01/03/2013 

In semiconductor manufacturing, 450mm is the next big opportunity. Issues of economic scale and complexity will force fab designers, OEMs and process integrators to investigate all open avenues in the search for solutions to the huge challenges that accompany 450mm.

01/02/2013 

NAND flash has embarked on its own 3-D scaling program, whereby the stacking of bit cells allows continuous cost-per-bit scaling while relaxing the lateral feature size scaling.

01/02/2013 

While solutions are available to extend Moore’s Law, these solutions come at considerable increases in cost and complexity. As it has in the past, this industry will find more innovative solutions to overcome the challenges of inflection.

01/02/2013 

The SEMI Consensus Forecast and the SEMI World Fab Forecast, with data collected from two different methodologies, point to the same conclusion: 0% growth for 2013.

12/28/2012 

Industry watchers have been lowering their outlooks for 2013 over the past few weeks, but there's one set of opinions that still see optimism for an industry rebound in 2013 -- chip industry executives themselves.

12/28/2012 

Researchers in Japan have devised a MEMS fabrication technology using lower-cost production methods of printing and injection molding, enabling MEMS devices to be applied for fields such as lighting -- and producable by firms outside the semiconductor sector.

12/24/2012 

Are we closer than we think to our needed mass production costs for silicon interposers? Phil Garrou gleans some insights from the year-ending RTI Architectures for Semiconductor Integration and Packaging conference.

12/20/2012 

Global spending on wafer fab equipment (WFE) is now on pace to finish 2012 with a -17% annual decline, and 2013 now looks like it'll only be slightly better at a -10% dropoff, before the next cyclical spending upturn begins in 2014, according to an updated forecast from Gartner.

12/19/2012 

Singapore's Institute of Microelectronics (IME) has launched a new multiproject wafer service for 2.5D through-silicon interposers, to provide a cost-effective platform for R&D prototyping and proof-of-concept in the technology.

12/17/2012 

Stephen Pateras, product marketing director for Mentor Graphics Silicon Test products, blogs about the new IJTAG standard, which enables "plug and play" automation for SoC design.

12/17/2012 

Demand for microelectromechanical systems (MEMS) devices, particularly pressure sensors for harsh environments, will grow 20% in 2012 on the way to a 9% CAGR for the next several years.

12/17/2012 

Samsung's reaffirmation of its planned $4B investments in its Austin, TX facilities don't offer much extra info, but do serve as a message to the market about its future plans -- with or without Apple.

12/14/2012 

Joining the growing chorus of industry watchers lowering their outlooks on the semiconductor sector, Gartner has reduced both its 2012 and 2013 forecasts for semiconductor sales but is remarkably more bullish on prospects in 2014.

12/12/2012 

STMicroelectronics is getting out of the JV chip business with Ericsson, but it's still full-steam ahead for its use of (FD-SOI) technology with its partners. 

12/11/2012 

With this week's IEEE International Electron Devices Meeting (IEDM 2012) now underway, here are four of the papers that were accepted late: on 90nm integrated silicon photonics, ZnNO for next-gen displays, and III-V TFETs for the 7nm node.

12/11/2012 

At the International Electron Devices Meeting in San Francisco, An Chen of GLOBALFOUNDRIES presented a survey of emerging nanoelectronic devices, which he divided into two categories: Charge-based and non-charge based.

12/10/2012 

STMicroelectronics has a new strategic plan that will focus on five product areas (MEMS/sensors, smart power, automotive products, microcontrollers, and application processors), and also exit its mobile chip JV with communications giant Ericsson.

12/07/2012 

A new wafer supply deal between AMD and GlobalFoundries will free up cash in the near-term, but industry watchers fear that long-term issues still loom.

12/05/2012  p>A team of ST and CEA-Leti researchers have received the 2012 Général Ferrié Award, considered to be the highest award in electronics R&D in France.

12/05/2012 

Chip sales growth continues to soften in 2012 as the industry slips from "stagnation" to "slump," but the stage is still set for a rebound in 2013, according to updated analysis from IHS iSuppli.