Device Architecture

DEVICE ARCHITECTURE ARTICLES



SiFive announces first open-source RISC-V-based SoC platform with NVIDIA Deep Learning Accelerator technology

08/20/2018  SiFive, a provider of commercial RISC-V processor IP, today announced the first open-source RISC-V-based SoC platform for edge inference applications based on NVIDIA's Deep Learning Accelerator (NVDLA) technology.

Toshiba announces next-generation superjunction power MOSFETs

08/20/2018  New devices increase power supply efficiency even further.

Seven top 15 semi suppliers of the first half of 2018 register ?20% gains

08/20/2018  Samsung extends its number one ranking and sales lead over Intel to 22%.

2018 IEEE IEDM to showcase breakthrough in semiconductor technology

08/17/2018  This year's theme is "Device Breakthroughs from Quantum to 5G and Beyond" -- chosen to reflect the expanding reach of electronics technology in society.

CTA study: China tariffs will cost the U.S. economy up to $2.4B annually

08/17/2018  The Trump administration's consideration of tariffs on Chinese printed circuit assemblies and connected devices would cost the economy $520.8 million and $2.4 billion annually for the 10 percent and 25 percent tariffs, respectively, according to a new study commissioned by the Consumer Technology Association (CTA).

Adesto demonstrates resistive RAM technology targeting high-reliability applications

08/16/2018  Adesto Technologies, a provider of application-specific semiconductors for the IoT era, announced it will present new research showing the significant potential for Resistive RAM (RRAM) technology in high-reliability applications such as automotive.

WFE semiconductor equipment billings to drop 24% in second half of 2018

08/16/2018  On the heels of a 37.3% growth in wafer front end (WFE) semiconductor equipment growth in 2017, the market will grow only 10% in 2018 to $62.3 billion.

Automotive semiconductors to reach $73B by 2023, says Semico Research

08/15/2018  Automotive electronics are a bright light for the semiconductor industry, as smartphone growth slows, and personal computing growth continues to decline.

pSemi announces world's first monolithic, SOI Wi-Fi front-end module

08/15/2018  pSemi Corporation (formerly Peregrine Semiconductor), a Murata company focused on semiconductor integration, introduces the world’s first monolithic, silicon-on-insulator (SOI) Wi-Fi front-end module.

NSF awards $1.2M to Rochester Institute of Technology, University of California-San Diego, University of Delaware

08/14/2018  Academic institutions partner with AIM Photonics to realize advanced computing architecture using light; develop mobile probes for identifying specific materials; and enable improved manufacturing processes for photonic devices.

SEMI integration of ESD Alliance underway

08/14/2018  SEMI today announced that all legal requirements have been met for the ESD (Electronic Systems Design) Alliance to become a SEMI Strategic Association Partner.

TowerJazz to hold Technical Global Symposium (TGS) in China

08/14/2018  TowerJazz, the global specialty foundry, announced details of its China Technical Global Symposium (TGS) event in Shanghai on August 22, 2018.

Size of semiconductor acquisitions may have hit limit

08/14/2018  Mega-mergers become less likely because of the high-dollar value of major acquisitions, increasing scrutiny from regulators, rising protectionism among more countries, and growing global trade frictions.

Strong 2Q'18 global supply chain growth but second half slowing

08/14/2018  Semiconductor capital equipment sales are historically very volatile, with their growth fluctuating MUCH MORE than electronic equipment.

Keysight Technologies acquires Thales Calibration Services

08/13/2018  This acquisition establishes Keysight as the largest calibration and support services organization in Australia.

DRAM sales forecast to top $100B this year with 39% market growth

08/09/2018  With 24% IC marketshare, DRAM expected to account for nearly one in four IC sales dollars spent.

European electronics industry CEOs call on European Commission to bolster sector's competitiveness

08/08/2018  In a bid to reinvigorate Europe’s electronics strategy and strengthen the region’s position in key emerging technologies, European electronics industry CEOs in June called on public and private actors to accelerate collaboration at the European Union and national levels.

SEMI China, CASPA promote China-Silicon Valley innovation partnership

08/08/2018  Aiming to forge stronger ties between the two technology heavyweights as partners in semiconductor industry innovation, SEMI and CASPA (Chinese American Semiconductor Professional Association) in mid July signed a strategic cooperation agreement to promote industry innovation between Silicon Valley and China.

Average design cost for basic SoCs across all geometries was $1.7M in 2017, says Semico Research

08/07/2018  The semiconductor industry today is faced with several substantial issues-not the least of which are the continuing rise in design costs for complex SoCs, the decrease in the incidence of first-time-right designs and the increase in the design cycle time against shrinking market windows and decreasing product life cycles.

Achronix and Mentor partner to provide link between high-level synthesis and FPGA technology

08/07/2018  Achronix Semiconductor Corporation today announced availability of an optimized High-Level Synthesis (HLS) flow from its partner, Mentor, a Siemens business, for its FPGA technology products.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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