Device Architecture

DEVICE ARCHITECTURE ARTICLES



Molex announces agreement to acquire Laird Connected Vehicle Solutions division

09/28/2018  Investment to enhance connected mobility solutions for automotive manufacturers building intelligent next-generation vehicles.

Imagination and GLOBALFOUNDRIES collaborate to deliver ultra-low-power connectivity solutions for IoT applications

09/28/2018  Imagination brings Ensigma Ultra-Low-Power Connectivity IP to GLOBALFOUNDRIES' 22FDX process.

Machine learning helps improving photonic applications

09/28/2018  Nanostructures can increase the sensitivity of optical sensors enormously - provided that the geometry meets certain conditions and matches the wavelength of the incident light. This is because the electromagnetic field of light can be greatly amplified or reduced by the local nanostructure. The HZB Young Investigator Group "Nano-SIPPE" headed by Prof. Christiane Becker is working to develop these kinds of nanostructures.

JCET Group appoints distinguished semiconductor industry executive Dr. Lee Choon Heung as CEO

09/28/2018  Dr. Lee brings to JCET a wealth of expertise and veteran leadership with 20 years of extensive semiconductor packaging and test experience.

Alpha and Omega Semiconductor announces new TO-leadless packaging technology for high current 400A applications

09/27/2018  Alpha and Omega Semiconductor Limited today introduced the TO-Leadless (TOLL) package in combination with 40V Shield-Gate Technology (SGT) to provide the highest current capability in its voltage class.

China forecast to account for 90% of pure-play foundry market growth in 2018

09/26/2018  Driven by cryptocurrency device demand, TSMC's China sales are expected to surge by 79% this year.

WIN Semiconductors Corp integrated GaAs technologies support 5G user equipment and network infrastructure

09/26/2018  WIN Semiconductors Corp., the world?'s largest pure-play compound semiconductor foundry, is driving the development and deployment of 5G user equipment and network infrastructure in the sub-6GHz and mmWave frequency bands.

China trade brings semiconductor executives to DC for the Fall Washington Forum

09/26/2018  Last week, more than a dozen senior semiconductor executives traveled to Washington, DC for the first-ever Fall Washington Forum.

GLOBALFOUNDRIES delivering 8SW RF SOI client chips on 300mm platform for next-generation mobile applications

09/26/2018  RF SOI technology builds on manufacturing legacy that reaches new milestone with more than 40 billion chips shipped.

Semiconductor analyst Mark Lipacis to present featured keynote at GSA Silicon Summit

09/25/2018  Managing Director of Jefferies Group LLC to discuss next semiconductor growth opportunity at October 9 conference, which is designed to advance technology, business and collaboration.

Oxygen vs. nanochip

09/25/2018  Scientists show the vulnerability of a promising two-dimensional semiconductor to air, and discover new catalyst.

Professors from MIT, University of Illinois at Urbana-Champaign to be honored for excellence in semiconductor research

09/24/2018  Professors Hoyt and Shanbhag will receive the awards in conjunction with the SIA Annual Award Dinner on Nov. 29, 2018 in San Jose, Calif.

MagnaChip to host Foundry Technology Symposium in Shenzhen, China in November 2018

09/24/2018  MagnaChip Semiconductor Corporation, a designer and manufacturer of analog and mixed-signal semiconductor products, announced today that it will hold a Foundry Technology Symposium at the Shangri-La in Shenzhen, China, on November 27, 2018.

RISC-V Foundation announces initial keynote speakers for inaugural RISC-V Summit

09/21/2018  First RISC-V Summit features keynotes from Antmicro, Facebook, Microchip Technology, NXP, SiFive and Western Digital.

Micron appoints Mike Bokan as Senior VP, Worldwide Sales

09/21/2018  Micron Technology, Inc. announced today that the company has appointed Mike Bokan as senior vice president of Worldwide Sales, effective Oct. 1, 2018.

SEMI FabView update: More investments in semiconductor fabs

09/21/2018  Global fab construction investment shows continuing strength, with 19 new fab projects expected to begin construction in 2019 and 2020, based on the latest data published in SEMI’s World Fab Forecast.

Toshiba Memory and Western Digital celebrate the opening of Fab 6 and Memory R&D Center at Yokkaichi, Japan

09/20/2018  Toshiba Memory Corporation and Western Digital Corporation yesterday celebrated the opening of a new semiconductor fabrication facility, Fab 6, and the Memory R&D Center, at Yokkaichi operations in Mie Prefecture, Japan.

NXP Semiconductors announces $1B bridge financing

09/20/2018  NXP announced a US$1,000,000,000 senior unsecured bridge term credit facility agreement.

How will graphene, the 2D wonder material, change the semiconductor industry?

09/19/2018  What materials innovation will the future bring?

Seven IC products to outpace total 16% IC market growth in 2018

09/18/2018  13 IC products forecast to show double-digit growth, led by a 39% surge in DRAM sales.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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