Device Architecture

DEVICE ARCHITECTURE ARTICLES



EU announces achievements of three-year power microelectronics program

05/16/2013 

LAST POWER, the European Union-sponsored program aimed at developing a cost-effective and reliable technology for power electronics, today announced its three-year program achievements.

UC Riverside scientists discover new uses for carbon nanotubes

05/15/2013 

The atom-sized world of carbon nanotubes holds great promise for a future demanding smaller and faster electronic components.

Global semiconductor sales outpace last year through Q1 of 2013

05/14/2013 

Sales in March 2013 were up slightly compared to February 2013 and March 2012.

TowerJazz and TLi Korea to collaborate on sensor ICs for mobile market

05/13/2013 

TowerJazz today announced collaboration with TLi (Technology Leaders and Innovators), a fabless company that designs non-memory integrated circuits (ICs) focused on timing controllers and driver ICs on TFT-LCD panel modules.

Top industrial electronics semiconductor suppliers suffer declining revenue in 2012

05/09/2013 

The eight leading suppliers of industrial electronics suffered revenue declines in 2012, reflecting weak conditions for the beleaguered market.

Second phase of Nanoelectronics Research Initiative to focus on post-CMOS electronics

05/08/2013 

SRC and NIST will provide a combined $5 million in annual funding for three multi-university research centers tasked with demonstrating non-conventional, low-energy technologies that outperform current technologies on critical applications in 10 years and beyond.

SSDs to account for one-third of worldwide PC storage shipments by 2017

05/07/2013 

Global shipments of solid state drives (SSD) in PCs are set to rise by a factor of seven by 2017, allowing them to claim more than one-third of the market for PC storage solutions by that time.

Analog Devices appoints Vincent Roche CEO

05/06/2013 

Analog Devices, Inc. today announced the appointment of Vincent Roche as president and chief executive officer (CEO) and his election to the Board of Directors, effective immediately.

Cache solid state drives prevail over pure SSD storage in Ultrabooks And ultrathins

04/30/2013 

The most popular storage medium this year for superthin Ultrabooks and similarly built laptops won’t be the pricey solid state drives (SSD) that initially created a buzz for their astonishing speeds.

University of Manchester researchers cultivate first graphene-based transistor

04/30/2013 

University of Manchester researchers reported to Nature Communications that they have developed the first graphene-based transistor with bistable characteristics.

Spansion to acquire microcontroller and analog business from Fujitsu

04/30/2013 

Spansion Inc. and Fujitsu Semiconductor Limited today announced they have executed a definitive agreement for Spansion to acquire the Microcontroller and Analog Business of Fujitsu Semiconductor for approximately $110 million, plus approximately $65 million for inventory.

Samsung now producing 4Gb LPDDR3 mobile DRAM at 20nm

04/30/2013 

Samsung Electronics Co., Ltd. today announced the industry’s first production of ultra-high-speed four gigabit (Gb) low power double data rate 3 (LPDDR3) mobile DRAM, which is being produced at a 20nm-class process node.

Renesas Electronics to release intelligent power device for IGBT drive with micro-isolator

04/26/2013 

Renesas Electronics Corporation this week announced the development of the R2A25110KSP intelligent power device of isolated IGBT driver for use in electric and hybrid vehicle power inverters.

Global semiconductor industry to witness a CAGR of 4.3% over next five years

04/26/2013 

Global macroeconomic developments and technological advances, personal computers, and memory markets are expected to drive demand over the forecast period, Research and Markets predicts in their report, “Global Semiconductor Industry 2012-2017: Trend, Profit and Forecast Analysis.”

Digital power market booms as technology spreads to consumer and lighting areas

04/26/2013 

The global markets for digital power supplies and digital power integrated circuits (ICs) are projected to boom from 2013 to 2017, as their use in IT infrastructure increases and as the technology expands into lighting and consumer-oriented applications including PCs, appliances and cellphones.

SiC and GaN semiconductors: What to expect in the next decade

04/24/2013 

The market for GaN and SiC power semiconductors is set to rise by factor of 18 from 2012 to 2022.

Bluetooth chip shipments to nearly double by 2017

04/19/2013 

The market for Bluetooth semiconductors is expected to boom by nearly 100 percent from 2011 to 2017, with the majority of the growth driven by demand for wireless combination integrated circuits (ICs) and mobile system-on-chip (MSoC) devices with integrated wireless connectivity that are used in mobile devices like smartphones and media tablets.

Reinventing Intel

04/19/2013 

The semiconductor chip giant revealed plans to branch out beyond PCs. Will it work?

Freescale Semiconductor to open 10 sales offices in China in 2013

04/19/2013 

In order to meet the rapidly growing business demands in the Chinese market and further expand the mass market in that region, Freescale Semiconductor announced today that the company plans to open ten new sales offices covering key areas across the mainland area.

SEMI reports March book-to-bill ratio of 1.14

04/19/2013 

North America-based manufacturers of semiconductor equipment posted $1.14 billion in orders worldwide in March 2013 (three-month average basis) and a book-to-bill ratio of 1.14, according to the March Book-to-Bill Report published today by SEMI.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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