Device Architecture

DEVICE ARCHITECTURE ARTICLES



ASMC will focus on productivity and technology challenges

04/18/2012 

The 23rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2012) will be held May 15-17 in Saratoga Springs, New York. The conference will feature presentations of more than 85 peer-reviewed manuscripts covering critical process technologies and fab productivity. This year’s event features a panel discussion on “Competing for R&D Dollars,” moderated by Solid State Technology Editor-in-Chief Pete Singer.

Soitec's fully depleted (FD) semiconductor product roadmap

04/17/2012 

Soitec, semiconductor materials supplier, released its fully depleted product roadmap, comprising two products designed for both planar and three-dimensional approaches to building semiconductor transistors.

Top 10 semiconductor vendors: Intel broadens lead, Qualcomm sees most growth

04/17/2012 

Total worldwide semiconductor revenue reached $306.8 billion in 2011, up $5.4 billion, or 1.8% from 2010, according to Gartner Inc.

Conference Report: MRS Spring 2012, Day 5

04/16/2012 

Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the fourth day: electronic skin, energy storage with nanowires, printable inks, gas sensing, inkjet printing, semiconductor polymers for organic devices, CNTs, OFETs, touch screen fabrics, and the coffee breaks.

Conference Report: MRS Spring 2012, Day 4

04/13/2012 

Blogger Michael A. Fury, Techcet Group, reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the fourth day: nanowire FETs, laminate MEMS, nanoparticles in security printing, graphene nanoribbons, Ta2O5 memristors, redox flow batteries, graphene, and more.

Chip sector sets up for high demand in H2

04/13/2012 

Barclays Capital and FBR Capital Markets share their takes on earnings season for public semiconductor companies. Both predict a cycle of inventory replenishment in the semiconductor supply chain that will bode well for chip makers in 2012.

JEDEC taps Nokia, Micron, Samsung Semiconductor for non-volatile wireless memory subcommittee

04/13/2012 

JEDEC Solid State Technology Association will form a subcommittee to its JC-64 Committee for Embedded Memory Storage and Removable Memory Cards focused on standardization of non-volatile memory (NVM) in wireless applications.

Sony restructures to boost leading-edge display, electronics products

04/13/2012 

Sony Corporation will implement series of initiatives, under its new management team, to “revitalize and grow the electronics business to generate new value, while further strengthening the stable business foundations of the Entertainment and Financial Service businesses.”

Intel, Xilinx fund chip design software company Oasys

04/12/2012 

Oasys Design Systems added Intel Capital and Xilinx to its investors in a Series B round. Oasys will use the funds to expand R&D and build a global support structure.

Graphene grown on 300mm wafers with AIXTRON tool in Japan

04/12/2012 

The National Institute of Advanced Industrial Science and Technology in Japan is using its AIXTRON SE BM 300 system to grow monolayer graphene on 300mm wafers.

Top 25 fabless IC companies in 2011

04/12/2012 

The top 25 fabless IC suppliers captured 80% of a total $64.9 billion fabless IC market in 2011, according to IC Insights. Sales topped $1 billion at 12 fabless companies; Qualcomm topped the list with nearly $10 billion in sales. US-based suppliers captured 8 of the top 10 rankings.

Conference Report: MRS Spring 2012, Day 3

04/12/2012 

Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the third day: leakage and TDDB in low- ? dielectrics, flexible energy storage and conversion, Mn capping layers and diffusion barriers, hard masks for Cu interconnects, nanogenerators, Cu in RF, flexible temperature sensors, NEMS and MEMS in HDD, ZnO nanostructures, and various aspects of CMP.

Economy, fabless relationships, 450mm and more on deck at The ConFab 2012

04/12/2012 

The ConFab 2012, an invitation-only global conference and business meeting on semiconductor manufacturing, June 3-6 in Las Vegas, selected speakers and sessions for 2012.

Semiconductor foundries expect double-digit growth through 2015

04/11/2012 

The pure-play semiconductor foundry business will ride the growth of tablets, ultrabooks, and smartphones to $29.6 billion in revenues, according to an IHS iSuppli Semiconductor Manufacturing and Supply Market Tracker report.

Conference report: MRS Spring 2012, Day 2

04/11/2012 

Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the second day: OLED TFT displays, single transistor DRAMs, silicon photonic wires, CNTs, 3D optical interconnects, graphene for RF and sensing, transparent ZnO, epidermal electronic systems, stretchable electronics, ultra-low-k dielectrics, patterning of electroceramics, PRAM (an alternative to NRAM), and inkjet printing of superconducting films.

Attend joint sessions at VLSI Technology and Circuits

04/10/2012 

The 2012 Symposia on VLSI Technology and Circuits, this June in Honolulu, HI, will foster joint interactions among device technologists and circuit/system designers with overlapping technical programs of both symposia, and joint focus sessions on important topics.

SMIC doubles guidance on improved semiconductor wafer fab utilization

04/10/2012 

Semiconductor Manufacturing International Corporation (SMIC, NYSE:SMI, SEHK:981) revised upward its first quarter revenue and gross margin guidance for the three months ended March 31, 2012.

Conference Report: MRS Spring 2012, Day 1

04/10/2012 

Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco, describing recent work with graphene, organic electrochemical transistors, pentacene organic TFTs, and functional inks made of CNTs and other nanomaterials.

TSMC begins Fab 14 expansion for 20nm-node semiconductors

04/09/2012 

TSMC (TWSE: 2330, NYSE:TSM) began Phase 5 of its Fab 14 GigaFab at the South Taiwan Science Park in Tainan, planned to be a “key production center” for advanced 20nm semiconductor chips.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

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