06/03/2013 

In advance of the 2013 SEMICON West TechXPOTs on lithography and nonplanar transistors beyond 20nm, SEMI asked some of the speakers and industry experts to comment on the challenges they wanted to highlight. Many of the inputs focused on the need for precision in the processes used to form transistors, as well as how EDA can contribute to mitigating variability.

05/31/2013 

Critical trends and developments in the technologies, methodologies, and applications challenges in semiconductor test will be presented at the 6th annual IEEE Test Vision 2020 Workshop held in conjunction with SEMICON West 2013, on July 10-11 at the San Francisco Marriot Marquis Hotel.

05/31/2013 

At next week's 50th Design Automation Conference in Austin, Texas, GLOBALFOUNDRIES will unveil a comprehensive set of certified design flows to support its most advanced manufacturing processes.

05/30/2013 

Aptina’s board of directors yesterday announced that Phil Carmack has joined Aptina as chief executive officer and as a member of the board of directors.

05/30/2013 

Association Connecting Electronics Industries announced today the PCB book-to-bill ratio, which reached 1.10, its highest level since July 2010.

05/30/2013 

Benefiting from its leadership position in AM/FM tuner and audio processing chips, NXP Semiconductors NV in 2012 retained its rank as the world’s top supplier of application-specific standard product semiconductors for the automotive infotainment market.

05/29/2013 

Element Six today announced it has acquired the assets and intellectual property of Group4 Labs, Inc. (Group4), a semiconductor wafer materials company that manufactured gallium nitride (GaN) on-diamond semiconductor technology for RF and high-power devices.

05/29/2013 

Mentor Graphics Corp. today announced significant achievements in its continued collaboration with TSMC on 20nm physical verification kit optimizations.

05/22/2013 

Soitec announced the PV industry’s first four-junction solar cell device, which uses two dual-junction sub cells grown on different III-V compound  materials, which allows optimal band-gap combinations tailored to capture a broader range of the solar spectrum.

05/22/2013 

IDC expects the semiconductor market to return to growth in 2013 with revenues forecast to increase by 3.5 percent this year.

05/21/2013 

Leaders of the National Science Foundation (NSF) and the Semiconductor Research Corporation (SRC) today announced 18 new projects funded through a joint initiative to address research challenges in the design of failure-resistant circuits and systems.

05/21/2013 

Qualcomm, TSMC, and SK Hynix each register greater than 20 percent year-over-year growth.

05/21/2013 

Toshiba Corporation today announced that the company has developed second generation 19nm process technology that it will apply to mass production of 2-bit-per-cell 64 gigabit NAND memory chips later this month.

05/21/2013 

Imec and GLOBALFOUNDRIES announced today that they have expanded joint development efforts to advance STT-MRAM (spin-transfer torque magnetoresistive random access memory) technology.

05/20/2013 

This year’s SEMICON West front-end processing TechXPOTs on lithography and transistors below 20nm will provide critical updates on how technologists are coping with the next scaling challenges.

05/20/2013 

Can PC makers produce ultrathin, touch-screen PCs that are appealing to consumers—and that are priced at just $200?

05/17/2013 

The new report from IDTechEx titled "Printed, Organic & Flexible Electronics: Forecasts, Players & Opportunities 2013-2023" finds that the total market for these technologies will grow from $16.04 billion in 2013 to $76.79 billion in 2023.

05/17/2013 

Samsung Electronics Co., Ltd., a provider of advanced semiconductor solutions, today announced the industry’s first 45nm embedded flash logic process development called eFlash. Samsung successfully implemented the new process into the smart card test chip, which means that this process technology fulfills the stringent quality requirements of the security solution market and can be successfully deployed on a commercial scale.

05/16/2013 

Vishay Intertechnology, Inc. today announced that the company has enhanced its ACAS 0606 AT and ACAS 0612 AT precision thin film chip resistor arrays with tighter absolute tolerance, relative tolerance, and relative TCR for the new S, T, and U accuracy grades.

05/16/2013 

Imec and Renesas Electronics Corporation announced today that they have entered into a new strategic research collaboration at Holst Centre.