Device Architecture

DEVICE ARCHITECTURE ARTICLES



GaN microelectronics revenue forecast to reach $334M by 2017

06/24/2013 

While military applications continue to drive the GaN device market, commercial applications have emerged that will help fuel rapid market growth.

Beyond silicon: Transistors without semiconductors

06/21/2013 

For decades, electronic devices have been getting smaller, and smaller, and smaller. It's now possible—even routine—to place millions of transistors on a single silicon chip. But transistors based on semiconductors can only get so small.

North American semiconductor equipment industry posts May 2013 book-to-bill ratio

06/21/2013 

A book-to-bill of 1.08 means that $108 worth of orders were received for every $100 of product billed for the month.

Two-dimensional atomically-flat transistors show promise for next-generation green electronics

06/21/2013 

UC Santa Barbara researchers demonstrate first n-type field effect transistors on monolayer tungsten diselenide with record performance.

Global semiconductor manufacturing equipment spending to decline in 2013, says Gartner

06/20/2013 

Outlook for semiconductor equipment market improves, but remains soft in the short term.

Semiconductor inventory falls in Q1 as outlook for electronics demand rises

06/20/2013 

Total inventory held by semiconductor suppliers declined significantly in the first quarter as excess stockpiles created during the global economic malaise of 2012 were cleared away, done in anticipation of a resurgence in consumer demand for electronic products expected by the second half of 2013.

DRAM market grows up

06/19/2013 

Industry’s newfound maturity yields growth amid adversity.

SEMATECH names William R. Rozich chairman of the board

06/17/2013 

Rozich, who previously was a member of the company’s board, succeeds Michael R. Polcari, who served as chairman since November 2009.

Samsung now mass producing industry’s first PCI-Express solid state drive

06/17/2013 

Samsung announced today that it has begun mass producing the industry’s first PCI-Express (PCIe) solid state drive (SSD) for next-generation ultra-slim notebook PCs.

SEMATECH to address critical supply chain challenges and more at SEMICON West 2013

06/17/2013 

Through a series of lectures and workshops, SEMATECH will address R&D challenges and closing key infrastructure technology gaps from July 8–12 at SEMICON West in San Francisco, CA.

Imec and Renesas pioneer high-performance RF solutions in 28nm CMOS technology

06/14/2013 

The companies released this new development at this week’s VLSI circuits Symposium in Kyoto, Japan.

Imec shows multiple enhancement options for next-generation finFETs

06/13/2013 

Nano-electronics R&D center addresses key challenges of Germanium finFET technology at VLSI 2013.

US Army validates SiOnyx XQE sensor performance

06/13/2013 

SiOnyx Inc. announced independent validation of its image sensor technology.

World's first large(wafer)-scale production of III-V semiconductor nanowire

06/10/2013 

The research team demonstrated a novel method to epitaxially synthesize structurally and compositionally homogeneous and spatially uniform ternary InAsyP1-y nanowire on Si at wafer-scale using metal-organic chemical vapor deposition (MOCVD).

Altera Corp introduces Generation 10 FPGAs and SoCs

06/10/2013 

Altera Corporation today introduced its Generation 10 FPGAs and SoCs, offering system developers breakthrough levels of performance and power efficiencies.

Fujitsu touts GaN HEMT millimeter-wave transceiver

06/07/2013 

Fujitsu Laboratories Limited has launched millimeter-wave transceiver based on gallium-nitride high-electron mobility transistor (GaN HEMT). The device operates at frequencies up to the millimeter-wave band and features an output of 10W.

Silicon Labs to acquire Energy Micro

06/07/2013 

Silicon Labs today announced that it has signed a definitive agreement to acquire Energy Micro AS.

Olympus launches LEXT OLS4100 laser confocal microscope

06/07/2013 

New 3D measuring system offers auto brightness and high-speed stitching.

Fab equipment spending: 23% growth for 2014

06/04/2013 

Fab equipment spending will grow two percent year-over-year  (US$ 32.5 billion) for 2013 and about 23 to 27 percent in 2014 ($41 billion) according to the May edition of the SEMI World Fab Forecast.

Learning the secrets of design for yield

06/04/2013 

Dr. Zhihong Liu, Executive Chairman of ProPlus Design Solutions, Inc., says that design-for-yield (DFY) considerations are more important than ever. And yet, we as an industry may not fully understand device modeling and its impact on DFY results.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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