Category Archives: Uncategorized

Date: Date and time TBD

Free to attend

Length: Approximately one hour

Registration coming soon.

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Contact Jenna Johnson about sponsorship opportunities for this event.

MKS Instruments, Inc., a global provider of technologies that enable advanced processes and improve productivity, has introduced the I-250, I-500 and I-1000 Mass Flow Controllers. These products extend MKS’ I-Series full scale flow rate capabilities to 250, 500 and 1000 slm, respectively, and provide mass flow control for large scale production processes such as in Biopharm, Heat Treatment and Spray Coating. Available as both MFCs and MFMs, the IP66-rated I-250, I-500 and I-1000 are reliable, cost effective solutions for today’s most rigorous industrial applications. Simultaneous to this release, MKS is also releasing a G-Series version of the 250 slm product, the G-250.

The I-250, I-500 and I-1000 incorporate the latest digital mass flow control electronics; a proven, patented thermal sensor and mechanical design provide 1% of setpoint accuracy and precise control for full scale flow rates from 100 to 250 slm (I-250), 250 to 500 slm (I-500) and 500 to 1000 slm (I-1000). Multi-gas/multi-range capability is enabled through the onboard Ethernet interface and allows the user to change the gas and range of the instrument, reducing inventory requirements. The I-250, I-500 and I-1000 also feature the ability to convert flow measurements to the user’s unit of choice (e.g., slm, scfh, kg/hr.).

With the release of these products, the MKS I-Series mass flow products now provide customers with flow rate control capabilities extending from less than 1 sccm up to 1000 slm. Designed for use in harsh environments where resistance to liquid or dust ingress is essential, these elastomer-sealed instruments are available with analog I/O (0 to 5 VDC or 4 to 20 mA), with digital I/O soon to follow.

mks-iseries-mass flow

TMC, a developer of high-performance vibration and motion cancellation technology, has introduced Stage-Base 450, its next generation of frame-mountable, active vibration and motion cancellation systems designed to control building floor vibration in semiconductor facilities, while increasing wafer-processing throughput.

TMC is the first and only solutions provider to integrate unique serial-type architecture with voice coil technology into a system for aggressive moving-stage motion cancellation. Its Stage-Base 450 system is specifically designed to be the primary vibration cancellation system for semiconductor tools that incorporate high-precision motorized X-Y stages.

While such tools require extremely efficient vibration isolation, they just as critically require that payload motion induced by the moving stage settle very quickly to maximize tool throughput. By adding voice coil motor technology to TMC’s highly advanced STACIS system, Stage-Base 450 (patent pending) provides a 4x improvement in settling time over TMC’s previous generation STACIS® iX Stage-Base.

“TMC continues to apply the latest technological advances in developing new solutions for the challenging demands that semiconductor tools place on their vibration isolation systems. Stage-Base 450, with STACIS inside, is truly unique in our industry,”  states Wes Wigglesworth, TMC Product Manager, Active Systems.

“This is the only commercial solution that provides active floor vibration cancellation starting at 0.6Hz increasing to a 10-to-1 reduction by 2Hz with voice coil technology in a compact, reliable system to dramatically reduce the impact of stage motion on wafer processing,” he adds.

Like its predecessor, Stage-Base 450 incorporates TMC’s unique STACIS technology. The serial-type architecture of STACIS allows TMC to use a very stiff spring to support the payload. This is very desirable due to the much lower initial deflection in response to stage forces compared to softer springs. The proven piezoelectric active cancellation technology in STACIS delivers vibration cancellation starting at the lowest frequency commercially available.

With the addition of optional voice coil motors with feed-forward control for even faster settling time, Stage-Base 450 is the most advanced active vibration- and motion-cancellation system available for tools with moving stages.

TMC designs and manufactures precision vibration isolation systems for sensitive research and manufacturing processes worldwide. The Company’s ISO 9001:2008-certified products include active and passive vibration isolation systems; optical tops, optical table systems, and breadboards; laboratory tables and table top platforms; floor platforms; magnetic field cancellation and electric field shielding systems; and acoustic enclosures.

TMC is a unit of AMETEK Ultra Precision Technologies, a pioneer in the development of ultra-precision measurement instruments and a global leader in ultra-precise machine tools and manufacturing systems for the semiconductor, photovoltaic, nanotechnology, military, defense and ophthalmic lens markets.

AMETEK Ultra Precision Technologies is a division of AMETEK, Inc., a global manufacturer of electronic instruments and electromechanical devices with annual sales of $4.0 billion.

voice coil

Entegris, Inc. announced the latest addition to its IntelliGen family of two-stage dispense technologies used in microelectronics manufacturing processes. The IntelliGen MV extends upon the proven performance of the IntelliGen Mini and HV dispense systems with a solution optimized for 3D and MEMS applications, enabling high-purity filtration and repeatable dispense of mid-viscosity fluids.

