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By Girolamo Di Francia, ENEA & EU-PVTP expert, Italy

Introduction

The photovoltaic (PV) sector has now reached a good maturity characterized by a worldwide installed capacity of 180 GWp, increasing at a constant rate of about 35 GWp/yr during the last three years and by an annual turnover of about 45 B$, a trend that also seems confirmed for the current year. More than 85% of all the PV plants are realized by means of PV modules based on crystalline and polycrystalline silicon (cSi solar cell technology), an industrial sector dominated by Chinese companies with a 60% of the market share. In comparison, less than 20% of the photovoltaic modules are produced in the European Union (EU) and the United States (US). Vice versa EU and US are the most relevant markets for photovoltaic products with almost 70% of the installed capacity being located in those areas (EPIA 2013, Eurobarometer 2015).

On the history and the development of such a strongly unbalanced situation, several papers have been published (see for instance: de la Tour, 2011). As a matter of fact, the question is not a minor one. Photovoltaic is indeed an important product segment of the semiconductor industry, accounting, in 2014, for about a 5% of the whole 300 B$ sales of this sector and, by now, rapidly becoming comparable to other more confirmed electronic device markets, such as those related to memories or analog devices. A very intense debate is, therefore, in progress focused on the possible strategies the US and EU should undertake in order to revitalize their photovoltaic industries so that a more suitable equilibrium between China and EU/US production is set. In this respect, it seems natural to try to learn from the historical development of the electronic industry, if similar problems have occurred in that case, and if the solutions they implemented could be transferred to the photovoltaic case.

Table 1. 2014 world leading photovoltaic manufacturers

Company Country Location of production lines
Trina Solar China China
Yingli Green Energy China China
Canadian Solar Canada, China Canada, China
Jinko Solar China China
JA Solar China China
Renesola China Poland, South Africa, India, Malaysia, South Korea, Turkey, Japan
Sharp Corporation Japan Japan, US
Motech Taiwan Taiwan, China, Japan, USA
First Solar US Malaysia, US
Sun Power US US, Philippines

Indeed, a similar situation occurred in the US semiconductor industry in the late 1980s, when it had become evident that the competition with Asian electronic chips manufacturers (memories and analog devices) was going to be lost. Most of the US electronic companies decided then to shift their production from that class of chips to new products (mainly microprocessors), also through the support of national governments initiatives. This change of approach was sustained by a growing demand for the new products that, in turn, supported the creation of a local industry of production equipment specialized for those kinds of applications (Pillai 2014). Product innovation was, therefore, in that situation, the solution to cope with the asian competition, at least temporarily.

Discussion

Whether this approach can be applied to the PV industry, as well, and innovation in solar cell technology be used to revitalize the US and EU photovoltaic industries is, however, a matter of debate. Before that paradigm can be adopted, it is important to understand the extent that the photovoltaic and the electronic sectors are similar and, in this respect, a few issues need to be more deeply discussed.

1. Technological issues

Although the basic material and processing technologies are similar, the actual fabrication processes for a cSi solar cell and an electronic chip are very different, as shown in Table 2. In the case of a solar cell, a single device is obtained out of the processing of a single silicon wafer (true large area devices) while in electronics, thousands of chips are fabricated on a single substrate (high volume production). Of course, device processing resolution requirements are also very different. For a solar cell, the minimum line to be processed is, at most, in the hundreds of microns range, while for a memory chip even less than 20 nm could be required. Both resolution and number of devices to be processed per single wafer change, in turn, the basic Fabrication Yield (FY) requirements for the two devices: for a solar cell, the FY is mainly limited by wafer handling failure, with less concern with the fabrication environment.

