10/14/2011 

NeoPhotonics Corporation (NYSE:NPTN), photonic integrated circuit (PIC) modules and subsystems maker, completed the acquisition of privately held Santur Corporation, a designer and manufacturer of Indium Phosphide (InP) PIC products.

10/13/2011 

A deep dig inside ASML's 3Q11 results and execs' commentaries unearths insights into 4Q11 and 2012 projections, an updated EUV timeline, and some curious disconnect about the industry's 450mm readiness.

10/11/2011 

Heading to the AVS Symposium later this month (Oct. 30-Nov. 4) in Nashville, TN? We've scanned the program to pick out some of the sessions that are of interest.

10/10/2011 

Imec says it has developed a f_T/f_MAX 245GHz/450GHz SiGe:C heterojunction bipolar transistor (HBT) device, useful for future high-volume millimeter-wave circuits in various applications.

10/10/2011 

Imec says it has built an integrated poly-SiGe-based piezoresistive pressure sensor on top of 0.13?m copper backend CMOS, the first such device directly fabricated above its readout circuit and the first poly-SiGe MEMS device of any kind processed on top of Cu-backend CMOS.

10/06/2011 

Analog semiconductors will buck the trend of contraction in the overall chip industry, growing 13.8% in 2011, 8.6% in 2012, then 12.8% in 2013.

10/06/2011 

The Royal Swedish Academy of Sciences awarded this year's Nobel Prize in Chemistry to Dan Shechtman, Technion - Israel Institute of Technology, Haifa, Israel, for the discovery of quasicrystals.

10/05/2011 

Stanford researchers have combined two known topological insulators to create a new one, fabricated small plates with the new topological insulator, and gated them. The result is an insulator-based transistor.

10/05/2011 

Analog Devices Inc. (ADI) introduced a packaging technology for digital isolators that achieves a minimum of 8mm creepage distance required by global industry standards to ensure safe operation in high-voltage medical and industrial applications.

10/04/2011 

Global sales of semiconductors inched back above the $25B level in August, and analysts pick through the numbers to find a mix of good and bad news -- and reason for yet another forecast downgrade.

09/29/2011 

Ames Laboratory researchers have discovered very different reactions between various materials and graphene. Rare-earth metals, such as dysprosium (Dy) and gadolinium (Gd), react strongly with graphene, while lead (Pb) does not.

09/29/2011 

Samsung Electronics Co. Ltd. developed a monolithic 4Gb low-power double-data-rate 3 (LPDDR3) memory device on 30nm-class wafer processing technology.

09/29/2011 

Samsung Electronics Co. Ltd. developed a high-performance 64GB embedded memory with 64Gb NAND. The package contains an 8 die stack in a low profile for smartphones, tablets and other mobile devices.

09/28/2011 

JEDEC Solid State Technology Association released JESD216: Serial Flash Discoverable Parameters (SFDP) for Serial NOR Flash. The SFDP allows serial Flash manufacturers to embed a description of device characteristics inside the Flash chip.

09/28/2011 

Both graphene and carbon nanotubes (CNT) suit applications from flexible displays to silicon-replacing transistors. In a relatively short time, graphene has emerged as a low-cost, tunable material for all kinds of electronics. Will graphene overtake CNTs as the nanomaterial of future devices?

09/27/2011 

New York State has entered into agreements for $4.4 billion in investments over the next 5 years from Intel, IBM, GlobalFoundries, TSMC, and Samsung to create a 450mm consortium and manufacturing center there.

09/26/2011 

Fabless wireless semiconductor companies are putting out new chips and breakthrough technologies, adding "growth momentum" to the semiconductor industry value chain as a whole, according to CyberMedia Research. TSMC and Amkor benefit the most from the rise of fabless companies.

09/26/2011 

Brookhaven National Laboratory scientists discovered a new kind of quasiparticles in three-layer graphene sheets. These quasiparticles have mass dependent on their velocity and could be channeled into new spintronics devices.

09/26/2011 

Invensas president Simon McElrea explains the company's new wire bond-based multi-die face-down (xFD) packaging technology, demo'd at this year's Intel Developer Forum, and its advantages in terms of performance and manufacturing cost reductions.

09/23/2011 

Adding to the growing chorus of semiconductor industry downgrades, Gartner analysts are raising another red flag: semiconductor inventories are at "worrisome" levels given market conditions and softening end-markets.