08/01/2013 

Micron Technology, Inc. and Elpida Memory, Inc. trustees announced today the closing of Micron’s acquisition of 100 percent of Elpida’s equity, pursuant to a Sponsor Agreement entered into on July 2, 2012 in connection with Elpida's corporate reorganization.

07/30/2013 

Semiconductor revenue worldwide will see improved growth this year of 6.9 percent and reaching $320 billion according to the mid-year 2013 update of the Semiconductor Applications Forecaster (SAF) from International Data Corporation (IDC).

07/26/2013 

Spansion Inc. today announced production of a new family of 16 Mb, 32 Mb and 64 Mb Spansion FL-1K Serial Flash memory devices.

07/26/2013 

Samsung announced today that it is mass producing the world’s fastest embedded memory – the industry’s first eMMC 5.0 devices – in 16 gigabyte (GB), 32GB and 64GB densities for next-generation smartphones and tablets.

07/24/2013 

China’s total IC production is forecast to represent only 6% of the worldwide IC market in 2017.

07/23/2013 

Dialog Semiconductor plc, a provider of highly integrated power management, audio, AC/DC and short-range wireless technologies today announced that Richard Beyer, appointed to the board in February this year, as an independent non-executive director, will succeed Gregorio Reyes as chairman of the board. Greg will continue to serve as a board member.

07/22/2013 

After a flat year in 2012, global purchasing of semiconductors by the world’s top electronic brands is set to return to growth in 2013, as Apple Inc. and Samsung Electronics contend to claim the title of biggest spender.

07/19/2013 

North America-based manufacturers of semiconductor equipment posted $1.33 billion in orders worldwide in June 2013 (three-month average basis) and a book-to-bill ratio of 1.10.

07/17/2013 

Engineering samples of The Hybrid Memory Cube (HMC) are expected this summer, with high volume manufacturing coming next year. It will be one of the first high volume devices employing 3D integration and through silicon vias (TSVs), employing a bottom logic layer and 4-8 stacked DRAM layers.

07/16/2013 

42 percent increase in 2Q13 followed 22 percent gain in 1Q13.  DRAM ASPs to reach levels last seen in 4Q10.

07/16/2013 

World’s smallest semiconductor process node will feed the storage demands of consumer applications and data centers.

07/15/2013 

In the afternoon of the last day of SEMICON/West 2013, a session was devoted to updates from the International Technology Roadmap for Semiconductors (ITRS) Front End of Line Technologies.

07/11/2013 

At SEMICON West 2013, Boston Semi Equipment (BSE), LLC announced the expansion of its semiconductor front end and back end equipment businesses in Tempe, Ariz. into a new and larger facility.

07/10/2013 

SEMICON West 2013 included a robust set of technical and marketing presentations on the general theme of developing new semiconductor devices in the session “Lab to Fab: From R&D to High Volume Manufacturing” held 1:30-3:30PM on July 9.

07/09/2013 

When Ajit Manocha, GlobalFoundries CEO, polled his audience during his keynote address on Tuesday at SEMICON West 2013, nearly 60 percent of the audience believed that the biggest challenge facing the semiconductor industry was the economy. However, during his presentation, Manocha seemed to suggest otherwise.

07/03/2013 

Boston University filed a lawsuit against Apple Inc. and several other big tech companies over an alleged patent infringement, a thin film semiconductor technology that they claim was developed by one of their professors.

07/03/2013 

Fab 5 second phase construction will start at the end of August this year and be completed in summer next year. Decisions on equipment investment and production will reflect market trends.

07/02/2013 

Developers have made major progress in the technology to manufacture printed or flexible circuits, sensors, batteries and displays. But frankly it’s been hard to build applications with much market pull without logic or memory as well, and those have been much harder to make.

07/01/2013 

Altair said it plans to use the capital to further strengthen its position in the single-mode LTE market as well as to support high volume product deployments from its largest customers.

06/24/2013 

Toshiba Corporation today announced that it will showcase its leading-edge semiconductor solutions for mobile devices at Mobile Asia Expo 2013.