Table 2. A comparison of the main features of a solar cell and an electronic device

Photovoltaic Electronic
Basic Fab. Proc. = =
Large Area True large area High volume
Resolution 0.1 mm 20 nm
Reliability 25 yr/80% 5 yr (Memory card)
Operating Conditions -40 °C/+80 °C -10 °C/+50 °C
Fab. Yield Limit. Handling Wafer processing

For an electronic device, particle contamination control is critical, perhaps even more than wafer handling, and highly controlled environments (clean rooms ISO 1 and ISO 2) are mandatory. But it is, perhaps, in terms of device reliability that the two classes of devices mainly differentiate. A solar cell has to continuously work for at least 25 years in an operating temperature range that can change from – 40°C up to + 80°C, and with an end life efficiency that has to not be less than 80% of its starting one. On the contrary, an electronic device, a memory card for instance, is warranted to operate for about five years and in much less stringent operating conditions (-10 °C up to + 50 °C). It is worth noting, in this respect, that for many other electronic devices (mobile phones for instance) the full functionalities are assured for not more than two years.

2. Product innovation issues

In the electronic sector, the capacity a new product has to enter the market is, first of all, connected to its innovative performance, perhaps even more than to its cost. Let us, for instance, consider again the case of memory cards, one of the most reliable devices, as stated above. As shown in Figure 1, in the last 12 years the average product has increased its performance by a factor of 1,000, increasing its capacity from an average of 128 Mb in the year 2003, to today’s 128 GB.

Figure 1. The increase in size for an average memory card and the corresponding decrease of its cost/Mb, 2003-2014.

Figure 1. The increase in size for an average memory card and the corresponding decrease of its cost/Mb, 2003-2014.

Correspondingly, a twofold decrease in the cost/Mb has been observed, although in this same period a more limited decrease in the average product cost is actually observed (McCallum 2015).

On the contrary PV solar modules have experienced in the same period a one fold decrease (from 6 $/Wp to 0.6 $/Wp) in their average cost, but the conversion efficiency, the main technological characteristic fingerprint of the innovation for this sector, has only observed a modest 30% increase (see Figure 2).

Figure 2. The increase of the average cSi solar module conversion efficiency and the decrease of the cost/Wp, 2003-2014.

Figure 2. The increase of the average cSi solar module conversion efficiency and the decrease of the cost/Wp, 2003-2014.

Innovation, therefore, does not seem to have played a key role in the development of the photovoltaic sector and, effectively, it has been reported that the major role in PV cost reduction is due to economies of scale (ISE 2013, Goodrich 2012).

Conclusions

Sic reris stantibus, it is questionable to what extent innovation in the PV sector can effectively support the further diffusion of this form of energy and help the EU and US industries cope with the Chinese competition. Recently, for instance, it has been observed that while a certain level of product innovation can be necessary, excessive innovative technological scenarios could even be detrimental (Goodrich 2012) with respect to a more capillar photovoltaic diffusion.

The point that is important to keep in mind is that the end user of a PV module is an energy producer, and since the fuel (the solar radiation) is available at no cost, once the system used for the conversion is such that the cost of the electricity produced becomes competitive with that of other energy sources, as it is now effectively observed in several countries, the only other issue to be considered is the long-term system reliability. As the solar modules actually on the market have shown in the last 40 years, to fully comply with this requirement, it is difficult to conceive an innovative product capable of revitalizing the US or EU photovoltaic industries that is, at the same time, truly different from that classical, very sound, product. Finally, it is worth noting that it has also been demonstrated that there is no practical economical advantage in setting up a PV industry in China with respect to any other US or EU region (Goodrich 2013). This suggests that revitalizing the US or EU industries could be more a question of further supporting the diffusion of photovoltaic energy than of pushing too hard on the innovative character of the PV productions. In this respect, it is perhaps more urgent to find innovative financial schemes, sustainable from the point of view of public spending, and also capable of supporting the expansion of a sector that has become relevant for EU and US industrial and environmental policies, than to pay too much attention to the innovative characteristics of a product that seems, at present, to fully satisfy most market expectations.

