Device Architecture

DEVICE ARCHITECTURE ARTICLES



Deca tips new M-Series chip-scale packaging offering

11/07/2012 

Deca Technologies has introduced a new chip-scale packaging (CSP) product line for applications where its existing wafer-level CSP option isn't a good fit. Details and analysis to come.

September IC sales bounce in Americas, tracking to -4% for FY2012

11/06/2012 

A big boost in demand in the US helped ratchet up chip sales growth in September, according to the latest data from the Semiconductor Industry Association (SIA), but annual growth is on pace for a -4% decline from 2011.

GSA working group evaluates new semiconductor startup models to attract investors

11/06/2012 

The Global Semiconductor Alliance (GSA) has formed a new working group and identify various alternatives to encourage startups to innovate, woo investors, generate returns, and keep generating sustainable industry M&A.

Imec, Nantero launch joint carbon nanotube memory program

11/05/2012 

Nantero's carbon nanotube-based memory (NRAM) will be manufactured, tested and characterized in imec's facilities targeting application in high-density next-generation sub-20nm memories.

O-S-D market momentum fades as world economy stalls

11/02/2012 

After a strong surge in 2010 and solid growth in 2011, the market for optoelectronics, sensors/actuators, and discrete semiconductors (O-S-D) has lost most of its momentum amid a wobbling world economy, says IC Insights.

X-Fab takes majority stake in MFI, widens MEMS portfolio to support growth push

11/01/2012 

X-Fab Silicon Foundries says it has become the majority shareholder in German MEMS Foundry Itzehoe GmbH (MFI), the latest in a series of recent moves to raise its profile as a top MEMS foundry.

EU partners clarify EUV optics improvements

11/01/2012 

A group of partners in Europe summarize results from their completed project to deliver the first EUV lithography optics, with progress in several optics components and in mask handling, cleaning, and repair.

Applied unveils new PVD, PECVD tools for display manufacturing

10/31/2012 

Applied Materials has announced two new tools for display manufacturing: one with a new design for depositing IGZO films for TFTs, the other handling bigger LTPS-deposited substrates to help lower manufacturing costs.

Why the new Windows 8 won't spur DRAM sales

10/29/2012 

In a departure from past iterations, Windows 8 will not cause any significant rise in DRAM unit shipments, predicts IHS iSuppli.

Comm, auto apps are now driving the IC market

10/26/2012 

Communications applications are far and away the leading growth market for ICs over the next five years, and PCs and consumer applications have fallen far back in the pack.

Why node shrinks are no longer offsetting equipment costs

10/24/2012 

Semiconductor manufacturers can expect equipment costs to increase about 15% for each new process node, but previously enjoyed advantages of moving to smaller feature sizes are no longer offsetting those costs -- even with a 450mm wafer transition.

Wafer shipments back on track: Inside the numbers

10/23/2012 

Wafer demand is slowly turning back toward growth, and a closer look at the numbers from SEMI and Semico Research shows what's behind the trends -- and why they give purchasing managers headaches.

Flat-panel displays rebounding in 2012 as prices fall, performance rises

10/18/2012 

Worldwide flat-panel display (FPD) revenues will reach a record $120 billion in 2012, up 8% from a challenging year in 2011, and the recovery is entirely on the backs of TFT-LCDs and AMOLED displays, according to NPD DisplaySearch.

European consortia, ASML, supplier network plan for 450mm transition

10/18/2012 

At SEMICON Europa, European government representatives, consortia, and suppliers discussed programs to support and participate in the 450mm wafer-size transition -- including a comprehensive presentation from ASML about its roadmap for 450mm EUV platforms.

Intel offers muted optimism in 3Q12 results, but cutting capex

10/17/2012 

Intel spoke of caution in end markets when discussing its 3Q12 results, but a big dip in capex and lack of 2013 visibility will likely cause concern in the semiconductor manufacturing ecosystem.

SEMI adds session, extends abstract deadline for China chip conference

10/16/2012 

SEMI has extended the deadline to submit proposed papers to next spring's China Semiconductor Technology International Conference 2013, and added a new symposium on circuit design, system integration, and application.

GSA forms technology steering committee to guide working groups

10/16/2012 

The Global Semiconductor Alliance (GSA) says it has formed a Technology Steering Committee to help address key business and technology areas of interest to its members, and "encourage the advancement and adoption of leading technology and practices."

Measuring inside an active OLED

10/15/2012 

Researchers at the National Institute of Advanced Industrial Science say they have devised a way to selectively and nondestructively evaluate molecules within a sealed organic light-emitting diode (OLED) in operation, in hopes to further understand and eventually minimize performance degradation.

Ultrabook outlook slashed for 2012-2013, but growth still promising

10/11/2012 

High pricing and ineffective marketing are weighing down expectations for ultrabook demand, but the future's still bright with new models promising new features -- and that's great news for one component sector.

EUV Symposium takeaways: Slow and steady progress, much improvement expected in early 2013

10/09/2012 

EUV Symposium host imec and a pair of industry analysts gauge the pace of improvements in EUV lithography and its long march toward production readiness.




WEBCASTS



Environment, Safety & Health

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The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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