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HORIBA Semiconductor, global leader in process metrology and control components, introduces its new HD-960L for sub-parts-per-billion level monitoring of DO in chemicals with a low sample-consumption rate. The HD-960L is specifically designed to enable processes that require ultra-low or controlled levels of DO.

The HD-960L uses an innovative polarographic sensor and an auto-ranging feature to give users real-time trace DO data from ppb level to saturation in critical process chemistries.  The technology allows users to monitor DO levels, avoid process excursions due to oxidation and more effectively control silicon etch rates.

“The HD-960L’s low detection limit, high accuracy, low sample consumption and wide range make it the perfect choice for critical next-generation processes that require low levels of DO,” said Mark Mahoney, Business Development Manager for Wet Products at HORIBA Semiconductor.

HORIBA technologies for wet process monitoring are used globally for critical process monitoring and control and the new HD-960L represents the latest in applications-driven technology development that supports the semiconductor industry.

HORIBA Semiconductor, part of HORIBA INSTRUMENTS, INC., headquartered in the United States, provides an array of instruments and solutions for applications across a broad range of semiconductor processes.

 

 

Semiconductor equipment manufacturer ClassOne Technology today announced a configuration for optimizing Through Silicon Via (TSV) and Through Wafer Via (TWV) processes on its affordable Solstice electroplating systems. The Solstice family, introduced last year, is designed to provide advanced yet cost-efficient plating for MEMS, Sensors, RF, Interposers and other emerging technologies for ≤200mm wafers.  Flexibly configurable, the Solstice for TSV/TWV combines chambers for the critical blind via pre-wet operation with advanced copper plating on the robust and reliable automation frame that is the heart of the Solstice.

“In recent months customer requests have skyrocketed for TWV, whether alone or in combination with forming redistribution layers (RDL),” said Kevin Witt, ClassOne’s Chief Technology Officer. “Many of our smaller-wafer customers seek the advantages of 2.5 and 3D packaging needed for their next generation products; and cost-effective TSV or TWV processing is mission critical. The new Solstice configuration addresses their needs effectively and elegantly with a plating tool that is affordably priced for 200mm and smaller substrates.”

Witt explained that the new Solstice TSV configuration, which has already been sold to customers, employs a unique, high-efficiency but simple vacuum pre-wet chamber followed by copper via electroplating. This combination of capabilities enables the ClassOne tool to routinely produce fully-filled or lined vias with widths ranging from 5 to 250 micron having aspect ratios as high as 9:1. Traditionally, this level of performance has been challenging even for plating systems costing twice as much as Solstice. The Solstice can also be configured to perform additional downstream processing such as resist strip and seed layer etch making it a cluster tool that delivers a suite of critical processes, reducing cycle time and saving money. This technology makes it possible to process TSV alone or TSV and redistribution layers simultaneously to provide a complete solution on a single tool.

“New customers always have the same reaction when they first see our Solstice platers in action,” said Byron Exarcos, President of ClassOne. “They’re always amazed that tools this affordable deliver such advanced processing. The new Solstice TSV configuration is one more example of what is making Solstice the preferred solution for electroplating on smaller wafers!”

Designed for high-performance, cost-efficient ≤200mm electroplating, Solstice systems are priced at less than half of what similarly configured plating tools from the larger manufacturers would cost — which is why Solstice has been described as delivering “Advanced Plating for the Rest of Us.” Solstice can electroplate many different metals and alloys in a spectrum of processes, on transparent or opaque substrates. ClassOne now offers three Solstice models: the LT for plating process development, the S4 for mid-volume production, and the S8 for high-volume, cassette-to-cassette production, with throughput of up to 75 wph.

Solstice S8 Plating System

Semiconductor equipment manufacturer ClassOne Technology has announced a new addition to its popular Solstice family of ≤200mm wafer electroplaters. The fully-automated, cassette-to-cassette Solstice S4 is available with up to 4 chambers and can deliver up to 75wph throughput. In footprint, capacity and cost, the S4 is positioned between the manual-load, development-oriented Solstice LT, with 1 or 2 chambers, and the fully-automated Solstice S8 electroplater with up to 8 chambers.

“Certain users had been asking for a smaller version of our S8,” said Kevin Witt, ClassOne’s Chief Technology Officer. “Others wanted a smaller incremental step up from our LT development tool. The new S4 was a natural answer to both requests. It provides cassette-to-cassette automation but has a 28 percent smaller footprint than the S8. Also, S4 pricing starts at $700k, compared with $1.5M for the S8.”

