Device Architecture

DEVICE ARCHITECTURE ARTICLES



STM: Semiconductor maker, MEMS specialist, venture capitalist?

12/16/2011 

STMicroelectronics (NYSE: STM), a global semiconductor company, launched ST New Ventures, its corporate venture capital fund currently under incorporation.

imec advances CMOS beyond silicon to Ge, III-V

12/14/2011 

Marc Heyns, fellow at research consortium imec, discusses the group's work on chip fab materials beyond silicon, namely, Ge and III-V, presented in "Advancing CMOS beyond the silicon roadmap with germanium and III-V devices" at IEDM.

imec claims RRAM is smallest based on HfO2

12/14/2011 

During IEDM, imec presented the world

IEEE IITC keynotes to come from Intel, NVIDIA

12/13/2011 

Mike Mayberry, VP and director of components research, Intel Corp. and Billy Dally, VP and chief scientist, NVIDIA will keynote the 15th Annual IEEE IITC, June 2012 in San Jose, CA.

GSA awards semiconductor companies

12/13/2011 

The Global Semiconductor Alliance named its 2011 awards recipients at a celebration last week in CA. Outstanding semiconductor companies worldwide were recognized for "success, vision and strategy in the industry." Winners include Broadcom, Intel, and lesser-known companies like Amalfi Semiconductor.

Self-powered electronics: Achievements and challenges @ IEDM

12/12/2011 

Dennis Buss, a visiting scientist at the Massachusetts Institute of Technology (MIT) and consultant at Texas Instruments (TI), presented "Research in self-powered electronic systems (#10.4)" at IEEE's International Electron Devices Meeting (IEDM) recently. He shares key results here.

Printed electronics innovators awarded by IDTechEX

12/09/2011 

Printed electronics materials and equipment suppliers, as well as academics and industry, were honored with annual awards at the IDTechEx Printed Electronics USA 2011 in Santa Clara, CA.

SMIC, Elpida settle 200mm wafer claims

12/09/2011 

SMIC entered into a settlement agreement with Elpida Memory Inc. to settle all pending arbitration claims and counterclaims relating to the parties' Amended and Restated 200mm Wafer Products Business Agreement.

SuVolta's DDC transistor technology @ IEDM

12/08/2011 

SuVolta Inc., developer of scalable low-power CMOS technologies, revealed its Deeply Depleted Channel (DDC) low-power transistor technology at IEEE's IEDM 2011 this week in Washington DC.

IEDM interview: SEMATECH’s SILC ~10% and HKMG lifetime; ALD BeO a viable gate stack IPL solution

12/07/2011  SEMATECH’s director of front end processes, Paul Kirsch, discusses two of the consortium’s papers presented at IEEE's International Electron Devices Meeting (IEDM) with Solid State Technology in a podcast interview

imec's IEDM papers reach "record number"

12/07/2011 

imec is presenting a record number of 17 papers at the IEEE International Electron Device Meeting (IEDM), ending today in Washington, DC.

Cornell, SRC develop RF MEMS technologies

12/07/2011 

Semiconductor Research Corporation (SRC), university-research consortium for semiconductors and related technologies, is working with Cornell University researchers to develop on-chip silicon technologies for mobile devices. The aim is a micro-mechanical resonator for RF MEMS.

WSTS forecast update: Two more tough years

12/06/2011 

The WSTS' newest version of its twice-a-year semiconductor industry outlook shows some softer segments than just six months ago. Hope you enjoyed 2010's 30% blowout, because the next three years will flatline at low- to mid-single-digit growth.

Oct. chip sales flat, annual growth pace now 1%

12/05/2011 

Wall Street watchers still see a mixed bag after tallying October chip sales, with some lingering concerns about inventories, but overall everyone seems to agree with full-year 2011 chip projections of 1%-2%.

IEDM 2011 Preview: Chipworks' must-see picks for IEDM

12/05/2011 

Chipworks' Dick James maps out the entire 2011 2011 IEEE International Electron Devices Meeting, taking a closer look at what he sees as the more interesting papers in various sessions and what he plans to attend in person.

IBM fabs Micron memory cube with TSV tech

12/02/2011 

Using the advanced through-silicon via (TSV) fabrication process at IBM (NYSE:IBM), Micron Technology Inc. (NASDAQ:MU) will begin producing its Hybrid Memory Cube. The companies claim that this is the first CMOS design to go commercial with TSV interconnects.

Intel pushes Samsung back for 2011 semiconductor market leadership: Top 20 chip suppliers

12/02/2011 

Intel Corp.'s semiconductor market dominance has been eroded for several years by Samsung Electronics Co. Ltd., but reversed this trend in 2011. Acquisition played a key role, not just for Intel, but for 5 of the other top-20 semiconductor chip companies, says analyst firm IHS.

Toshiba implementing chip plant closures, rolling shutdowns

11/30/2011 

Sluggish demand in Western markets and a persistently-strong yen are cited as reasons to adjust output and institute shutdowns across the company's Japanese manufacturing footprint.

Partnership forms to commercialize advanced photonic chip innovations

11/29/2011 

The Institute of Microelectronics, a research institute of Singapore's A*STAR, plans to commercialize key innovations in silicon photonic chips designed to support high-speed, high-bandwidth optical communications.

Nvidia's ConFab keynote will portray "the virtual IDM"

11/29/2011 

Dr. John Chen, VP of technology and foundry operations at Nvidia, and Thomas Jefferson, ISMI's 450mm project manager, are among the updated speaking roster of ConFab 2012, which will address the economics of semiconductor manufacturing and associated industries (LEDs, MEMS, displays).




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

More Webcasts