Device Architecture

DEVICE ARCHITECTURE ARTICLES



@ The ConFab: Semiconductor industry experts look to the future

06/04/2012 

The ConFab’s sessions opened with “The Economic Outlook for the Semiconductor Industry,” featuring Jackie Sturm of Intel, Dan Hutcheson of VLSIresearch, and Jim Feldhan of Semico.

A virtual IDM concept can unite semiconductor foundries, fabless companies, and packaging houses

06/04/2012 

The ConFab 2012, Solid State Technology’s invitation-only meeting of the semiconductor industry, opened today in Las Vegas with a keynote address from John Chen, PhD, VP of technology and foundry operations at Nvidia Corporation.

CNTs produced with >95% semiconducting content now available from SWeNT

05/31/2012 

SouthWest NanoTechnologies (SWeNT) released SG65i, a single-wall carbon nanotube product with >95% semiconducting concentration, before secondary processing to remove metallic SWCNT content.

Intel forms Collaborative Research Institutes to build global tech research community

05/26/2012 

Intel will invest more than $40 million over the next 5 years in a worldwide network of university research centers called "Intel Collaborative Research Institutes." Academia -- in hub and spoke universities -- will collaborate with industry on technology R&D.

Spansion (CODE) unveils SLC NAND with extended roadmap for embedded designs

05/25/2012 

Flash memory chip maker Spansion Inc. (NYSE:CODE) debuted its first family of single-level cell (SLC) NAND products using 4Xnm floating-gate technology. Spansion plans to roll out 3X and 2Xnm node versions of the NAND chips in the near future, without obsoleting the more mature designs.

ITF: The technology knobs for system scaling

05/25/2012 

At imec's International Technology Forum, An Steegen, Senior Vice President Process Technology at imec, discusses the three technology knobs that are key for a further system scaling.

ITF: Life has changed

05/25/2012 

At imec's International Technology Forum, the research consortium's CEO, Lec van den Hove, draws attention to the need for the industry to solve the world's health problems.

ITF: Winning together with strategic collaboration

05/25/2012 

At imec's International Technology Forum, Greg Bartlett, CTO of GLOBALFOUNDRIES, said the key to survival in the semiconductor industry is adaptability and collaboration.

How emerging growth sectors impact the overall semiconductor industry: ConFab preview

05/24/2012 

Intel's Jackie Sturm will bring to light some of the emerging, growth markets for semiconductors, and what they mean for chipmakers and the fab suppliers in the first session of The ConFab, “The Economic Outlook for the Semiconductor Industry.”

Power management semiconductors grow after a rocky Q4 2011

05/24/2012 

The market for power management semiconductors grew for 7 quarters before declining grossly in Q4 2011, flattened in Q1 2012, and is now “on its way to discernible growth in Q2,” reports IHS.

Bankrupt Elpida leapfrogs likely acquirer Micron in Q1 DRAM rankings

05/24/2012 

Micron is the generally favored acquirer for bankrupt Elpida. But this did not stop Elpida from displacing MU in the Q1 DRAM supplier rankings in Q1, noted IHS. DRAM as a whole declined in Q1, despite predictions of a strong 2012.

Direct chip bonding, all-SiC design increase power density in Mitsubishi Electric inverter

05/23/2012 

Mitsubishi Electric Corporation developed a prototype forced-air-cooled three-phase 400V output inverter with all-silicon carbide (SiC) power modules and direct lead bonding that has a power density of 50kVA per liter.

Present at IEEE IEDM 2012

05/23/2012 

IEEE International Electron Devices Meeting (IEDM) is seeking original presentations on microelectronics research and development, with a focus on silicon and non-silicon device and process technology, circuit/device interactions; energy-harvesting, biomedical, and power electronics; magnetics and spintronics; and other topics.

Power discrete semiconductors grow with cloud computing, electric vehicle demand

05/22/2012 

Power discretes’ sales revenue will grow at a CAGR of 6.5%, 2012-2016, estimates GBI Research. Power discretes are meeting demand for energy-efficient and environmentally friendly products.

ONNN opens IC design center in Czech Republic

05/21/2012 

ON Semiconductor (Nasdaq:ONNN) expanded its Roznov, Czech Republic, operations with a new 4,000sq.m. research and design facility, a quarter of which is high-tech laboratories.

Low-cost Flash memory boosted by gray-market cellphones

05/21/2012 

The massive “gray market” for cellphones is propelling sales of lower-cost flash memories like eMMC and SPI NOR, as manufacturers of the unregulated phones strive to keep production costs low, says IHS.

Bridging the fabless-foundry gap: Highlighted ConFab presentation

05/18/2012 

At The ConFab in Las Vegas, TSMC’s BJ Woo, senior director, Graphic/PLD/CPU Business Development Division, will present “Bridging the Fabless-Foundry Gap.”

Lower DRAM prices enable more DRAM per smartphone without higher pricetag

05/18/2012 

DRAM’ percentage of the cost of a smartphone is decreasing, even as DRAM usage in smartphones is on the rise. Lowering ASPs for DRAM components caused DRAM costs in smartphones to fall by more than half in the course of a year, according to IHS.

JEDEC publishes LPDDR3 standard for low-power memory chips

05/17/2012 

JEDEC Solid State Technology Association published the JESD209-3 LPDDR3 Low Power Memory Device Standard, targeting the performance and density demands of new-gen mobile devices.

Semiconductor companies see increased venture capital funding in April

05/17/2012 

In April 2012, venture investment dollars received by semiconductor companies was $194.2 million; a 901.0% increase M/M and 461.3% increase Y/Y, reports the Global Semiconductor Alliance (GSA).




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

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