References

de la Tour A., Glachant M., and Ménière Y. 2011. Innovation and international technology transfer: The case of the Chinese photovoltaic industry, Energy Policy 39 (2): 761-770.

EPIA Global market outlook for photovoltaics 2013-2017. Available at: http://www.epia.org/fileadmin/user_upload/Publications/GMO_2013_-_Final_PDF.pdf

Eurobarometer 2015. Barometre photovoltaique Eurobserver Avril 2015. Available at : http://eurobserv-er.info/photovoltaic-barometer-2015/

Goodrich A., Hacke P., Wang Q., Sopori B., Margolis R., James T.L., and Woodhouse M. , (2012) A wafer-based monocrystalline silicon photovoltaics road map: Utilizing known technology improvement opportunities for further reductions in manufacturing costs. Solar Energy Materials & Solar Cells 114: 110–135

Goodrich A., Powell D. M., James T. L., Woodhouse M. and Buonassisi T., (2013) Assessing the drivers of regional trends in solar photovoltaic manufacturing. Energy Environ. Sci., 6 : 2811-2821

ISE-Photovoltaic Report, Photovoltaic Report 2014, Ise Fraunhofer, 2014.

McCallum J.C. 2015 Flash Memory Prices (2003-2014). http://www.jcmit.com/index.htm (last accessed june 2015)

Pillai U., Querques N., and Haldar P. 2014 The U.S. Photovoltaic Manufacturing Consortium: Lessons from the Semiconductor Industry. InterPV.net – Global PhotoVoltaic Business Magazine. Available at: http://www.interpv.net/market/market_print.asp?idx=666&part_code=03

 

 

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Date: September 9, 2015 at 8:00 p.m. ET

Free to attend

Length: Approximately one hour

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The proliferation of mobile devices and Internet of Things (IoT) will lead to unprecedented demands in terms of data-traffic. Data-sharing networks need to be capable of storing and transmitting large amount of data as well as perform smart data-analysis to enable timely planning and decision-making in both personal (e.g. social, health) and enterprise (e.g. business, factory, traffic management) settings. To handle rapidly increasing amount of data, microelectronic devices and the interconnects between the vast number of devices within smaller systems (e.g. wearables, mobile phones, implanted devices) and larger systems (cars, factory equipment, roads and bridges,  supercomputers etc.) need to continuously scale with each successive generations. Moore’s law enables device scaling. Advanced interconnects and packaging technologies enable system-scaling and integration at the package level.  In this presentation, recent developments in interconnects and packaging technologies that will enable mobile devices, and IoT will be discussed.  Some of these packaging technologies include high density fan-out wafer level packaging, passive and active interposers, high throughput chip-on-wafer bonding, as well as wafer level chip scale packaging for MEMS and sensors.

Speaker: 

PKG_Surya BHATTACHARYA_IME_Photov3Dr. Surya Bhattacharya, Director of Industry Development (IPP & TSV Programs)A*STAR Institute of Microelectronics (IME)

Dr. Surya Bhattacharya is Director of Industry Development for Interconnect & Packaging and Through-Silicon Via Programs for A*STAR Institute of Microelectronics (IME). Surya has over 20 years of experience ranging from 0.8micron to 28nanometer CMOS while working in the US semiconductor industry at both Fabless companies and Integrated Device Manufacturers (IDM). He joined IME from Qualcomm CDMA Technologies, San Diego, California, a world leader in semiconductor chips for 3G and LTE mobile phone markets. At Qualcomm, he served as Director of Foundry Engineering while he oversaw technology and manufacturing ramps across multiple foundries in Asia and around the world. Prior to Qualcomm, he was a Principal Foundry Engineer at Broadcom Corporation, Irvine, California, driving CMOS development and manufacturing for Broadcom’s networking and wireless products at Asian foundries. He started his career at Rockwell Semiconductor Systems, Newport Beach, California, where he was Senior Manager for CMOS technology development for Rockwell’s communication products.

