Device Architecture

DEVICE ARCHITECTURE ARTICLES



IEDM 2012 slideshow: Sneak preview of 14 conference papers

12/04/2012 

We've scanned the entire conference program for next week's 58th annual IEEE International Electron Devices Meeting (IEDM), to present a quick sampling of some of the more intriguing papers.

A*STAR, SFC Fluidics develop point-of-need traumatic brain injury diagnostic device

12/04/2012 

A*STAR's Institute of Microelectronics (IME) and SFC Fluidics will develop a portable diagnostic tool for rapid triaging of traumatic brain injury (TBI) victims.

"Cloning" could make structurally pure nanotubes for nanoelectronics

11/30/2012 

Researchers have demonstrated a technique for growing virtually pure samples of single-wall carbon nanotubes (CNT) with identical structures, a process likened to "cloning" them -- and possibly an important step toward controlling their manufacture for future electronic devices.

AMD wants to sell, lease back Austin campus

11/30/2012 

AMD hopes to save up to $200M by selling its Lone Star campus in Austin and then leasing the site back, as the company seeks ways to regain its fiscal footing.

IDTechEx forecasts a $100 million graphene market in 2018

11/29/2012 

Despite graphene's promise as a material in future electronics with excellent properties in almost all applications, it still faces difficulties in market acceptance, according to a report from IDTechEx.

Renesas nearing final bailout: Reports

11/28/2012 

The Japanese rescue of Renesas Electronics partly with state-backed funding is nearing finality, with the company's three largest shareholders approving the deal, according to multiple reports.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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