Device Architecture

DEVICE ARCHITECTURE ARTICLES



How Toshiba's NAND biz survived Japan's Great East Earthquake 1 year ago

03/14/2012 

Japan's NAND flash memory supplier Toshiba rapidly rebounded from the devastating Great East Japan earthquake and tsunami that hit one year ago this week, says IHS, thanks to fortunate fab location, quick wafer supply replenishment, and strong demand.

SiC semiconductor maker SemiSouth expands capacity

03/13/2012 

SemiSouth Laboratories Inc., high-voltage silicon-carbide (SiC) semiconductor device manufacturer, launched its second major capacity expansion within 18 months.

2012 semiconductor spending forecast nearly doubled at Gartner

03/13/2012 

Worldwide semiconductor revenue is projected to total $316 billion in 2012, a 4% increase from 2011, according to Gartner Inc. This outlook is up from Gartner's previous forecast, made in Q4 2011, for 2.2% growth.

ST-Ericsson adopts FDSOI from Soitec

03/12/2012 

ST-Ericsson, wireless and semiconductor company, selected planar fully depleted silicon on insulator (FD-SOI) technology from Soitec for use in future mobile platforms.

Media tablets join top 5 semiconductor end-markets in 2012

03/09/2012 

Media tablets, experiencing "remarkably rapid ascension," will become the 4th largest application for semiconductors by 2014, up from 35th in 2010, according to IHS.

IBM drills optical vias in chip for 1Tbit/sec transmission

03/09/2012 

IBM scientists developed a prototype optical chipset, Holey Optochip, that can transfer 1Tbit per second as a parallel optical transceiver, using optical vias through a standard 90nm CMOS chip.

Semiconductors swayed by US presidential elections

03/08/2012 

Historically, US presidential election years have been very good for the semiconductor market as many elected officials attempt to pass (mostly short-term) legislation to boost the economy, reports IC Insights.

HDD recovers rapidly from Thailand floods and sluggish market

03/08/2012 

The HDD industry is rapidly recovering in 2012 and beyond, after surviving natural disasters and tepid market conditions in 2011, according to a report by TRENDFOCUS.

LED makers could diversify with GaN power electronics production

03/07/2012 

The gallium nitride (GaN) power elec market is currently small, but new entrants are ramping to production, silicon-based electronics suppliers developing GaN, and LED makers diversifying capacity to make power semis.

imec unveils 14nm PDK, 14nm test chip to follow

03/06/2012 

Imec has released an early-version process development kit (PDK) for 14nm logic chips, targeting the introduction of numerous new key technologies, such as FinFET architectures and EUV lithography.

GaN transistors commercially available from HRL

03/05/2012 

HRL Laboratories LLC will now offer products in its GaN high electron mobility transistor (HEMT) technology commercially to customers in select markets, such as high-data-rate wireless links, radars and active sensors.

TSMC establishes 3 COOs under CEO Chang

03/05/2012 

TSMC (NYSE:TSM) named 3 co-chief operating officers at a special meeting of the foundry's Board of Directors. All three executives will report directly to Chairman and CEO Dr. Morris Chang.

Semiconductor demand declines 8.8% to start 2012, but expect positive drivers

03/05/2012 

The SIA reports worldwide semiconductor sales of $23.1 billion in January 2012, an 8.8% decrease year-over-year, but SIA expects positive demand as 2012 progresses.

AMD's new GLOBALFOUNDRIES semiconductor wafer agreement frees up 28nm choices

03/05/2012 

AMD (NYSE:AMD) amended its wafer supply agreement with GLOBALFOUNDRIES. The new agreement most notably gives AMD "flexibility to manufacture 28nm parts elsewhere," reports FBR Capital Markets.

ISSCC from a memory analyst’s view

03/02/2012 

The International Solid State Circuits Conference (ISSCC) brought the best and brightest minds in semiconductors together to share the results of the past year’s research and development efforts. Memory analyst Jim Handy, Objective Analysis, was there to cover some highly interesting presentations.

Elpida begins reorganization in Tokyo court: Analysts weigh in

03/02/2012 

Elpida Memory Inc. (Tokyo: 6665) resolved to file a petition for the commencement of corporate reorganization proceedings, and filed the same with the Tokyo District Court. Akita Elpida Memory Inc. also saw the commencement of corporate reorganization proceedings

HDD rankings: Seagate ousts Western Digital after Thailand floods

02/29/2012 

Seagate recaptured the lead in HDD shipments during Q4 2011, ousting Western Digital thanks to "a fortuitous accident in geography" that kept Seagate's Thailand HDD manufacturing plant out of the floods last year, said IHS.

Infineon adds to semiconductor manufacturing complex in Malaysia

02/29/2012 

M+W Group, a global engineering and construction company, is reporting a major contract from Infineon Technologies for a new 100,000-sq.m. semiconductor plant in Kulim/Malaysia.

IBM sets quantum bit (qubit) error reduction records

02/29/2012 

IBM Research established new records for reducing errors in elementary computations and retaining the integrity of quantum mechanical properties in qubits for quantum computing, using superconducting qubits.

Intel (INTC), Micron (MU) expand NAND flash memory JV

02/29/2012 

Intel Corporation and Micron Technology, Inc., entered into agreements to expand their NAND Flash memory joint venture relationship, wherein Intel will sell its stake in 2 fabs to Micron, IMFS and IMFT.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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