Sponsored by Air Products

Air Products has been a leading global supplier of high-purity gases, chemicals, and delivery systems to the electronics industry for over 40 years. We serve all major segments of the industry with a unique combination of offerings, experience, and commitment.  We’re advancing materials science. We’re advancing semiconductors. We’re advancing mobility. What can we help you advance?  www.airproducts.com/advancing

Entegris, Inc, a developer of yield-enhancing materials and solutions for highly advanced manufacturing environments, announced this week at the SEMICON Taiwan tradeshow the development of a platform of CMP filtration solutions using nano-melt-blown (NMB) filtration technology, as well as the expansion of its CMP research, analytical services and manufacturing capabilities in Taiwan.

entegris products

“CMP processes continue to grow in complexity in both the materials used and the need for greater planarity in each layer of today’s devices,” said Entegris Vice-President of the Liquid Microcontamination Control business unit, Clint Haris. “Entegris continues to invest in people, technology and facilities in Asia to introduce new solutions for the semiconductor market. As our customers produce integrated circuits with smaller feature sizes, our nano-fiber technology reduces the number of defect-causing contaminants from reaching the wafer.”

The Entegris filter platform using NMB media now includes the Planargard bulk, Solaris point-of-tool and Planarcap point-of-dispense families to provide contamination control solutions throughout the CMP process area. Developed and manufactured in Taiwan, the NMB media utilizes the increased porosity of the nano-fibers to reduce shear stress placed upon the slurry during transport and filtration operations. These innovations result in extended filter lifetime and greater removal of defect-causing contaminants.

DCG Systems today announces the release of the OptiFIB Taipan circuit edit solution for the most advanced integrated circuit (IC) nodes. The first OptiFIB Taipan system surpassed all benchmark specifications for 10nm edit capabilities at a leading microprocessor manufacturer, resulting in an additional order from the same customer. Orders have also been received from leading fabless and foundry customers looking to support their advanced node development efforts.

DCG-Systems-OptiFIB-Taipan-full-system-small

OptiFIB Taipan System

Circuit edit technology is primarily used by product engineers for design corrections during the IC manufacturing process. By using circuit edit instead of producing a new mask every time corrections are needed, organizations can reduce their product time-to-market cycle by four to six weeks each time a new mask production is avoided. In addition, circuit edit solutions help to resolve reliability issues and accelerate yield ramp.

The OptiFIB Taipan system has been completely re-engineered to provide exceptional accuracy and control during the circuit edit process. The system has a new chamber and stage to enhance beam placement accuracy and superior drift control. In addition, the OptiFIB Taipan column retains DCG’s unique, patented coaxial design to enable simultaneous capture of focused ion beam (FIB) and optical images. The column is equipped with piezo motors for control of apertures and gun to drive higher resolution and productivity.

The fully redesigned gas injection system, the Scorpion Plus, offers exceptionally pure and highly controlled chemical dosing.

“DCG Systems’s introduction of the OptiFIB Taipan continues our leadership in providing circuit edit solutions for the industry’s most advanced IC nodes,” said Ketan Shah, circuit edit business unit manager. “The new system offers the best circuit edit selectivity as well as the highest imaging and milling resolution of any circuit edit tool currently available on the market.”

Backside circuit modification on a FinFET device performed by OptiFIB Taipan

Backside circuit modification on a FinFET device performed by OptiFIB Taipan

SEMI-GAS, a line of ultra high purity gas source and distribution systems with robust control technology, has introduced the latest offering developed through its Applied Solutions custom-engineering process: the Xturion Liquid Push Delivery System (LPX) for the precise delivery and handling of ultra high purity liquids. The fully automatic system, operated by a GigaGuard PLC controller, features an intuitive 9” color touchscreen and user-definable alarms and set points.

The system’s liquid-tight, ducted enclosure includes a high flow manifold design with ½” inch stainless steel components.

