Device Architecture

DEVICE ARCHITECTURE ARTICLES



Semiconductor sales rose in January

03/04/2013 

Worldwide sales of semiconductors were $24.05 billion the month of January, up 3.8% from January 2012 and down 2.8% from December 2012, according to the Semiconductor Industry Association (SIA).

Spansion and UMC to partner on tech development

03/04/2013 

Companies will develop integrated logic and Flash memory to enable creation of high-performance and low power electronics.

A single European semiconductor strategy is on its way

02/28/2013 

STM, Imec, CEA-LETI, ASML, Soitec and EU representatives discussed directions at ISS Europe 2013 in Italy.

Altera to build FPGAs on Intel’s 14nm tri-gate technology

02/27/2013 

Intel announced Monday a major move to expand its foundry business. Altera Corporation and Intel Corporation have entered into an agreement for the future manufacture of Altera FPGAs on Intel's 14nm tri-gate transistor technology.

World’s first GaN-based high power converter to be demonstrated at APEC 2013

02/27/2013 

Transphorm Inc. today announced at the 2013 ARPA-E Energy Innovation Summit that its novel 600V Gallium Nitride (GaN) module has enabled the world’s first GaN-based high power converter. Transphorm will demonstrate the product built with its customer-partner Yaskawa Electric, Japan at the upcoming APEC 2013 industry conference.

GaN Systems expands with new UK location

02/26/2013 

New marketing and technical support center opened in Reading, UK.

Qualcomm processor first to use TSMC’s 28 HPM advanced process technology

02/26/2013 

Snapdragon 800 processor on 28nm HPM process delivers high performance and low power for mobile devices.

Rise of smartphones reshapes competitive order in the cellphone chip market

02/25/2013 

The competitive landscape of the cellphone core integrated circuit (IC) business has completely transformed over the past five years, with Qualcomm Inc. and Samsung capitalizing on the rise of smartphones and 4G.

Toshiba develops CMOS image sensor for small and low power applications

02/25/2013 

Toshiba Corporation announced the development of a CMOS image sensor with a small area and low power pixel readout circuits. A sample sensor embedded with the readout circuits shows double the performance of a conventional one. Toshiba presented this development at ISSCC 2013 in San Francisco, CA on Feb. 20.

Painting with catalysts: Nano-engineered materials for detoxifying water

02/22/2013 

Only light, aerial oxygen, and a catalyst are needed to remove pollutants from water. Ruhr-Universitat Bochum researchers led by Professor Radim Beránek are collaborating with colleagues from seven different countries in order to develop a photocatalyst that is efficient enough to be profitable.

Ultra-low power processor operates at near-threshold voltage

02/21/2013 

At this week’s International Solid State Circuits Conference (ISSCC 2013), imec and Holst Centre presented an ultra-low power processor that operates reliably at near-threshold voltages.

1.9nJ/b Ultra-low power 2.4GHz multi-standard radio compliant to Bluetooth Low Energy and ZigBee

02/21/2013 

Imec and Holst Centre presented at ISSCC an ultra-low power multi-standard 2.3/2.4GHz short range radio. The 1.9nJ/b radio is compliant with three wireless standards: Bluetooth Low Energy, ZigBee and Medical Body Area Networks.

RRAM: Understanding reliability issues

02/21/2013 

Tim Turner, the Reliability Center Business Development Manager at the College of Nanoscale Science and Engineering (CNSE), Albany, NY, blogs about the potential of resistive memory and the reliability challenges the must be overcome.

Imec demonstrates low power beamforming transceiver chipset

02/20/2013 

New advancement enables the development of low-power, low-cost, high-data rate solutions for true mobile devices.

Leti to coordinate European supply chain in silicon photonics

02/20/2013 

CEA-Leti today announced that it will coordinate a four-year project aimed at building a European-based supply chain in silicon photonics and speeding industrialization of the technology.

Poongsan to partner with SEMATECH

02/20/2013 

Joint effort to explore novel process techniques to improve device performance and reliability in semiconductor manufacturing for sub 20nm technology node.

STMicroelectronics 28nm FD-SOI technology hits 3GHz operating speed

02/20/2013 

STMicroelectronics announced today another milestone in its testing of its 28nm FD-SOI Technology Platform.

MRAM/STTMRAM and PCM forecasted to represent a $1.6B business by 2018

02/19/2013 

Yole Développement’s report provides an analysis of the emerging Non Volatile Memories (NVM) five applications fields that will fuel market growth and a description and forecasts of the four emerging NVM (MRAM, PCM, RRAM, FeRAM) technologies.

300-millimeter thin-wafer products by Infineon now being shipped worldwide

02/19/2013 

In February, Infineon received the first customer go-aheads for products of the CoolMOS family produced by the 300-millimeter line at their site in Villach, Austria.

Shimadzu introduces high-sensitivity gas chromatograph

02/18/2013 

Shimadzu Corporation today introduced the Tracera, a high-sensitivity gas chromatograph. Tracera is equipped with the newly developed barrier discharge ionization detector BID, which is capable of detecting all types of trace organic and inorganic compounds.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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