or a host of other external factors. I contend that these results can also be explained by many internal factors, such as how a company approaches planning and how seriously they value predictability.

At PwC, we benchmark operational performance of high-tech and semiconductor manufacturers on a regular basis. Recently, we have noticed that the median forecast accuracy of technology companies from 2009 to 2013 has dropped over 500 basis points! This doesn’t correlate with the belief within many companies that they are getting better with their planning processes.

So what are we missing?

While companies have improved their operational planning processes, disconnects to the broader financial planning and reporting processes have remained and in some cases, worsened due to the faster clock speed of product introductions. As I’ve stated previously, there are several reasons behind “surprises.” Below is the common classification of earning surprises and note that several of them are due to planning challenges.

image 2

When examining this across several companies, there are five core reasons behind the planning disconnects:

  1. Limited understanding of true market rate of demand – Historical projections to develop a financial plan are disconnected from unconstrained sales forecasts; Post-close bridge analysis explain deltas but don’t drive improved forecast methods
  2. Immature end-to-end S&OP processes – Slow open-loop supply planning and partner collaboration processes
  3. Disconnects between S&OP, Product Planning and Financial planning process – Forecasts have insufficient operational input and incentives are not always aligned
  4. Budget allocations do not always reflect latest sales, product, and operational pulse – Process lacks leading indicators and transparency
  5. Inability to make rapid cross-functional decisions based on data and simulation models reflecting changing business environment

Often the costs of inaccuracy are not immediately felt, lulling companies into deprioritizing the impact of poor planning. Left unaddressed, planning challenges impact predictability, and can also impact business performance.  A few real-life anecdotes behind some of our client engagements on planning topics include:

  • “… Why does my S&OP plan call for higher inventory levels than the financial plan (which was provided as street guidance)?  The S&OP plan called for higher revenue attainment and on-time performance, but finance never factored the cost to support revenue “ – High-tech COO
  • “Despite all the IT investments, I just missed my quarterly gross margin target by a mile”- Manufacturing OEM CFO
  • “We are really good at hitting our dollar revenue forecast but continue to watch with baited breath if we will make the quarterly budget targets till the last day of quarter” – Semiconductor VP of Finance
  • “We have no idea how many buffers are placed on the demand plan and by whom – leading to mistrust on the real demand internally and with partners” – Semiconductor VP of Operations

The answer: Step closer toward “Integrated Planning”

With experience helping clients improve financial efficiency and performance from our PwC legacy service offerings and in operations from recent acquisitions such as PRTM, Diamond and Booz & Co, we have found that the following key areas are critical steps toward improving your planning process:

1.     Process: Balance and align S&OP and Finance goals to create a consensus plan by:
  • Separating forecasting from demand planning – Establish a demand planning discipline and analytics driven capability as a neutral function that drives consensus across sales, product marketing, operations and finance
  • Orchestrating the financial, product, and operations planning activities across products, geographies, and functions on a unified cadence
  • Linking planned incentives to planned performance and corporate goals instead of budgets and functional goals
2.     Data: Align product data structure across all functions while establishing an integrated operational data model for common definitions and usage
3.     People: Minimize organizational silos and align incentives –  Clearly defined accountability for execution and adherence to outcomes of the decision making forums
4.     Technology: Create an end-to-end planning simulation system that supports both S&OP planning and financial planning activities – Unified simulation model across all functions with ability to understand impact of changes directly on the key elements of the P&L and balance sheet

The Integrated Planning environment—with integrated process, data, organization, and technology capabilities—will allow finance and operations teams to work closely and strategically, ultimately enabling companies to accurately forecast earnings and respond with agility.

While these steps sound ambitious and daunting, I recommend key stakeholders start by stepping back to assess their current end-to-end planning process to begin their Integrated Planning journey.

A newly finalized Department of Defense (DoD) rule reduces the risk of counterfeit semiconductor products being used by our military by implementing needed safeguards in the procurement of semiconductors and other electronic parts. The final DoD rule addresses contractor responsibilities for detection and avoidance of counterfeit electronic parts. Among other provisions, the rule implements section 818 of the National Defense Authorization Act (NDAA) for fiscal year 2012, which calls for DoD to utilize trusted suppliers to mitigate the risks of counterfeits.

“Counterfeit semiconductor products can end up in critical consumer, industrial, medical, and military devices, potentially undermining our public safety and national security,” said Brian Toohey, president and CEO, Semiconductor Industry Association. “The new Department of Defense rule will help stem the tide of dangerous counterfeit semiconductor products by mandating that DoD contractors purchase from original manufacturers or authorized sources. This rule represents a long fought victory for the semiconductor industry and a significant step toward ensuring the safety and security of semiconductor products used by our military.”

While the proposed rule issued last year contained numerous issues of concern for the semiconductor industry, the final rule incorporates many improvements called for by SIA in comments filed last year. The final rule requires contractors and their subcontractors to establish a counterfeit electronic part and avoidance system, subject to audit, that includes procedures to show their use of original manufacturers, authorized distributors, or authorized aftermarket distributors prior to turning to other outlets. Additionally, the rule further strengthens flowdown requirements to subcontractors called for by SIA and subjects violators of the requirements within the rule to disapproval of their purchasing system and/or potential withholding of payments by DoD.

SIA has long advocated for measures to stop the dangerous proliferation of counterfeit semiconductor products. Counterfeiters often “harvest” semiconductor components from old circuit boards and then re-mark them to indicate they are new or that they have better performance than the original components. These counterfeit semiconductors, which may be indistinguishable from authentic semiconductors, are then sold through a network of international brokers, posing a risk to critical end products. For more information, see SIA’s anti-counterfeiting whitepaper.

“By working together to implement common sense policies like this DoD rule, we can win the fight against counterfeit semiconductor products and help ensure the safety of technologies that are vital to America’s economic and national security,” said Toohey.