02/28/2012 

HiSilicon and imec have signed a strategic research collaboration to develop innovative RF transceiver architectures for next-generation mobile terminals. OSAT Company is using Agilent EMPro and the Momentum 3-D planar electromagnetic simulator to design and simulate innovative new antennas and circuits.

02/27/2012 

FBR Capital released its Q4 2011 semiconductor industry analysis, surveying chip, distributor, EMS, PC OEM, communications equipment OEM, handset OEM, and industrial firms. Their conclusion? Corrective actions in the supply chain have set up a possible H2 2012 snapback for semiconductors.

02/24/2012 

Tabula is implementing a family of 3PLD products manufactured by Intel using its advanced 22nm manufacturing process featuring 3D tri-gate transistors and co-optimized packaging technology.

02/23/2012 

Simon Segars, ARM, will keynote the Common Platform Technology Forum, along with execs from IBM, Samsung and GLOBALFOUNDRIES, March 14 (Pi Day) in Santa Clara, CA.

02/22/2012 

New information from NIST about how layered switching devices for novel computer memory systems work may now allow these structures to come to market sooner.

02/22/2012 

International Solid-State Circuits Conference (ISSCC) is going on now, gathering semiconductor design and device architecture presentations from research firms like imec to chip companies like IBM. Here are some highlighted presentations.

02/22/2012 

MIT researchers used gases to precisely control nanowires' width and composition as they grow, which could yield complex structures optimally designed for particular applications, like LED substrates or solar panels.

02/21/2012 

Semiconductor vendors had slow Q3 and Q4 revenues, indicating that the anticipated correction to chip inventory levels occurred, Gartner reports. The correction process will be largely completed by Q1 2012, evidenced by rising trends in the lead-time index.

02/21/2012 

A team of researchers at the University of New South Wales, Purdue University and the University of Melbourne have built the smallest transistor ever using a single phosphorous atom.

02/21/2012 

Processors like Qualcomm’s Snapdragon will make an impact on future chip revenues, reports analyst firm In-Stat, an NPD Group company.

02/20/2012 

At International Solid-State Circuits Conference (ISSCC), imec and Holst Centre are presenting 14 papers on low-power design for wireless communication and wireless sensor networks, and organic electronics.

02/17/2012 

The Flash Memory Summit covers the current state of flash memory and its applications via tutorials, panel discussions, keynote speeches, paper sessions, and more. Submit your abstract by March 16.

02/14/2012 

The ConFab's second-day keynote will be "Smart Society, the Sensing Era and Signal Chain" presented by Ali Sebt, CEO of Renesas Electronics America.

02/13/2012 

Yole Developpement released "European Microelectronic Fabs Database & Report 2012," a database and report on the European microelectronics and microsystem manufacturing fabs, pilot lines, and major R&D organizations.

02/13/2012 

Chih-Yuan (C. Y.) Lu, a semiconductor engineer, scientist, and entrepreneur in Taiwan, is being honored by IEEE with the 2012 IEEE Frederik Philips Award.

02/10/2012 

IC Insights forecasts 7% growth for the total IC industry in 2012. 27 of the 33 major IC product categories will experience growth in 2012. 11 will grow faster than 7%. 6 will show double-digit growth.

02/09/2012 

SEMATECH authors discuss semiconductor metrology solutions currently being investigated to address the challenges of future nodes. FinFETs raise new metrology complexities, as the entire 3D structure becomes critical for process control, including fin and gate dimensions, profiles and roughness, and metal gate undercuts.

02/09/2012 

FlexTech Alliance awarded its 2012 FLEXI Awards for flexible, printed electronics and displays industry to PARC and Thin Film Electronics, Western Michigan University, and the Georgia Institute of Technology.

02/08/2012 

The 2011 International Technology Roadmap for Semiconductors (ITRS) has been publicly released. Several areas of advancement are highlighted in the 2011 ITRS: DRAM and Flash memory, and MEMS.

02/08/2012 

Handset products dominate compound semiconductor revenue, but microelectronics companies focus development on high-performance, high-frequency applications where volumes are lower and products are differentiated by performance, reports Strategy Analytics.