Device Architecture

DEVICE ARCHITECTURE ARTICLES



SEMI: Second quarter semiconductor equipment billings US$ 7.55B

09/10/2013  SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$ 7.55 billion in the second quarter of 2013

New magnetic semiconductor material holds promise for 'spintronics'

09/10/2013  Researchers at North Carolina State University have created a new compound that can be integrated into silicon chips and is a dilute magnetic semiconductor – meaning that it could be used to make "spintronic" devices, which rely on magnetic force to operate, rather than electrical currents.

Accidental nanoparticle discovery could hail revolution in manufacturing

09/10/2013  A nanoparticle shaped like a spiky ball, with magnetic properties, has been uncovered in a new method of synthesising carbon nanotubes by physicists at Queen Mary University of London and the University of Kent.

Fab equipment spending up 25% in 2014

09/09/2013  Semiconductor revenue has improved in 2013 compared to 2012 and early forecasts for 2014 project revenue growth averaging about eight percent.

Growing thin films of germanium

09/06/2013  A new method to grow germanium crystals at low temperatures may lead to next-generation large-scale integrated circuits and future flexible electronics.

IDT president and CEO resigns

08/28/2013 

Board member Jeffrey McCreary appointed interim president and CEO.

TSMC becomes the largest semiconductor supplier in the world in 2Q13

08/27/2013 

Share of total IC market by foundry-produced devices is forecast to reach over 45 percent in 2017.

$5.2B in printed electronics is expected to be sold in 2015

08/22/2013 

The total applied market created by printed electronics technology is expected to grow at a compound annual growth rate (CAGR) of 47 percent to $24.3 billion by 2020 from $3.3 billion in 2013

ORNL superconducting wire yields unprecedented performance

08/19/2013 

The ability to control nanoscale imperfections in superconducting wires results in materials with unparalleled and customized performance, according to a new study from the Department of Energy’s Oak Ridge National Laboratory.

Scientists find asymmetry in topological insulators

08/19/2013 

New research shows that a class of materials being eyed for the next generation of computers behaves asymmetrically at the sub-atomic level.

Graphene nanoscrolls are formed by decoration of magnetic nanoparticles

08/19/2013 

Researchers at Umeå University, together with researchers at Uppsala University and Stockholm University, show in a new study how nitrogen-doped graphene can be rolled into perfect Archimedean nano scrolls by adhering magnetic iron oxide nanoparticles on the surface of the graphene sheets.

Maxim Integrated Products to acquire Volterra Semiconductor Corp.

08/15/2013 

Maxim Integrated Products, Inc. announced it has entered into a definitive agreement to acquire Volterra Semiconductor Corp. for $23 per share, which represents a 55 percent premium to Volterra Semiconductor's closing share price on August 14, 2013.

Skyera and SK Hynix partner on 16nm NAND Flash

08/15/2013 

Skyera Inc. today announced it has selected 16nm NAND Flash from SK Hynix for its new skyEagle all-Flash enterprise storage array.

Harold Hughes joins View Inc. board of directors

08/15/2013 

View Inc. today announced Harold Hughes, a semiconductor industry veteran, is joining the company's board of directors.

Toshiba honored with Best of Show Award at Flash Memory Summit

08/15/2013 

The Storage Products Business Unit of Toshiba is pleased to announce that its solid state hybrid drive (SSHD) series has been honored with a Best of Show Award at this year’s Flash Memory Summit.

Micron 16nm NAND wins Flash Memory Summit Best of Show Award

08/15/2013 

World’s smallest process node is recognized as most innovative Flash memory technology.

Advancing resistive memory to improve portable electronics

08/14/2013 

Researchers develop novel way to build resistive memory devices that could become the storage part of the next generation of smart phones and tablets.

Small, fast and not so demanding

08/14/2013 

Breakthrough in memory technologies could bring faster computing, smaller memory devices and lower power consumption.

Samsung introduces world’s first 3D V-NAND-based SSD

08/14/2013 

Samsung today introduced the first solid state drive (SSD) based on its recently released 3D V-NAND technology. Samsung announced its new SSD, designed for use in enterprise servers and data centers, during a keynote at the Flash Memory Summit 2013.

Tablet and cellphone processors offset PC MPU weakness

08/13/2013 

Total microprocessor sales are forecast to rise 8 percent in 2013 and reach $61.0 billion.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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