08/06/2018  Q2 sales are highest on record, 6.0 percent more than previous quarter, 20.5 percent higher than Q2 of last year.

08/06/2018  UMC will offer cost effective licensing of embedded 28nm non-volatile MRAM macros to its foundry customers.

08/06/2018  Samsung Electronics Co., Ltd. today announced that it has begun mass producing the industry’s first 4-bit (QLC, quad-level cell) 4-terabyte (TB) SATA solid-state drive (SSD) for consumers.

08/03/2018  A UCF physicist has discovered a new material that has the potential to become a building block in the new era of quantum materials, those that are composed of microscopically condensed matter and expected to change our development of technology.

08/02/2018  The march to greater precision, efficiency and safety – the lifeblood of high-technology manufacturing facilities – has taken on a new urgency as emerging applications such artificial intelligence (AI), the Internet of Things (IoT) and Industry 4.0 give new meaning to smart factories.

08/02/2018  We’re living in a digital world where semiconductors have been taken for granted. But, Artificial Intelligence (AI) is changing everything – and bringing semiconductors back into the deserved spotlight.

08/02/2018  Leti, a research institute at CEA Tech, and CMP, a service organization that provides prototyping and low-volume production of ICs and MEMS, today announced the integrated-circuit industry's first multi-project-wafer (MPW) process for fabricating emerging non-volatile memory OxRAM devices on a 200mm foundry base-wafer platform.

08/01/2018  Hennessy, pioneer in electrical engineering, will accept 2018 Robert N. Noyce Award at SIA Award Dinner on Nov. 29.

08/01/2018  Toshiba Memory Corporation today announced that it consummated the merger with K. K. Pangea which is its parent company on August 1, 2018.

08/01/2018  Silicon-based system offers smaller, cheaper alternative to other 'broadband' filters; could improve a variety of photonic devices.

07/31/2018  Avnet, a global technology company, has been named a global distribution partner for Microsemi Corporation, a wholly owned subsidiary of Microchip Technology, Inc.

07/31/2018  SEMI today announced its support for calls yesterday by nearly 50 members of Congress for the Trump Administration to remove tariffs on U.S. semiconductor products imported from China.

07/31/2018  New packaging provides double-sided cooling for improved heat dissipation.

07/31/2018  Correlation coefficient expected to reach a very high level of 0.95 in the 2018-2022 timeframe.

07/30/2018  Rambus Inc. today announced the appointment of Sanjay Saraf to its board of directors, effective immediately.

07/30/2018  Two months after opposing $34 billion in U.S. trade tariffs on behalf of the U.S. semiconductor manufacturing industry, Jonathan Davis, global vice president of industry advocacy at SEMI, this week spoke out against an additional $16 billion duties on Chinese goods.

07/30/2018  Imec, a research and innovation hub in nanoelectronics and digital technologies, announces that Niels Verellen, one of its young scientists, has been awarded an ERC Starting Grant.

07/27/2018  The increasing use of SOI wafers in advanced devices such as smartphones, tablets, earphones/headphones, and wearables is expected to boost the market for consumer electronics application.

07/27/2018  SiFive, a provider of commercial RISC-V processor IP, today welcomed Chipus Microelectronics, a semiconductor company with proven expertise in the development of ultra-low-power (ULP), low-voltage, analog and mixed-signal integrated circuits, to the growing DesignShare ecosystem.

07/26/2018  PLDA and HPE collaborate on Gen-Z silicon IP to enable a robust ecosystem of Gen-Z component providers to power memory-driven systems and solutions.