“It’s about giving customers more options,” said Byron Exarcos, President of ClassOne Technology. “With the new Solstice S4 we’re providing more ways for budget-constrained users to get exactly what they need to improve their processes. For some, the S4 will provide an affordable way to replace wet benches, automate production and gain significant improvements in uniformity, consistency and productivity. For others, the S4 will be a natural replacement for aging Equinox systems.”

All Solstice models share the same advanced-performance chambers, software controls, electronics and processing results — enabling users to move easily from process development on the LT, to mid-volume production on the S4, to high-volume production automation on the S8.

The Solstice S4 was also just named by Solid State Technology magazine and the SEMI organization as one of three finalists in the BEST OF WEST AWARD competition associated with the SEMICON West 2015 Conference.

ClassOne Technology introduced the Solstice family in 2014 to provide high-performance yet cost-efficient electroplating solutions for users of ≤200mm wafers, in MEMS, LEDs, RF, Power, Sensors and other emerging markets. All Solstice systems are priced at less than half of what similarly configured plating systems from the larger manufacturers would cost — which is why Solstice has been described as “Advanced Plating for the Rest of Us.” The tools are designed for a broad spectrum of electroplating processes using many different metals and alloys on opaque or transparent substrates. ClassOne also supports plating customers with process development, deployment and service around the globe.

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Isolating Electrical Faults in Advanced IC Devices

Date: July 29, 2015 at 2:00 p.m. ET

Free to attend

Length: Approximately one hour

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Yield improvement and production engineers working on today’s ICs encounter many challenges as defects affecting device operation go undetected by traditional in-line techniques.  Electrical Failure Analysis (EFA) is a suite of techniques that helps the modern day fab increase yields by isolating faults to areas small enough for Physical Failure Analysis (PFA).  In this Webinar, we showcase a few of the proven EFA fault isolation techniques and describe how EFA helps to characterize the underlying defects.

Speakers:

Jordan FineJordan Fine, Applications Engineer, DCG Systems

Jordan Fine is a Staff Applications Development engineer for the Circuit Analysis group at DCG Systems. His primary focus is the development of new optical fault isolation (OFI) techniques for the Meridian and WaferScan platforms. He also supports a worldwide customer base that debugs the most advanced technology nodes using OFI. Dr. Fine holds a Ph.D. from the University of Southern California and has published multiple papers in the fields of molecular physics and electronic failure analysis.

jennifer koppJennifer Kopp, Product Marketing Director, DCG Systems

Jennifer Kopp is the Product Marketing Director for the Meridian optical fault isolation product line at DCG Systems.  She has 15 years experience in the semiconductor capital equipment industry including technical product marketing and applications development roles in the Electrical Failure Analysis, Inspection & Metrology, and process equipment segments. Jennifer holds a B.S. degree in Chemical Engineering from Cornell University and lives in Fremont, California.  She can be reached at [email protected]

Sponsored by DCG Systems, Inc.

DCG Systems, Inc. is the industry’s leading supplier of systems that enable direct localization and characterization of electrical faults in integrated circuits, packages and board assemblies. DCG Systems are used worldwide throughout the electronics product life cycle, from IC process development and design de-bug, to yield ramp and yield enhancement, to supporting advanced packaging engineering, and finally to failure analysis of customer returns.

DCG Systems has more than 1500 systems deployed worldwide, and serves its global customer base from its headquarters in Fremont, California and its field offices in the United States, Japan, Taiwan, Korea, Malaysia, Singapore, Israel and Germany. For more information about DCG Systems, visit www.dcgsystems.com.

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Maximize Lean Strategies with Mobile Technologies on the Plant Floor and Beyond

Date: June 18, 2015 at 2:00 p.m. ET

Free to attend

Length: Approximately one hour

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Employing mobile technologies to bring plant collaboration into the 21st century can be one of the most effective efficiency investments to maximize lean strategies an electronics or high-tech manufacturer can make. It is becoming ever clearer that a mobile communication strategy consistent with the pace of life today, one capable of alerting the right people at the right time about critical issues can have a big impact on reducing wasteful practices, cutting costs, and increasing quality of fabrication operations.

Mobile technologies progressively working with your critical ERP systems can provide streamlined workflow to enhance lean strategies.  Likewise, empowering employees on the plant floor and beyond with information and recording results “at the point” of activity provides heightened traceability and accuracy.

Join us for this session with Kathie Poindexter, manager of product marketing manufacturing and supply chain for Epicor Software Corporation, on the factors to maximize lean strategies with mobile technologies. With the rise of the mobile workforce, mobility is truly an ideal ‘lean’ enabler. In this session we will examine the top 10 areas where mobility can have the most impact on the success of your lean initiatives. Mobility is capable of stripping wasted time and errors out of virtually any process in any and all of your business functions, including fabrication, making mobility the ultimate platform to take your semiconductor manufacturing operations to the next level of lean.