LPX delivers ultra high purity liquids using an inert push gas, which doubles to support the system’s automatic purge processes. Built in accordance with SEMI-S2 standards and helium leak tested to 1.0 x 10-8 Atm-cc/sec, the Liquid Push System is also equipped with a number of safety features including vent line liquid leak sensors, an EMO button, and remote monitoring and shutdown functionality.

Other features of the system include:

  • An enclosure that accommodates up to 200 L (24” x 48”) drums / tanks, and that includes a liquid level detector and an 8” exhaust connection.
  • Flexibility in system configuration and flow capacity, for optional wall mount and/or rack mount applications, as well as standard and higher volume applications.

“The Xturion Liquid Push Delivery System is another example of our engineering innovation applied to solve a customer’s unique challenge, in this case related to high flow liquid delivery,” said Jim Murphy, General Manager of Applied Energy Systems. “While this system was initially developed to suit a specific need presented by a specific customer, we see the applicability of such a product in many other industry processes and production environments that use ultra high purity liquids. With that in mind, we designed the system with inherent flexibility, so that it can be easily tailored to address the particular needs of any customer seeking the safety, quality, and performance of the SEMI-GAS brand for ultra high purity liquid delivery.”

SEMI GAS

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Lock-in Thermography for Advanced Assembly Qualification

Date: August 26, 2015 at 1:00 p.m. ET

Free to attend

Length: Approximately one hour

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Increasing IoT business opportunities drive a need for new packaging techniques such as FOWLP, Embedded Component Packaging, etc. Such new assembly techniques allow more components and functionality to be integrated into an ever decreasing package space. In parallel the faster product cycle drives the need for faster production ramp to stay competitive. All these challenges highlight the need for a better methodology to determine root cause of assembly-related defects during the new package process qualification process. We will demonstrate a totally non-destructive fault localization method based on a lock-in thermography with examples in these areas.

Speakers: 

SpeakerTameyasu Anayama, Vice President, Business Development

Tam Anayama is the Vice President and General Manager for ELITE product line at DCG Systems.

Mr. Anayama has 15 years of experience in semiconductor equipment industry focusing on product development, sales and marketing of various electrical failure analysis, design characterization and circuit edit systems at Schlumberger, NPTest, Credence and most recently with DCG Systems.

Tam holds a B.S. degree in Mechanical Engineering from Waseda University in Tokyo, Japan. Tam can be reached at [email protected]

Sponsored by DCG Systems, Inc. 

DCG Systems, Inc. is the industry’s leading supplier of systems that enable direct localization and characterization of electrical faults in integrated circuits, packages and board assemblies. DCG Systems are used worldwide throughout the electronics product life cycle, from IC process development and design de-bug, to yield ramp and yield enhancement, to supporting advanced packaging engineering, and finally to failure analysis of customer returns.

DCG Systems has more than 1500 systems deployed worldwide, and serves its global customer base from its headquarters in Fremont, California and its field offices in the United States, Japan, Taiwan, Korea, Malaysia, Singapore, Israel and Germany. For more information about DCG Systems, visit www.dcgsystems.com.

Watlow, a designer and manufacturer of complete thermal systems, announces its new point-of-use fluid delivery heater, a compact solution used to provide precise and uniform heat to gases flowing into the chamber.

This new heating solution is designed as an integrated solution that replaces multiple components in a system. Space in the tool is prime real estate and design engineers are seeking solutions that are not only compact but better performing. Watlow’s new fluid delivery heater features Watlow’s patented thermal spray technology. The heater makes use of its entire surface to optimize heat transfer and temperature uniformity at temperatures up to 450°C. This design enables a high performance heater to also be small and lightweight, helping to reduce overall system size, complexity and costs.

The heater’s patented circuit patterning process offers many benefits including customizable heating profiles, distributed wattage and/or multiple zones of control and precise and repeatable power distribution.

The point-of-use fluid delivery heater is a high watt density, low mass heater, which contributes to fast response times, efficient heat transfer and enables on-demand process start up.

