Device Architecture

DEVICE ARCHITECTURE ARTICLES



OASIS vs GDS: Time to switch?

02/08/2020  The Open Artwork System Interchange Standard (OASIS®) format, which can reduce both file sizes and loading times. The OASIS format has been available for almost 15 years and is accepted by every major foundry. It is also supported by all industry standard EDA tools.

Overlay performance of through silicon via last lithography for 3D packaging

02/05/2020  A lithographic method for TSV alignment to embedded targets was evaluated using in-line stepper self metrology, with TIS correction.

Layout schema generation: Improving yield ramp during technology development

02/05/2020  Layout schema generation generates random, realistic, DRC-clean layout patterns of the new design technology for use in test vehicles.

Organic electronics: Scientists develop a high-performance unipolar n-type thin-film transistor

03/01/2019  A research team at Tokyo Tech's Department of Materials Science and Engineering including Tsuyoshi Michinobu and Yang Wang report a way of increasing the electron mobility of semiconducting polymers, which have previously proven difficult to optimize.

97 IC wafer fabs closed or repurposed during past 10 years

02/28/2019  90% of closures were ?200mm wafer fabs; greatest number of closures in Japan.

ON Semiconductor names 2018 Distribution Partner Award winners

02/27/2019  ON Semiconductor today announced its top distribution partners for 2018.

IBM elects Michelle J. Howard to its Board of Directors

02/27/2019  The IBM board of directors today elected Admiral Michelle J. Howard to the board, effective March 1, 2019.

Qualcomm, Samsung name new Si2 board members

02/27/2019  Qualcomm Incorporated and Samsung Electronics have named two executives to join the Silicon Integration Initiative board of directors. Si2 is a global research and development joint venture that provides standard interoperability solutions for integrated circuit design tools.

Micron accelerates the mobile computing experience with introduction of new client SSD

02/27/2019  Micron Technology, Inc. today added a new cost-efficient solid-state drive (SSD) to its client computing portfolio.

French start-up moves to the edge with battery-operated devices

02/26/2019  The SEMI Europe Industry Strategy Symposium (ISS Europe) returns in Milan, Italy, this year from 31st March to 2nd April, 2019 to explore new opportunities and challenges in the digital economy.

It's all in the twist: Physicists stack 2D materials at angles to trap particles

02/26/2019  Scientists create a unique platform to study quantum optical physics on the nanoscale.

Sigma Labs joins Manufacturing Technology Centre to advance industrialization of additive manufacturing with in-process quality control

02/26/2019  Sigma Labs, Inc. was named a member of the Manufacturing Technology Centre (MTC) located at Ansty Park, Coventry, UK.

Nominations open for ESD Alliance Governing Council

02/26/2019  The Electronic System Design Alliance, a SEMI Strategic Association Partner, today opened nominations for member company executives to serve on the ESD Alliance Governing Council for the next two-year term.

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Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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