Device Architecture

DEVICE ARCHITECTURE ARTICLES


CEA-Leti signs agreement with Qualcomm to assess sequential 3D technology

12/09/2013  CEA-Leti today announced an agreement with Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, to assess the feasibility and the value of Leti’s sequential 3D technology.
Growing interest in the physics of nanostructures to drive demand for thin films

12/06/2013  GIA invites senior industry executives, domain experts, technologists and market strategists to participate in a comprehensive global research initiative studying the “Thin Films” markets.

Graphene: Growing giants

12/06/2013  While searching for an ideal growth platform for the material, investigators developed a promising new recipe for a graphene substrate: a thin film of copper with massive crystalline grains.

Equipment spending down 2013; expect 33% growth in 2014

12/06/2013  Fab construction projects boom in 2013 but slow in 2014.
Industry on track for highest-ever annual sales in 2013

12/05/2013  Worldwide sales increase for eighth straight month and top $27 billion for first time ever in October; WSTS forecast projects growth of 4.4 percent in 2013 and 4.1 percent in 2014.
Laser light at useful wavelengths from semiconductor nanowires

12/05/2013  Nanowire lasers could work with silicon chips, optical fibers, even living cells.
Worldwide semiconductor revenue grew 5.2 percent in 2013

12/04/2013  Worldwide semiconductor revenue totaled $315.4 billion in 2013, a 5.2 percent increase from 2012 revenue of $299.9 billion, according to preliminary results by Gartner, Inc.

Micron Technology appoints Rajan Rajgopal as VP of Quality

12/04/2013  Micron Technology, Inc. today announced that the company has named Rajan Rajgopal, vice president of Quality.
Soitec announces high-volume manufacturing of new eSI substrates

12/04/2013  Soitec, a manufacturer semiconductor materials for the electronics and energy industries, today announced it has reached high-volume manufacturing of its new Enhanced Signal Integrity (eSI) substrates, enabling cost-effective and high-performance radio-frequency (RF) devices.
Sankalp Semiconductor appoints Dan Clein into its management team

12/03/2013  Sankalp Semiconductor Private Limited, a leading Analog Mixed-Signal services and solutions company from India, announced today the appointment of Mr. Dan Clein into its management team. Dan will be based out of the North America region.
Semiconductor industry leaders to examine the future of 3D NAND at Dec 10 event

12/02/2013  Manufacturing 3D NAND designs requires overcoming formidable technical challenges to create extremely complex high-aspect-ratio structures.

Soitec and SunEdison enter into patent license agreement

11/26/2013  Soitec and SunEdison, Inc. announced today that they have entered into a patent cross-license agreement relating to silicon-on-insulator (SOI) wafer products.

12) A New Memory Type – TRAM

11/26/2013 

10) Nonvolatile Logic-in-Memory Technology

11/26/2013 

9) Flexible High-Performance Nonvolatile Memory

11/26/2013 

7) Real-World Performance of Scaled InGaAs Devices

11/26/2013 

6) Dual-Channel Nanowire Transistors

11/26/2013 

2) Fully Integrated 27nm 16Gb ReRAM

11/26/2013 

What can happen when graphene meets a semiconductor

11/25/2013  For all the promise of graphene as a material for next-generation electronics and quantum computing, scientists still don't know enough about this high-performance conductor to effectively control an electric current.
Dongbu HiTek starts volume production of 5 megapixel CMOS image sensor chips

11/25/2013  Dongbu HiTek today announced that it has begun volume production of 5.0 Megapixel (5M) CMOS Image Sensor (CIS) devices for Superpix Micro Technology Co., Ltd., a fabless customer based in Beijing.



WEBCASTS


Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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