Speaker:

Poindexter Full size CroppedKathie Poindexter, Manager, Product Marketing Manufacturing and Supply Chain

Kathie Poindexter joined Epicor Software in 2010, bringing more than 25 years success in the Electronics & High Tech and Aerospace & Defense industries as well as implementation consulting and product marketing for enterprise resource planning (ERP) solutions. In her current position as manager, product marketing manufacturing and supply chain, Poindexter is responsible for leading and developing Epicor’s initiatives in the growing and dynamic ETO and project manufacturing market sector. Her industry experience is invaluable to helping Epicor build strong market share within this key manufacturing vertical.

Prior to joining Epicor Poindexter spent a number of years as a senior solution engineer providing ERP pre-sale and consulting support for both commercial and public sector A&D, ETO and project-based manufacturing businesses. Prior to moving into the software industry, Poindexter had an extensive background in manufacturing operations, finance, government contract compliance, and ERP project implementation,  in management positions at Cubic Defense Applications, Lockheed Martin and General Dynamics.

Poindexter attended University of Redlands, California earning a Bachelor of Science in Business Administration and a Master of Arts in Management.

Sponsored by Epicor Software Corporation

Epicor Software Corporation is a global leader delivering inspired business software solutions to the manufacturing, distribution, retail and services industries. With over 40 years of experience serving small, midmarket and larger enterprises, Epicor enterprise resource planning (ERP), production control software (MES), and supply chain management (SCM), enable companies to drive increased efficiency and improve profitability. With a history of innovation, industry expertise and passion for excellence, Epicor provides the single point of accountability that local, regional and global businesses demand.

Nanoscience Instruments is pleased to offer the new Nano-Observer atomic force microscope (AFM). The Nano-Observer, designed by Concept Scientific Instruments, is ideal for current and future AFM research applications. Advanced and unique electrical measurements highlight the AFM’s key strengths. High Definition single-pass Kelvin Probe Force Microscopy (KFM) provides high resolution surface potential mapping. Electrical measurements, like Conductive AFM, can be performed with the ResiScope covering 10 orders of magnitude.

“The Nano Observer applies new technologies for atomic force microscopy. In combination with the ResiScope, the Nano-Observer takes AFM well beyond imaging,” explains Sebastian Kossek, co-founder of Nanoscience Instruments. “This technology allows for quantitative electrical characterization of a wide range of materials including semiconductors, conductive polymers or thin films.”

The Nano-Observer delivers new technology well-suited to solve challenges in advanced materials research and development. Research in materials science, thin films, semiconductors, data storage and nanomaterials will all benefit from using a Nano-Observer AFM. The user interface is intuitive yet flexible and can be customized for a range of applications.

“We are very pleased to announce the new Nano-Observer AFM. The instrument greatly adds to our capabilities at Nanoscience Instruments,” says Mark Flowers, co-founder of Nanoscience Instruments, “These innovative techniques allow us to provide a more comprehensive solution to our customers developing new, advanced engineered materials.”

The ResiScope, an award-winning innovative module, can be combined with the Nano-Observer to measure resistance over 10 orders of magnitude using atomic force microscopy. Resistance measurements can be coupled with magnetic force microscopy, electric force microscopy or single-pass Kelvin probe force microscopy imaging modes to acquire multiple properties in the same scan area.

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Temporary wafer bonding for thin wafer processing is one of the key technologies for wafer level 3D system integration. AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thin wafer processing of bonding device wafer to carrier wafer. Leveraging its expertise manufacturing film adhesives for the semiconductor industry over the last 30 plus years, AIT offers Wafer Processing Adhesives (WPA) from 5 to 80 micron film adhesives for device wafer processing up to 450mm with and without topography. AIT high temperature capable WPA removes easily with laser assisted and solvent assisted release separation de-bonding besides traditional heat-sliding processes.

AI Technology, Inc. (AIT)’s temporary bonding Wafer Processing Adhesives (WPA) are thermally stable to 320- 330°C and the bonded compound wafers are compatible with standard WLP process equipment and for backside processing of 3D-TSV wafers. High integrity in bond strength enables easy back grinding to a thickness of 50 μm. AIT’s thermally and chemically stable polymers can withstand multiple device wafer processes, such as dry etching, wet etching, CMP, PVD, solvent based spin coating of resists and polymers, lithography, electro plating and extended elevated temperature processing up to 320-330°C for at least 60 minutes under high vacuum.

In comparison to traditional wax based and polyimide based temporary handling solutions, AI Technology, Inc. (AIT)’s WPA-TS 320 and WPA-TL 330 demonstrate some of the highest temperature capabilities for thin wafer processing as well as easy removal and cleaning.