“With the growth of 3D IC technology and MEMS, manufacturers are requiring a higher level of throughput and greater filtration capabilities to meet their unique process demands,” said Entegris Chief Operating Officer, Todd Edlund.  “Each application requires an intensive focus on real-time, interactive diagnostics and feedback. The IntelliGen MV provides several new diagnostic and detection features to reduce defects, simplify recipe programming and improve filter priming.”

The IntelliGen MV Dispense System’s compact design allows manufactures to install multiple dispense systems into a single track with the ability to process several chemistries simultaneously and maximize filter performance even in the most sensitive photochemicals between 100 and 300 centipoise.

The IntelliGen MV Dispense System and other Entegris contamination control and substrate handling solutions will be featured at the SEMICON® Korea 2015 tradeshow, which is being held at COEX exhibition center in Seoul, Korea from February 4 through 6, 2015.

entegris

HAM-LET, a global manufacturer of instrumentation valves and fittings for industrial and high purity fluid and gas delivery systems is showcasing its Ultra Fast (UF series) Diaphragm Valve for Atomic Layer Deposition at Semicon Korea in Seoul, during 4-6 February, booth no.2878.

“Our UF series unique flow adjustment mechanism, patent pending no. US 61/910,79, allows for precise flow adjustment and stable flow capacity during rapid high cycle operation,” said Mr. Felix Shestatski, Vice President of Quality, Engineering and R&D at HAM-LET.

The optional extended bonnet and cooling fin provide a superb solution when precise and repeatable performance in high-temperature applications is required. The UF series offers superior sealing performance and remarkable durability in hazardous environments, under severe demands of ultra fast actuation at ultra high purity (UHP) applications.

“Another advantage of our UF diaphragm valve is its outstanding durability and low maintenance, as it offers over 100 million life cycles.

The UF series meets the demand for high-precision diaphragm valves that can perform  repeatable and reproducible performance over an extremely frequent and large number of cycles, required by ALD applications. In addition, the UF series offers a wide range of applicable accessories, such as: position indicators, direct mounted solenoid valves (for actuation speed optimization), integrated thermocouples, heaters and more” said Shestatski.

HAM-LET has received purchase orders of UF series by one of the strongest equipment manufacturer for Samsung. In addition, HAM-LET developed a special high temperature fully immersed version of UF valve for 120°C, enabling position indication and with special inductive sensor designator. The UF series is available in surface mount (IGS) and in-line type of connections, 2-way and multiport configurations.

HAM-LET will showcase a live demonstration of the UF series at Semicon Korea 2015, booth no. 2878, as well as exhibit its advanced actuated ball valves, Let-Lok fittings, process valves and HTC fittings, which are available in Korea through HAM-LET’s distributer, PFK.

UF Diaphragm Valve for for ALD Applications

Wafer Processing


February 1, 2015

Date: Date and time TBD

Free to attend

Length: Approximately one hour

Registration coming soon.

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Contact Jenna Johnson about sponsorship opportunities for this event. 

Ultratech, Inc., a supplier of ALD systems, as well as lithography, laser-processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs), today introduced the Ultratech Cambridge NanoTech Savannah G2 atomic layer deposition (ALD) system. Since its introduction in 2004, the Savannah product line has become the industry-leading commercial ALD system used for research and development activities.

The Savannah G2 platform incorporates a wide range of advanced field-upgradable options intended to aid serious researchers in expanding their portfolio of available ALD films, as well as allow them to characterize the films in real time. Among the Savannah G2’s array of options, a unique low vapor precursor delivery system has been developed to enable the growth of novel materials including single- and multi-component films from Perovskite, Yttrium, Lithium, and the rare earth families. Additional options such as ellipsometry, Quartz Crystal Microbalance (QCM), and mass spectrometry allow for the simultaneous growth of ALD films and the real-time characterization of the deposition process, all of which are indispensible capabilities for process development and optimization activities.

Ultratech Cambridge NanoTech Vice President of Research and Engineering Ganesh Sundaram noted, “With 400 ALD systems in the field, Ultratech Cambridge NanoTech’s tools have been used in over 800 published papers in peer-reviewed journals. As a result, universities and government institutions, as well as corporate research and development centers, are using our ALD systems to break ground on some of the most interesting applications for thin film use. Today, the Savannah G2 system represents a highly extendable ALD platform, engineered to meet the needs of both routine and extremely challenging ALD thin-film research and development for today’s and tomorrow’s requirements.”

Dynaloy unveils safer cleaners


November 19, 2014

In response to evolving industry trends and customer preferences for products with better environmental, health, and safety (EHS) profiles, Dynaloy LLC is launching three new formulated products that offer exceptional performance without the use of certain chemicals, while continuing to offer its line of traditional cleaners.

