10/30/2013  3D atomic force microscopes can measure critical dimensions, line edge roughness and sidewall roughness in a way that is highly accurate, non-destructive and cost-effective.

10/30/2013  The choice between buying new systems from OEMs or fully capable refurbished gear from qualified used equipment vendors is examined.

10/30/2013  Senior executives from Semiconductor Industry Association (SIA) member companies and other multi-national semiconductor companies around the globe sent a letter to Chinese Vice Premiers Wang Yang and Ma Kai on October 16, encouraging China to support duty-free coverage for semiconductor products in an expanded Information Technology Agreement (ITA).

10/29/2013  Vanadium dioxide is one of the few known materials that acts like an insulator at low temperatures but like a metal at warmer temperatures starting around 67 degrees Celsius.

10/29/2013  New atomic layer-by-layer InGaN technology offers perfect crystal.

10/25/2013  Markets for pulsed RF power devices up to 18 GHz are expected to show continued solid growth over the next five years despite the current economic turmoil and cuts in defense spending. While the volatility of many global electronics markets is fueled by their association with consumer spending, markets for pulsed RF power devices are supported by quite different priorities.

10/24/2013  Micron Technology, Inc. today announced that the company has named Brian Angell, vice president, Advanced Controller Development.

10/23/2013  While the number of materials used in semiconductor logic will increase approximately 50 percent in the transition from 32nm to 22nm production, the materials revolution in memory will be even more pronounced, challenging developers, manufacturers, equipment, and materials suppliers, according to experts speaking at the SEMI Strategic Materials Conference 2013, held in Santa Clara on October 16-17.

10/23/2013  Carlos Lee, Director General of the European Photonics Industry Consortium (EPIC), moderated a discussion with executives from the UK photonics industry and filed this report.

10/22/2013  North America-based manufacturers of semiconductor equipment posted $975.3 million in orders worldwide in September 2013 (three-month average basis) and a book-to-bill ratio of 0.97, according to the September EMDS Book-to-Bill Report published today by SEMI.

10/21/2013  Alpha and Omega Semiconductor Limited this week released a new dual MOSFET family in the common-drain configuration in both DFN 5x6 and Micro-DFN 3.2x2 packages.

10/18/2013  Total shipments of analog devices forecast to jump 14% in 2013.

10/17/2013  ParkerVision, Inc., a developer and marketer of semiconductor technology solutions for wireless applications, today announced that a jury in the U.S. District Court for the Middle District of Florida found Qualcomm Incorporated guilty of direct and indirect infringement of ParkerVision patents.

10/15/2013  Intersil Corporation, a provider of innovative power management and precision analog solutions, today announced the appointment of Roger Wendelken as senior vice president of worldwide sales effective immediately.

10/15/2013  At IEDM, IBM researchers will report on a CMOS-compatible 200 mm wafer-scale sub-20nm nanochannel fabrication method that enables stretching, translocation and real-time fluorescence microscopy imaging of single DNA molecules.

10/15/2013  Jordan Valley Semiconductors Ltd. received another order for its recently introduced JVX7300LMI scanning X-ray in-line metrology tool for patterned and blanket wafers

10/15/2013  A research team in Japan has built a triangular InGaAs-on-insulator n-MOSFETs using MOVPE that has a high on-current of 930 µA/µm.

10/14/2013  Recent blogs address semiconductors in healthcare (blood cell sorters), FinFETs and logic roadmaps, 450mm progress, panel level embedded tech, materials innovation, options to reduce mask write time, SOI and EUV.

10/09/2013  Surprising result: Graphene retains its properties even when coated with silicon.

10/09/2013  Semiconductor capital spending has increased significantly among pure-play foundries as more IDMs shift to a fabless/fab-lite business model and as new foundry participants intensify competition among the old guard.