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ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cleaving and drilling of glass up to 10mm thickness. Using less than 100 watts of laser power, most transparent, hard and brittle materials, like sapphire, quartz or heat- and chemically-strengthened glass, can be cut at speeds of up to 1 meter per second. The resulting kerf width is about 1 micron and the edges are smooth with a measurable surface roughness of less than 1 micron.  Cutting interior features like holes, slots and other shapes down to 2 mm is possible without damage to the surrounding material. The process is silent, non-contact, produces minimal debris and has low consumable costs. Stack glass sheets can also be cut without damage to individual layers.

The ROFIN SmartCleave FI laser process eliminates conventional, mechanical methods with their inherent and significant drawbacks (low scribing quality, micro-cracks, chipping, accuracy limitations, additional time-consuming and labor-intensive processing steps, etc.) and results in fast processing and higher yields.

This unique, IP-protected laser cutting process opens the door to huge application areas, and is of particular interest to manufacturers of consumer electronics, medical devices, integrated circuits, architectural, automotive, aerospace, and a variety of other market segments.

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ROFIN will debut this new technology at SEMICON WEST 2015.

Lattice Semiconductor Corporation, a provider of programmable connectivity solutions, today announced the close of its acquisition of Silicon Image, Inc., a provider of wired and wireless connectivity solutions, and the results of the related tender offer. For the first time in the semiconductor industry, a single company now combines the design flexibility and time to market benefits of FPGAs, with the highly integrated, function and cost optimization benefits of ASSPs. The all-cash acquisition, valued at approximately $606.6 million (or approximately $466.6 million on an enterprise value basis), is expected to be immediately accretive to EPS on a non-GAAP basis.

Darin G. Billerbeck, Lattice Semiconductor’s President and Chief Executive Officer, said, “Today marks an exciting day for Lattice, as we close our transformative acquisition of Silicon Image. We have significantly expanded our Company’s capabilities, with the addition of MHL, HDMI and 60 GHz Intellectual Property, enhanced our business prospects and financial profile, and further diversified our global customer base. We will move forward quickly in order to realize the compelling revenue and operating synergies created by our increased economies of scale. Our team has put in place a well thought through, comprehensive consolidation plan for an efficient integration and the achievement of our targeted cost synergies. We plan to work relentlessly over the coming years to rapidly deleverage through our increased free cash flow, and to achieve the full benefits of this major acquisition for our customers, shareholders and employees.”

The transaction, which was announced on January 27, 2015, was funded through a combination of cash on hand and $350 million in debt financing led by Jefferies Finance LLC. Jefferies LLC served as the financial adviser to Lattice Semiconductor, and Skadden, Arps, Slate, Meagher & Flom LLP served as legal adviser to Lattice Semiconductor. Barclays PLC served as the financial adviser to Silicon Image, and Fenwick & West LLP served as legal adviser to Silicon Image.

MKS Instruments, Inc., a global provider of technologies that enable advanced processes and improve productivity, has introduced the Cirrus 3-XD Atmospheric gas analysis system in both benchtop and rack mounted models. These quadrupole mass spectrometer (QMS) based systems provide a step-change in performance and ‘eXtreme Detection’ capability to advance atmospheric gas analysis in a wide range of analytical applications and environments. The Cirrus 3-XD system features new, patented V-lens Ion Optics Technology that eliminates baseline noise associated with the effects of metastable neutrals (a by-product of bulk gas ionization), a common issue in conventional QMS instruments. This unique performance attribute enables users, for the first time, to achieve consistently low ppb level detection limits, irrespective of the bulk gas present. The compact system includes new software to streamline the process of carrying out accurate quantitation of trace and bulk gases, and a unique capillary inlet and oven design that ensures a rapid and ultra-stable response.

The Cirrus 3-XD system also incorporates a unique internal oven and capillary inlet design that provides high temperature uniformity and ultra-stable response for qualitative and quantitative applications. The oven design eliminates cold spots and features advanced insulating properties and convection heating characteristics that are optimized for temperature uniformity across the entire inlet and analyzer. The heated inlet assembly employs a low volume, low surface area and inert silica-lined capillary to maximize response speed (250 data points per second) while minimizing memory effects.

As in earlier models, the Cirrus 3-XD system is controlled by the proven and versatile ProcessEye Professional software, which now features a new ‘Multipoint Calibration’ methodology to enable users to confidently generate accurate gas concentrations (in %) from raw partial pressure measurements. The new workflow provides facile calculation and implementation of sensitivity and normalization factors that are essential for accurate gas quantitation in applications such as identification of trace gases in bulk gas or profiling simple or complex gas mixtures.

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