Device Architecture

DEVICE ARCHITECTURE ARTICLES



Optoelectronics, sensors, and discretes saw record year in 2011, beat IC growth

03/28/2012 

Strong demand for MEMS sensors, CMOS image sensors, LEDs, fiber-optic laser transmitters, and power transistors enabled the OSD semiconductors market to grow by 8% in 2011, hitting a new record revenue and beating out the overall IC market, according to IC Insights.

ARM’s Segars sees changing requirements for electronics driven by mobile

03/26/2012 

At the recent Common Platform Technology Forum -- produced by Global Foundries, Samsung and IBM -- Simon Segars, executive vice president and general manager of the physical IP division at ARM, spoke about the impact of the internet of things and mobile computing on the way electronics are designed and used.

Hynix becomes SK group member, focuses on semiconductor leadership beyond memory

03/26/2012 

Hynix officially became a member of SK group, energy and telecommunications conglomerate, changing its name to SK Hynix.

Elpida president, independent attorney to co-lead DRAM maker's bankruptcy

03/23/2012 

Elpida's bankruptcy process moved forward another step, with the Tokyo District Court naming Yukio Sakamoto, Elpida president & CEO and Nobuaki Kobayashi, attorney-at-law as the Trustees for the case.

GLOBALFOUNDRIES signals 32nm yield success with 250k wafers from Fab 1

03/22/2012 

GLOBALFOUNDRIES' Fab 1 in Dresden, Germany has shipped 250,000 semiconductor wafers based on 32nm HKMG technology. AMD commented that it will move ahead with 28nm at GLOBALFOUNDRIES.

Apple A5X processor teardown: Bigger die, higher heat?

03/22/2012 

Apple’s ARM-based processors have created a point of hardware differentiation in applications processors. With the A5X, Apple is going with a much larger die at the 45nm node (shared across the 2 prior generations), shares Chipworks. It's also turned off the PoP track.

Semiconductor inventories coast at record levels into 2012

03/21/2012 

Semiconductor days of inventory rose 3.4%, hitting an 11-year high of 84.1 DOI at chip suppliers in Q4 2011, but this will decline 0.5% in Q1 2012, with hopes that demand is improving, says IHS.

ASIC design starts evolve into 3 SoC types

03/21/2012 

ASIC design starts are evolving under increasing design costs, rising design complexity, and lengthening design cycle times, especially in the SoC market, says Semico Research Corp. New applications are providing an element of stability.

Elpida bankruptcy: Will Micron (MU) take over the DRAM maker?

03/21/2012 

Barclays Capital weighs in on rumors that Micron (MU) offered $1.5 billion to take over Elpida. Should the offer stand, it would be about 20-30 cents on the dollar for Elpida's assets.

Taiwan allows higher Chinese investments in LCDs, semiconductors, fab equipment, more

03/21/2012 

Taiwan raised investment ceilings for Chinese investors in LCDs, semiconductors, IC assembly and test, microelectronics production equipment, and metal tool manufacturing.

NIST offers $2.6M for semiconductor research beyond CMOS

03/20/2012 

NIST is soliciting proposals of long-term research in next-generation semiconductor technology, putting up $2.6 million in federal cost-shared funding for a project’s first year, with the potential for continued funding for up to 5 years.

Japan's aging semiconductor industry revealed by 2011 earthquake

03/20/2012 

One year ago, Japan’s semiconductor industry was rocked by a devastating earthquake and tsunami. However, the real disaster for Japan’s chip industry occurred during the years before the earthquake, says IHS.

Amplifier IC enables purely electronic nanopore measurement

03/19/2012 

Columbia Engineering and University of Pennsylvania researchers developed a way measure nanopores with less error, designing a custom IC using commercial semiconductor technology and building the nanopore measurement around the new amplifier chip.

Semiconductor foundry Dongbu HiTek recruits leadership from Samsung, MagnaChip

03/16/2012 

Dongbu HiTek named Dr. Chang-Sik Choi, former EVP of Samsung Electronics, as its president and CEO and Chan-Hee Lee, former EVP of MagnaChip Semiconductor, as president of its foundry business.

Silicon germanium grown monolithically to avoid crystal defects

03/16/2012 

European researchers have manufactured defect-free structures of different semiconductors on silicon wafers, using semiconductor manufacturing processes.

LED lighting to illuminate power semiconductor sector

03/16/2012 

The global market for power semiconductors used in LED lighting is forecast to reach over $3 billion in 2016. LED lighting systems require complex electronics, IMS Research notes.

3M expands silicon battery-anode manufacturing in US, bolsters research

03/16/2012 

3M is investing in research and manufacturing of novel silicon (Si) based battery anode materials, for mobile electronics and electric vehicles.

Samsung, IBM and GlobalFoundries look to the future: A report from the Common Platform Technology Forum

03/15/2012 

Execs from Samsung, IBM, GlobalFoundries and ARM looked to the future at The Common Technology Platform Forum in Santa Clara. They focused on the innovation pipeline for 20nm and 14nm technology nodes, and the role that EUV, FinFETs, TSVs, CNTs and DSA will play.

Gallium nitride development accelerates at microelectronics companies

03/15/2012 

As products using gallium nitride (GaN) technology continue to gain acceptance in military and commercial applications, development activities at microelectronics companies are accelerating.

Texas Instruments, SMIC sprout new IC research labs in US and China

03/14/2012 

TI opened a CA-based research lab for analog and mixed-signal circuits, tapping into local universities for a portion of the research. SMIC is teaming with Brite Semiconductor and Zhejiang University for an IC research program in China. Both aim to develop a "home-grown" and dynamic semiconductor industry workforce.




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Environment, Safety & Health

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The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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