Device Architecture

DEVICE ARCHITECTURE ARTICLES



Micron, Hynix gain share in NAND Flash memory business

04/30/2012 

Micron Technology Inc. and Hynix Semiconductor Inc. achieved strong NAND flash business globally in Q4 2011, thanks to solid manufacturing and pricing. The chipmakers gained market share on the NAND Flash industry leaders Samsung and Toshiba, and will continue to grow in 2012, reports IHS.

Touch controller ICs see fast growth, capacitive display controllers gaining share

04/30/2012 

The global touch controller IC market is growing quickly, thanks to emerging natural user interfaces and touchscreens’ rapid adoption in consumer electronics. From 2011 to 2016, global touch controller revenue will grow from 0.4% of the total semiconductor industry to 1.65%.

Semiconductor revenues topped USD300B in 2011

04/30/2012 

Worldwide semiconductor revenues increased more than 3.7% year over year to $301 billion in 2011, according to the IDC Worldwide Semiconductor Applications Forecaster. IDC expects 2012 growth to be in the 6-7% range.

Qualcomm dominates cellular baseband chip market in 2011

04/26/2012 

The global cellular baseband processor market grew 15% year-on-year in 2011, hitting $15.1 billion, shows Strategy Analytics. Of that, Qualcomm holds 45% market share.

SEMATECH highlights from VLSI-TSA

04/26/2012 

SEMATECH experts reported on innovative processes for advanced CMOS logic and memory device technologies and 3D TSV manufacturing at the International VLSI Technology, System and Applications Symposium (VLSI-TSA).

Understanding semiconductor wafer demand growth in 2012

04/25/2012 

Wafer demand grows at a CAGR of about 8-9%, but capital investment in wafer fab capacity does not stick with an 8-10% investment rate every year. Semico tracks wafer demand, which is “anything but stable.”

2012 semiconductor revenue forecast bumped up 1 point at IHS

04/25/2012 

The overall semiconductor industry will grow 4.3% in 2012, according to IHS, which raised its forecast 1 percentage point based on consumer demand for wireless products like smartphones and tablets.

Texas Instruments (TI, TXN) reports broad orders increase in Q1 2012

04/24/2012 

"As we expected, our business cycle bottomed in the first quarter, and early signs of growth began to emerge." -- Rich Templeton, TI's chairman, president and CEO.

Intel’s first 22nm trigate transistor products debut

04/24/2012 

Intel Corporation introduced its first product built on the 22nm 3D trigate transistor: the quad-core 3rd-generation Intel Core processor family for desktop, laptop and all-in-one (AIO) designs.

AMD Q1 shows steady improvement, 28nm readiness, heavy competition

04/24/2012 

AMD (NYSE:AMD) announced Q1 2012 revenue of $1.59 billion, a net loss of $590 million and operating loss of $580 million. Analysts share their takes on AMD's 32nm and 28nm situation, ASPs, and more.

Qualcomm’s first 28nm semiconductor outperforms 45nm siblings by 25%

04/24/2012 

The HTC One S HSPA phone runs Android 4.0.3, based on Qualcomm’s first 28nm processor, the MSM8260A, with an Adreno 225 GPU core. ABI Research performed a teardown on the handset.

Toshiba builds semiconductor fab in Thailand to replace flooded fab

04/24/2012 

Toshiba Corporation (TOKYO: 6502) will rebuild its semiconductor manufacturing operations in Thailand by relocating Toshiba Semiconductor Thailand Co., Ltd. (TST) to a new manufacturing facility.

Freescale Semiconductor CEO plans retirement, seeks successor

04/23/2012 

Freescale Semiconductor Holdings (NYSE:FSL) launched a formal process to identify a successor to Chairman and CEO Rich Beyer, who will retire as CEO after a transition.

Semiconductor investments from venture capital sector fall in March

04/23/2012 

Investments in fabless companies, semiconductor suppliers, and other chip companies fell more than 80% month/month and year/year in March, reports the Global Semiconductor Association (GSA).

IBM adds membrane, chemical suppliers to lithium-air battery project

04/23/2012 

IBM welcomed Asahi Kasei and Central Glass to its Battery 500 Project team, collaborating on far-reaching research to improve electric vehicles. Asahi Kasei will engineer membrane technologies and Central Glass will develop electrolytes and additives for lithium-air batteries.

Multi-core semiconductor scaling enabled with memory communication research

04/20/2012 

Researchers sponsored by Semiconductor Research Corporation have identified a path to overcome challenges for scaling multi-core semiconductors by addressing how to scale memory communications among the cores.

NAND flash memory sees steady growth thanks to ultrabooks, smartphones, tablets

04/19/2012 

The NAND flash memory market will grow 8% in 2012 to $22.9 billion, thanks to major sales drivers such as solid-state-drive (SSD) equipped ultrabooks, according to the IHS iSuppli Data Flash Market Tracker.

Intel’s Q1 2012 earnings: Key takeaways

04/19/2012 

Intel Corporation (NASDAQ:INTC) posted quarterly revenue of $12.9 billion, operating income of $3.8 billion, and net income of $2.7 billion. Analysts from FBR Capital Markets and Barclays Capital break down the numbers.

EPIC names new director general, promises closer ties with EU

04/19/2012 

EPIC, the European Photonics Industry Consortium, announced at its annual general meeting that Carlos Lee has been appointed as director general, succeeding Thomas Pearsall, who has led the association since its founding in 2003.

Texas Instruments (TI, TXN) names top suppliers

04/19/2012 

Texas Instruments awarded 15 of its 12,000 suppliers with Supplier Excellence Awards for delivering outstanding service and support, based on cost, environmental responsibility, technology responsiveness, assurance of supply, and quality.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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