Device Architecture

DEVICE ARCHITECTURE ARTICLES



Elpida, Nanya lob patent accusations amid DRAM quagmire

11/28/2011 

With losses and oversupplies mounting, DRAM rivals are taking increasingly drastic steps to stay competitive, including courtroom battles and even more production cutbacks.

NeoPhotonics doubles PIC production capacity

11/23/2011 

Citing rising demand and a potential industry shortage, NeoPhotonics is in the process of more than doubling its production capacity of narrow linewidth tunable lasers with minimal expected additional capital expenditures.

DAC seeks speakers bureau experts

11/23/2011 

The Design Automation Conference (DAC) is soliciting semiconductor industry experts for participation in invited sessions, panels, and other events at the 49th DAC, June 3-7, 2012 in San Francisco, CA.

Amazon Kindle Fire puts Ilitek on the map

11/21/2011 

In an IHS iSuppli Teardown Analysis, IHS found that Amazon is using previously unknown Jorjin and Ilitek for its WLAN module and touchscreen controller IC, respectively, in the new Kindle Fire media tablet. Other teardown findings? TI is all over the new product, and a Kindle Fire costs more than its price.

IHS downgrades semiconductor forecast within positive territory

11/21/2011 

IHS has reduced its global semiconductor market forecast for 2011 to 1.2% growth, a slight revenue increase over 2010 owing to continued growth in the third quarter. This is down from the 2.9% growth IHS forecast when it looked at the numbers in September.

MEMS win, DRAM lose in ultrabook designs

11/18/2011 

Sensors are hot items for ultrabook functionalities, boosting MEMS sales. The thin form factor of ultrabooks will deter DRAM device integration and DRAM use as memory upgrades, according to IHS iSuppli Semiconductor Value Chain.

Intermolecular (IMI) prices IPO

11/18/2011 

Intermolecular Inc. (Nasdaq:IMI) priced its initial public offering of 9,650,000 shares of common stock at a public offering price of $10.00 per share.

Fabless semiconductor start-ups gain Singapore association support

11/17/2011 

Semiconductor start-ups are forming at a slower pace in recent years, and VCs are less willing to invest. In light of this environment, Singapore Semiconductor Industry Association announced 3 initiatives to support emerging fabless semiconductor companies.

Fairchild Semiconductor's 200mm Mountain Top wafer fab rebounds

11/16/2011 

Reversing its 2009 decision to close the 200mm wafer fab, Fairchild Semiconductor (NYSE:FCS) will keep open its Mountain Top, PA, facility. Moutain Top makes high-voltage and automotive semiconductor products.

AKHAN Technologies reports diamond microelectronics breakthrough

11/15/2011 

AKHAN Technologies, advanced diamond electron device design company, is commercializing diamond microelectronics with a shallow n-type diamond material over silicon.

Last one standing: SK Telecom pays $3B for 21% Hynix stake

11/14/2011 

South Korean memory firm Hynix has finally settled on a buyer: SK Telecom, South Korea's biggest wireless telco, will buy a 21% stake for roughly $3B.

GSA nominees for semiconductor industry awards

11/14/2011 

The Global Semiconductor Association announced nominees in several categories for its annual awards. Following are the nominees for start-up to watch, most respected companies, best-managed companies, analysts' favorites, and more.

Emerging semiconductor companies: Financial analysis with GSA

11/11/2011 

The Global Semiconductor Alliance (GSA) shares financial reports on the top three emerging semiconductor industry companies of 2011, as voted by suppliers, customers, peers, and other members of the sector.

Backside-illuminated image sensors: Optimizing manufacturing for a sensitivity payoff

11/11/2011 

Backside-illuminated image sensors require more precise wafer processing -- uniform extreme wafer thinning, dopant control, epitaxy growth, trench manipulation, etc. -- but the payoff in image quality is significant. Researchers at imec experimented with different wafer fab technologies to make a record BSI sensor. They also consider new architectures/packaging techniques for this technology.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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