“At Watlow, we are striving to bring innovation to the industry to meet the needs of advanced process tools,” said Ray Derler, semiconductor business unit marketing director. “We listen to our customers. We understand the issues they face and we design and manufacture solutions to not only meet their needs, but delight them as well. This new fluid delivery heater is a perfect example. We have engineered a solution that can mounted close to the chamber, where space is tight, to deliver process gases with high temperature accuracy.”

Watlow, a designer and manufacturer of complete thermal systems, announced its new EZ-ZONE RM fiber optic temperature measurement system, a compact sensing and control solution ideal for plasma environments.

Temperature sensors that transmit electrical signals, such as thermocouples and RTDs, are often compromised when exposed to the electromagnetic environments found in plasma chambers where the RF noise couples onto the sensor and distorts the signal. Fiber optic temperature sensing, using the principles of fluorescence, enables operation in plasma environments providing stability, repeatability and cost effectiveness. As such they are ideal for determining the temperature of chamber components such as chamber lids, chamber baffles, electrostatic chucks, edge rings and showerheads.

Leveraging its strength in control systems, Watlow has combined advances in fluorescent sensing with its powerful EZ-ZONE RM control platform, creating an integrated solution for the latest semiconductor processing tools. Two versions make the system adaptable to all system requirements.

The EZ-ZONE RMZ integrates fiber optics, PID temperature control and EtherCAT communication capabilities into a single package. It features up to 48 loops of input and control with all EZ-ZONE RM temperature control features including I/O, logic, current measurement, power switching and more.

For those without the need to implement EtherCAT, the EZ-ZONE RMF module is a dedicated fiber optic input module integrating the power of the EZ-ZONE control system with one to eight channels of fiber optic temperature sensing. It can be used as either an expansion module or configured with built-in temperature control loops. These two modules provide system designers with an integrated solution with the flexibility to expand the number of sensing/control zones as required. The EZ-ZONE RMF can be used independently when only sensing is required.

Real estate associated with a plasma chamber is expensive. Watlow’s fiber optic temperature measurement system is compact at just 144 cubic inches, and can be mounted on a DIN-rail, minimizing the size of the installed footprint. Integration of the fiber optic probes (sensing head) are customized based on many factors including application environment, temperature regime, size constraints and material compatibilities.

Other system benefits include faster temperature sampling rates with high resolution, highly accurate fluorescent signal processing electronics and a highly reliable LED light source, designed to run at low currents for maximum life.

“The introduction of our fiber optic temperature measurement and control system marks a major advancement in this technology arena,” said Ray Derler, semiconductor business unit marketing director. “While the sensing technology has been markedly improved to advance both performance and reliability, this product moves beyond the sensor as a component and brings new, system-level, advantages to equipment designers. We are proud to introduce our fiber optic temperature measurement system because of the benefits the system will provide. Our customers have been telling us that they need a better solution that addresses reliability, accuracy and system level packaging. Our new system is the innovation desired for temperature sensing and control in plasma chambers.”

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The Path to Future Interconnects

Date: August 6, 2015 at 1:00 p.m. ET

Free to attend

Length: Approximately one hour

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Jon Candelaria, Semiconductor Research Corp.’s director of interconnect and packaging sciences, will summarize a SEMICON West Semiconductor Technology Symposium Session focused on interconnects. He’ll describe the challenges for interconnect technology up to the end of the CMOS roadmap, and a few of the alternatives to address them. Next, he’ll discuss possible directions beyond the roadmap, as well as interconnectivity requirements and solution paths for emerging applications.

Speaker:

jon-candelariaJonathan Candelaria, Director, Interconnect and Packaging Sciences, Semiconductor Research Corporation

Jon Candelaria has over 38 years of experience in the electronics industry in a wide variety of engineering and managerial roles. He was a Distinguished Member of the Technical Staff at Motorola’s Applied Research & Technology Center before joining the SRC in September, 2010 as the Director for Interconnect and Packaging Sciences.

