Device Architecture

DEVICE ARCHITECTURE ARTICLES



Promising new alloy for resistive switching memory

09/20/2013  Tiny nanoscale filaments could be breakthrough for smaller, denser memory devices.

Densest array of carbon nanotubes grown to date

09/20/2013  New technique could one day help improve the performance of microelectronics in devices ranging from batteries to spacecraft.

NXP NextPowerS3 MOSFETs offer super-fast switching with soft recovery

09/20/2013  Industry’s first MOSFET platform to deliver integrated Schottky performance with low leakage current.

Mentor Graphics and TSMC collaborate on reference flow for 16nm FinFet process technology

09/20/2013  Mentor Graphics Corp. today announced that it has completed enhancements to its digital tool set for TSMC’s 16nm FinFET manufacturing processes.

Graphene Frontiers awarded $745k NSF grant for ‘roll-to-roll’ graphene production

09/19/2013  Graphene Frontiers, a Philadelphia-based advanced materials and nanotechnology company, has been awarded a $744,600 grant from the National Science Foundation. The funds will be used to develop roll-to-roll production of graphene.

Worldwide semiconductor manufacturing equipment spending to decline 8.5 percent in 2013

09/19/2013  Worldwide semiconductor manufacturing equipment spending is projected to total $34.6 billion in 2013, an 8.5 percent decline from 2012 spending of $37.8 billion, according to Gartner, Inc.

RFMD introduces world’s first 6-inch GaN-on-SiC wafers for RF power transistors

09/19/2013  RFMD today introduced the world's first 6-inch GaN-on-Silicon Carbide (SiC) wafers for manufacturing RF power transistors for both military and commercial use.

Logic gates in graphene technology

09/18/2013  Serial production of a QCA graphene cell could be possible. Simple, well-defined process steps are identified.

High temperature reverse bias reliability testing of high power devices

09/18/2013  Power device characterization and reliability testing require instrumentation capable of sourcing higher voltages and more sensitive current measurements than ever before.

Leading-edge technology to be responsible for 2013 increase in pure-play foundry sales

09/17/2013  TSMC forecast to sell $6.33 billion worth of ?28nm devices this year, a 3x increase over 2012.

Imec, KULeuven and AIST pave the way toward increased mobility of beyond 10nm MOS devices

09/17/2013  Tensile-strained GeSn MOSFET devices on Si developed using solid phase epitaxy.

Asia-Pac soars, Japan drops in regional semiconductor capex spending

09/17/2013  Capex marketshare flips in Asia-Pac and Japan; Europe's share erodes while North America gains.

Graphene photodetector integrated into a computer chip

09/16/2013  Both academia and the industry have high hopes for graphene. The material, which consists of a single layer of hexagonally arranged carbon atoms, has extraordinary properties.

Spansion licenses ARM processor technology to power embedded systems

09/16/2013  Spansion Inc. today announced it has licensed a wide range of ARM processors for its current and future product lineup aimed at embedded applications in the automotive, industrial and consumer markets.

Entegris to partner with SEMATECH on surface conditioning and wafer cleaning technology

09/16/2013  Entegris, Inc. and SEMATECH announced they have partnered to move forward the development of advanced nanoscale particle removal processes and cleaning technologies for next-generation wafers and devices.

MediaTek and Imagination expand partnership

09/13/2013  Imagination Technologies has signed a further license agreement with MediaTek Inc., a fabless semiconductor company for wireless communications and digital multimedia solutions.

Worldwide total semiconductor market to grow 3% in 2013; consolidation still rife

09/13/2013  The worldwide semiconductor market is expected to grow three percent from 2012 to 2013. There has been sequential market growth from 1Q13 to 2Q13 and the vast majority of the top 20 vendors are expecting 3Q13 to grow revenues again.

Bruker announces acquisition of Prairie Technologies

09/13/2013  Bruker Corporation today announced that it has acquired Prairie Technologies, Inc. (Prairie), a provider of life science fluorescence microscopy products.

SUNY CNSE to develop center for 450mm computer chip manufacturing

09/12/2013  Building on Governor Cuomo’s CNSE G450C initiative and expanded partnership between NanoCollege and the Mohawk Valley EDGE continues New York’s investment strategy.

Shining a little light changes metal into semiconductor

09/10/2013  By blending their expertise, two materials science engineers at Washington University in St. Louis changed the electronic properties of new class of materials — just by exposing it to light.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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