“We understand concerns in the industry about some formulations. That’s why we’ve developed products that have the same or better functional capability but none of the chemicals that raise EHS concerns. For customers who prefer conventional cleaners, we still provide a robust selection of those products as well,” said Diane Scheele, Dynaloy business manager.

The newly released Dynastrip DL9150 is a non-TMAH containing multi-purpose photoresist and post-etch residue remover. With outstanding cleaning and metal compatibility, this product raises the bar for achieving environmental, health, and safety compliance while also performing as well as comparable products that contain TMAH.

With the release of Dynastrip DL9240, it’s possible to remove tough photoresists and residue materials without the use of N-methylpyrrolidinone (NMP), a solvent. Dynast rip DL9240 shows excellent compatibility with dielectric materials while cleaning hard-to-remove photoresist in advanced packaging applications.

The third product is Dynastrip DL9005. Used for high density solder cleaning applications, this product is formulated for customers who have concerns about meeting improved waste-related guidelines. It does not contain a common photoresist stripping solvent, dimethylsulfoxide (DMSO). DMSO is a solvent that may cause nuisance odors in waste stream abatement systems.

These new Dynaloy products combine superior performance with EHS-advantaged profiles to allow companies around the world to address existing and emerging EHS concerns and regulations.

Belgian nanoelectronics research center imec has announced a joint development project with Coventor, a supplier of semiconductor process development tools. The collaboration will enable faster and more optimized development of advanced manufacturing technology in the 3D device architecture era, extending down to imec’s 10- and 7-nanometer (nm) processes.

To adopt the 7nm node, the industry needs to select the optimal layout, as well as optimize process step performance and control methodology. Using Coventor’s SEMulator3D platform, engineers from imec and Coventor are working together to reduce silicon learning cycles and development costs by down selecting the options for development of next-generation manufacturing technologies. The SEMulator3D platform is an integrated set of modeling tools with enhanced visibility, accuracy and performance that enables engineers to interactively model and simulate a wide range of manufacturing effects in software before committing to expensive test chips.

At imec, process and integration experts have connected optical lithography simulations with Coventor’s SEMulator3D virtual fabrication platform to explore FinFET scaling to the 7nm node and to compare the process window marginalities in several dense SRAM designs using  Spacer Assisted Quadruple Patterning and either multiple immersion or EUV patterning cut/keep solutions. Moreover, a Spacer-Assisted Quad Patterning scheme for 7nm dense interconnect was devised using SEMulator3D, and process window marginalities for an immersion based multiple block patterning solution were analyzed. Additional collaboration will focus on the predictive modeling of Directed Self-Assembly for advanced patterning.

An Steegen, senior vice president process technology at imec said:  “A virtual fabrication platform enables us to tie together integrated processing before all of the individual processes are available.  The SEMulator3D tool gives us the visibility and accuracy to do that, and an integrated platform to bring together all the various elements of advanced processing before moving on to actual silicon.”

“Imec is the premier semiconductor research center, and this collaboration allows us to synchronize our modeling roadmap with one of the industry’s most advanced process roadmaps, as well as to speed the development of their 10nm and 7nm technology,” said David Fried, Chief Technical Officer, Semiconductor, at Coventor. “Working together with imec on novel integration schemes, designing SEMulator3D-specific structures for imec’s testsites, and then calibrating advanced models to imec’s wafer processing is an extremely effective and valuable way for Coventor to optimize our virtual fabrication platform for emerging market requirements.”

imec&conventor

Mentor Graphics Corp. today announced the appointment of A.J. Incorvaia to the role of vice president and general manager of the company’s Board Systems Division. The Mentor Graphics Board Systems Division offers a complete PCB flow, providing many of the world’s largest system design companies with a range of scalable solutions to reduce the time, cost and risk of electronic system design.

Incorvaia was recently vice president of the PCB and IC Packaging Group at Cadence Design Systems. Other responsibilities during his sixteen years at Cadence included vice president of Product Development, and engineering group director. Prior to Cadence, Incorvaia held software development and management positions at Viewlogic and Digital Equipment Corporation. He holds a B.S in Computer Science from Rochester Institute of Technology, and an M.S in Computer Science and Software Engineering from George Mason University.

“Mentor Graphics has a strong, proven track record of leadership in PCB systems design,” said A.J. Incorvaia. “I am excited to be joining an organization that is committed to its customers’ success and is forward-thinking in delivering world-class technologies to the electronics industry.”

“A.J. has a deep and comprehensive knowledge of the PCB/EDA industry, and a demonstrated focus on serving customers and improving software quality,” said Henry Potts, vice president and general manager of the company’s Systems Design group, which comprises several Mentor divisions.  “Mentor already has leading market share in PCB, and under A.J.’s direction we anticipate a strong momentum to further increase that leadership.”