He has over a dozen issued patents and published technical articles, and received the Motorola Patent of the Year Award for a foundational backend processing invention which contributed over $1B to Motorola over the course of its lifetime.

He has been an invited speaker on a wide range of topics and has led or participated in many industrial consortia activities such as the Science Advisory Council for the SRC, the National Optoelectronic Technology Research Task Force, the SIA’s ‘Semiconductor Technology Roadmap for CMOS’, and the ‘International Technology Roadmap for Semiconductors’ (ITRS), etc.

He served as Technical Program Chair and General Chair of the IEEE Electron Devices Society’s flagship conference, the IEDM.

He was the V.P. of Conferences for the IEEE’s Electron Devices Society (EDS), the EDS representative on a joint United Nations-IEEE Humanitarian Challenge advisory committee, and was an Executive Committee member of the local IEEE Computer Society, Waves & Devices, and Laser and Electro Optics Society Chapters in Phoenix, Arizona.

He is currently the North American Technical Program Chair for the International Interconnect Technology Conference (IITC)

Sponsored by Air Products

Air Products has been a leading global supplier of high-purity gases, chemicals, and delivery systems to the electronics industry for over 40 years. We serve all major segments of the industry with a unique combination of offerings, experience, and commitment.  We’re advancing materials science. We’re advancing semiconductors. We’re advancing mobility. What can we help you advance?  www.airproducts.com/advancing

Tanaka Holdings Co., Ltd. today announced that Electroplating Engineers of Japan, Limited, which operates the Tanaka Precious Metals’ plating business, has developed, and launched from July 15, the RAD-Plater cup-type ultra-compact plating laboratory equipment for semiconductor wafers, which achieves equivalent films to mass-production machines.

The RAD-Plater is ultra-compact laboratory equipment for manufacturing 2 to 8 inch semiconductor wafers. Measuring 800 mm wide and 700 mm deep, it is smaller than mass production machines and can operate on only compressed air and the 100 volt power of general equipment. In addition to gold, silver, palladium, copper and nickel, it can use a wide variety of plating solutions including alloys and lead-free solutions, and at 10 liters or less of solution, it uses about half the plating solution required by dip-type machines, which also reduces experimentation costs. The RAD-Plater uses an EEJA-manufactured Stir Cup and delivers mass-production level plating quality through uniform and bubble-less film thickness and superior filling of deep vias. It also enables reduced plating time by using a high current density achieved with an increased ion supply. Even though the RAD-Plater is laboratory equipment, it achieves a level of plating equivalent to that of mass-production machines, which enables early problem-solving in the development stage for mass production issues such as expected yield, and enables trouble-free rollout to the mass-production line. This is the world’s first cup-type plating laboratory equipment for manufacturing semiconductor wafers, using 10 liters or less of plating solution and handling 8-inch wafers.

Many development divisions of manufacturers with mass-production plating lines would have previously contracted out the plating solution experimentation work to equipment manufacturers and others for evaluation, but purchasing a RAD-Plater and conducting experiments in-house now enables a considerable reduction in development lead times. Other customers would have previously purchased mass-production machines to conduct their own experiments, but because the RAD-Plater comes at a cost that is one third to one quarter that of the mass-production machines, they can now achieve considerable cost reductions. EEJA provides samples of plating solution together with the RAD-Plater to research, development and trial manufacture divisions of manufacturers, universities and other education and research institutes, material manufacturers and others to improve sales of plating equipment and plating solutions for mass production. It aims to achieve RAD-Plater sales of 500 million yen per year by 2017.

RAD plater

RAD plater

Tanaka Precious Metals will be exhibiting at SEMICON West 2015 from July 14th to July 16th at the Moscone Center in San Francisco. Our engineers will be available to answer questions anytime at Booth No. 1628, South Hall.