11/25/2013  It would seem that if Intel could scale transistor cost as they have done in the last 40 years then they could win these super high volume consumer-oriented designs where cost is extremely important. And TSMC is clearly taking this seriously.

11/21/2013  Open-Silicon, Inc., and GLOBALFOUNDRIES today announced the industry’s first demonstration of a functional system-on-chip (SoC) solution featuring two 28nm logic chips, with embedded ARM processors, connected across a 2.5D silicon interposer.

11/20/2013  SUSS MicroTec has successfully installed an ELP300 excimer laser stepper to support next generation advanced packaging and 3D IC laser debonding applications at the Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin.

11/20/2013  A book-to-bill of 1.05 means that $105 worth of orders were received for every $100 of product billed for the month.

11/19/2013  The DesignForward award supports the research of the interconnect architectures and technologies needed to support the data transfer capabilities in extreme-scale computing environments.

11/18/2013  Imagination Technologies announces a ground-breaking new camera Image Signal Processing (ISP) architecture codenamed 'Raptor.'

11/18/2013  Micron Technology, Inc. today announced the development of a fundamentally new computing architecture capable of performing high-speed, comprehensive search and analysis of complex, unstructured data streams.

11/18/2013  Designed for stringent industrial requirements, Spansion FM Family offers a range of high performance and low power solutions.

11/15/2013  Semiconductors, the foundation of modern electronics used in flat-screen TVs and fighter jets, could become even more versatile as researchers make headway on a novel, inexpensive way to turn them into thin films.

11/11/2013  The Semiconductor Industry Association (SIA) today announced that Mike Splinter, former CEO and current executive chairman of the board of directors at Applied Materials, has been named the 2013 recipient of SIA's highest honor, the Robert N. Noyce Award.

11/11/2013  Xilinx today announced first customer shipment of the semiconductor industry's first 20nm product manufactured by TSMC, and the PLD industry's first 20nm All Programmable device.

11/07/2013  Global semiconductor capital equipment manufacturer OEM Group, Inc. announced the opening of its new Sales and Service Center in Yokohama, Japan.

11/07/2013  SEMI, the global trade organization representing the nano- and micro-electronic manufacturing supply chains, today announced that next year’s Plastic Electronics Conference (PE2014) will be held in Grenoble, France and alternate with Dresden, Germany in future years to better address pan-European opportunities and challenges in Plastic Electronics.

11/07/2013  Development of voltage-tunable radio frequency inductors boosts semiconductor and defense industry applications.

11/07/2013  Fabless semiconductor company DecaWave announced today its first single chip of the ScenSor wireless technology family, DW1000, which makes indoor location and communications more accurate, cost-effective and power-efficient than ever before.

11/07/2013  SK Hynix, MediaTek, Micron, and Qualcomm each forecast to show ?30% year-over-year growth.

11/05/2013  Clearly Moore's law is about cost, and Gordon Moore’s observation was that the optimum number of components (nowadays - transistors) to achieve minimum cost will double every year.

11/05/2013  Technology achievement marks significant step towards monolithic heterogeneous integration and non-silicon devices.

11/01/2013  Peregrine Semiconductor and GLOBALFOUNDRIES, a leading provider of semiconductor manufacturing technology, are sampling the first RF Switches built on Peregrine’s new UltraCMOS 10 RF SOI technologies.

10/30/2013  Results can depend on the properties of the wafers used, the conditions of the implant, the conditions of the anneal process, and even the measurement technique.